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1. 发明专利

JP2009224714A Manufacturing method of organic thin film transistor 有权
标题翻译：有机薄膜晶体管的制造方法
公开(公告)号：JP2009224714A
公开(公告)日：2009-10-01
申请号：JP2008070082
申请日：2008-03-18
申请人： Harima Chem Inc , Sij Technology:Kk , Univ Of Tokyo , ハリマ化成株式会社 , 国立大学法人東京大学 , 株式会社エスアイジェイテクノロジ
发明人： SOMEYA TAKAO , SEKIYA TAKESHI , MURATA KAZUHIRO , MATSUBA YORISHIGE , KOYAMA MASAHIDE
IPC分类号： H01L29/786 , H01L21/336 , H01L51/05 , H01L51/30 , H01L51/40
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an organic thin film transistor, capable of producing a source electrode and a drain electrode configuring an organic thin film transistor by utilizing the dispersion solution of metal nanoparticles in which an organic solvent is a dispersion solvent. SOLUTION: In the process of forming the source electrode and the drain electrode, a metal nanoparticle dispersion solution is applied in a prescribed pattern shape to form a metal nanoparticle dispersion solution application layer using an ultrafine inkjet printer, the metal nanoparticle dispersion solution application layer is heated and sintered, and the source electrode and the drain electrode consisting of a metal nanoparticle sintered body layer are formed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种有机薄膜晶体管的制造方法，其能够通过利用金属纳米颗粒的分散溶液来生产构成有机薄膜晶体管的源电极和漏电极，其中有机溶剂是分散溶剂。解决方案：在形成源电极和漏电极的过程中，以规定的图案形状施加金属纳米颗粒分散液，以使用超细喷墨打印机形成金属纳米颗粒分散液施加层，金属纳米颗粒分散溶液施加层被加热烧结，并且形成由金属纳米颗粒烧结体层组成的源电极和漏电极。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2005109467A Substrate and method of manufacturing the same 有权
标题翻译：基板及其制造方法
公开(公告)号：JP2005109467A
公开(公告)日：2005-04-21
申请号：JP2004264046
申请日：2004-09-10
申请人： Harima Chem Inc , National Institute Of Advanced Industrial & Technology , ハリマ化成株式会社 , 独立行政法人産業技術総合研究所
发明人： MURATA KAZUHIRO , YOKOYAMA HIROSHI , ITO DAISUKE , IZUMITANI AKITO , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H05K3/40 , H01L21/48 , H01L21/60 , H05K3/12 , H05K3/46
CPC分类号： B05D1/007 , B32B3/266 , B32B15/08 , H01L21/4867 , H01L2924/0002 , H05K3/125 , H05K3/245 , H05K3/4061 , H05K3/4647 , H05K2201/0367 , H05K2203/013 , H05K2203/105 , H05K2203/1131 , H05K2203/1476 , Y10T428/24322 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate in which a fine metal column is formed by injecting and depositing metal particles dispersion onto the substrate using a fine ink-jet printing method capable of fine drawing, a manufacturing method thereof, a substrate structured to have a high aspect ratio, and a manufacturing method simply producing the substrate at high speed. SOLUTION: In the substrate manufacturing method, metal particles are deposited on a certain position of a substrate in a column state by using a fine ink-jet method and then sintered, thus a metal column is formed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种基板，其中通过使用能够精细拉制的精细喷墨打印方法将金属颗粒分散体注入并沉积到基板上来形成细金属柱，其制造方法，基板被构造成具有高纵横比，以及简单地高速生产基板的制造方法。解决方案：在基板制造方法中，通过使用细小的喷墨法将金属颗粒在柱状态下沉积在基板的某个位置上，然后烧结，从而形成金属柱。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2007299988A Electric connector, method for forming same, and cartridge 有权
标题翻译：电连接器，形成它们的方法和盒
公开(公告)号：JP2007299988A
公开(公告)日：2007-11-15
申请号：JP2006127721
申请日：2006-05-01
申请人： Sij Technology:Kk , 有限会社エスアイジェイテクノロジ
发明人： MURATA KAZUHIRO
IPC分类号： H05K1/11 , B05D1/26 , H01L21/288 , H01L21/3205 , H01L21/60 , H01L21/768 , H05K3/10 , H05K3/40
CPC分类号： H01L2224/11 , H01L2224/1131 , H01L2224/13 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electric connector in which, when metallic ultrafine particle dispersion liquid is charged into a through-hole formed in a board to wire between the boards, even if a length of a height direction of the through-hole is longer than a micro through-hole diameter of a few μm, the metallic ultrafine particle dispersion liquid can be charged thereinto, thereby preventing a disconnection in the through-hole; and to provide a method for forming the electric connector and a cartridge. SOLUTION: A droplet 24 is sprayed to a substrate 22 and deposited from a nozzle 12 having a diameter of about 5 μm or less, preferably about 1 μm or less in a droplet discharger 10. In a droplet deposit formed by depositing a plurality of the droplets 24, when a solid diameter is Rm1 in a solidity of a growth origin droplet layer 34b on a first droplet 34a, and a maximum diameter is Rm 2 in a droplet 34d in an uppermost layer of the droplet deposit formed by depositing a plurality of droplets after an impact, a ratio of Rm1 to Rm2 is 2:1 to 1:1. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电连接器，其中当金属超微粒子分散液被填充到形成在板中的通孔中以在基板之间进行导线时，即使通孔的高度方向的长度孔比微通孔直径小于几μm，可以将金属超细颗粒分散液加入其中，从而防止通孔中的断开; 并提供一种用于形成电连接器和盒的方法。解决方案：将液滴24喷射到基板22上，并从直径约5μm或更小，优选约1μm或更小的喷嘴12在液滴放出器10中沉积。在通过沉积形成的液滴沉积当第一液滴34a上的生长起始液滴层34b的固体直径为Rm1时，多个液滴24的最大直径为通过沉积形成的液滴沉积物的最上层中的液滴34d中的Rm 2 冲击后的多个液滴，Rm1与Rm2之比为2:1-1:1。版权所有（C）2008，JPO＆INPIT

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