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    • 4. 发明专利
    • JPH05342531A
    • 1993-12-24
    • JP15183592
    • 1992-06-11
    • HITACHI METALS LTD
    • TAKEDA SHIGERUKAWAI TETSUOKASAKOSHI TOSHIYUKIITO CHIKAICHI
    • G11B5/31
    • PURPOSE:To widen the width of magnetic poles by flatly constituting the magnetic circuit of the magnetic head and making the sliding surface of the magnetic head and the film surfaces of magnetic cores parallel to each other. CONSTITUTION:Lower striped conductive films 2b are formed on a substrate 1 and the lower magnetic core 4b is deposited and formed via an insulating layer 3c on the films 2b. Upper striped conductive films 7a are formed via the insulating layer on the core 4a. The lower magnetic core 4a of the thin-film magnetic head having the helical conductive coils formed by connecting the ends of the conductive films 2b, 7a of the lower part and the upper part consists of the two magnetic thin films and these thin films are arranged in a straight shape apart at a specified spacing. The helical coils are respectively wound around the lower magnetic cores 4a, 4b and the upper magnetic core 6 is formed on the ends of the two cores 4a, 4b facing each other. The lower magnetic core 4a and the upper magnetic core 6 are magnetically joined and a head gap 5 is formed in a part of the upper magnetic core 6. The sliding surface of the gap 6 is made parallel with the film surface of the upper magnetic core 6.
    • 5. 发明专利
    • JPH05342529A
    • 1993-12-24
    • JP15183692
    • 1992-06-11
    • HITACHI METALS LTD
    • TAKEDA SHIGERUKAWAI TETSUOKASAKOSHI TOSHIYUKIITO CHIKAICHI
    • G11B5/31
    • PURPOSE:To obtain magnetic field thin-film resistance with decreased leakage magnetic fields and decreased malfunctions by making a sliding surface and a magnetic core film surface parallel to each other and efficiently absorbing the magnetic fields generated by a conductor coil into the magnetic core. CONSTITUTION:Striped conductive films are formed in a prescribed manner on a substrate 1 and are coated with an insulating layer 3a. The U-shaped magnetic core 4 is deposited thereon and the two sides are made parallel to each other. Both ends thereof are exposed on the end face of the substrate 1. The surface is coated with an insulating layer 3b. Through-holes 10a, 10b, 10c are provided by selectively etching away the insulating layer to expose both ends of the core 4 as well. A nonmagnetic spacer 11 is superposed on the part to be formed with a head gap 5. Striped conductive films 7a, 7b are joined to the conductive films to form a helical coil. The core is formed on the core 4 via a spacer 11. The groove of a head gap 3 is formed at the center of the core. The insulating layer 3c is so formed as to expose the gap 5 and the magnetic head is completed.
    • 6. 发明专利
    • ALUMINUM VAPOR-DEPOSITED LEAD FRAME
    • JPH01199459A
    • 1989-08-10
    • JP30436388
    • 1988-12-01
    • HITACHI METALS LTD
    • KAWAI TETSUOSAKAKIBARA MASAHIKOHARA HISAO
    • C23C14/20H01L23/50
    • PURPOSE:To reduce the vulnerability to moisture of an aluminum-vapordeposited lead frame and to render it excellent in withstanding corrosion by a method wherein the aluminum film is so vapor-deposited as to exceed a specified value relative to the plane (111) in crystal orientation. CONSTITUTION:A vapor-deposited aluminum film is so designed in crystal orientation as to exceed 70% relative to the plane (111). The rate of orientation relative to the plane (111) is expected to be 50-60% when a routine technique is employed of aluminum evaporation in vacuum. When the ion plating method or the like is applied for film formation, wherein the abundance of aluminum ions may be effectively controlled, 70% or more orientation may realize relative to the plane (111). In the high-frequency ion-plating method, aluminum ion abundance may be controlled simply by changing the high-frequency power. For example, a 2mum-thick Al film, 85% in orientation relative to the plane (111), may be formed on a 42% Ni-Fe lead frame in a 2X10 Torr Ar atmosphere at a 300W high-frequency power.
    • 9. 发明专利
    • THERMAL DECOMPOSITION TYPE BORON NITRIDE
    • JPS6236009A
    • 1987-02-17
    • JP17119985
    • 1985-08-05
    • HITACHI METALS LTD
    • KAWAI TETSUOSHIDORI KUNIO
    • C01B21/064C23C14/24C23C16/34C30B15/10C30B23/00
    • PURPOSE:To decrease the laminar surface exfoliation which is observed with the conventional thermal decomposition type boron nitride crucible and to extend the life of the crucible by forming the thermal decomposition type boron nitride in such a manner that the X-ray diffraction intensity of the hexagonal boron nitride is made smaller than the X-ray diffraction intensity of the boron nitride having the irregular laminar structure in the crystal structure of the thermal decomposition type boron nitride. CONSTITUTION:This thermal decomposition type boron nitride has the crystal structure consisting of the hexagonal boron nitride and the boron nitride of the irregular laminar structure having the larger inter-plane spacing of the C plane than the hexagonal boron nitride and has the diffraction strength of the hexagonal boron nitride smaller than the diffraction intensity of the boron nitride of the irregular laminar structure in the X-ray diffraction. The laminar surface exfoliation is prevented simply by controlling the lamination state of the C plane in the stage of forming the film of the boron nitride by a thermal decomposition method, for example, CVD method. The lamination state of the C plane is controllable by, for example, CVD conditions and the examination of the lamination state is possible by X-ray diffraction.