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1. 发明专利

JP2003243446A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
公开(公告)号：JP2003243446A
公开(公告)日：2003-08-29
申请号：JP2002043882
申请日：2002-02-20
申请人： HITACHI LTD , MCS KK
发明人： TOJO SHINJI , KANEMITSU NOBUYA , KOYANAGI AKIRA
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To prevent the deviation of alignment between an inner lead and a projected electrode of a semiconductor chip resulting from the fluctuation of the manufacturing a film substrate. SOLUTION: A distance A up to the other end from one end of a line of the output side inner lead 5a of a film substrate, a distance B up to one end of a line of the input side inner lead 5a from one end of a line of the output side inner lead 5a, a distance C up to the other end of a line of the input side inner lead 5a from one end of a line of the output side inner lead 5a, a distance between A and B up to one end of a line of the input side inner lead 5a from the other end of a line of the output side inner lead 5a, a distance between A and C up to the other end of a line of the input side inner lead 5a from the other end of a line of the output side inner lead 5a, and a distance between C and B up to one end from the other end of a line of the input side inner lead 5a are measured. When these sizes A, B, C, A-B, A-C and B-C are within the allowance of the alignment of the inner lead 5a and an Au bump, the film substrate is determined as a good product. COPYRIGHT: (C)2003,JPO

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