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1. 发明专利

JPH10261927A AGC CIRCUIT 失效
公开(公告)号：JPH10261927A
公开(公告)日：1998-09-29
申请号：JP6413797
申请日：1997-03-18
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： ONO KOICHI , MATSUURA TATSUJI , SONODA YASUHIRO , NARA TAKASHI
IPC分类号： H03G3/30
摘要： PROBLEM TO BE SOLVED: To provide an automatic gain control(AGC) circuit composed of high speed and high precision MOSs. SOLUTION: This circuit is composed of a variable gain amplifier whose a gain varies corresponding to a control voltage, an amplitude detector 71 and a charge pump circuit 72. In this case the amplitude detector 71 consists of two sets of preamplifiers 5a, 5b where one of input receives a common analog signal and another input part receives a reference voltage set at a prescribed voltage, two sets of differential pairs MN1-MN4 which output currents of noninverted and inverted outputs from a pair of output parts corresponding to an input difference voltage, loads MP1, MP2 that receive outputs of the differential pairs simultaneously and inverters INV1, INV2, and is provided with a means that connects each other the noninverting and inverting outputs of 2 sets of the differential pairs, extracts a current and flows the current to the loads. A charge pump circuit 72 is composed of a current source charging charges to a capacitor C, a current source discharging the charges, and MOS switches MP21-MP24 and MN21-MN24 controlled by one of control signals provided at both ends of each of the current sources.

2. 发明专利

JPS62165958A SOCKET FOR MEASURING ELECTRIC CHARACTERISTICS OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62165958A
公开(公告)日：1987-07-22
申请号：JP646286
申请日：1986-01-17
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： BABA TERUYOSHI , MIZUE KATSUYA , SONODA YASUHIRO , OURA TAKAYUKI , IRIKURA SHOGO
IPC分类号： G01R31/26 , G01R31/28 , H01L23/32 , H01R33/76
摘要： PURPOSE:To accurately measure the high frequency characteristics and the like of a semiconductor device by so composing that forces are operated to the inserting and perpendicular directions of the device to connect its lead pin to a socket. CONSTITUTION:When the electrode 12B of a chip carrier 12 is placed on the end 10A of the lead pin 10 provided at a socket body 15 and a cover 11 is closed, the pin 10 is engaged with the groove 12A on the side of the carrier 12, the electrode 12B is pressed by the end 10A of the pin to a carrier inserting direction and a perpendicular direction, supported by a supporting portion 12C, and mechanically and electrically effectively bonded. When the lower portion 10D of the pin is linearly minimized in size, the electric capacity, inductance and resistance value of the socket can be reduced to minimize the influence at the time of measuring characteristics.

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