会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明专利
    • PACKAGE STRUCTURE FOR HIGH-FREQUENCY DEVICE
    • JPS63170943A
    • 1988-07-14
    • JP187987
    • 1987-01-09
    • HITACHI ELECTRONICSHITACHI LTD
    • SUMIOKA JUNJITABUCHI TOYOJIHIKITA MITSUTAKA
    • H01L23/04H01L23/02
    • PURPOSE:To sharply enhance the isolation characteristic between an input pin and an output pin by a method wherein the input pin and the output pin are equipped with a conductor or a dielectric which is installed on both sides along their extraction direction and a facing conductor which is installed face to face with a stem part is used. CONSTITUTION:An input pin 4 and an output pin 5 are bent to the direction which is opposite to each other near the extraction part; they are extracted to the outside of a can 7 along the plane of a printed-circuit board 14; a stem part 1 and the pins 4, 5 are kept in the non-contact state; a ring-shaped dielectric 21 is fixed to prevent short-circuiting. The input pin 4 and the output pin 5 along the plane of the printedcircuit board 14 function as internal conductors; the dielectric 21 installed along the same plane as this plane, a conductor 12 as a facing conductor and, furthermore, the stem part 1 function as external conductors; a coaxial path is formed at each pair of pins 4, 5; the extraction direction of these pins is opposite to each other; the coupling amount between the pins 4, 5 is reduced sharply. By this method, the isolation characteristic between the input pin and the output pin is enhanced.