会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • LIQUID CRYSTAL DISPLAY ELEMENT
    • JP2000298262A
    • 2000-10-24
    • JP10540399
    • 1999-04-13
    • HITACHI LTDHITACHI DEVICE ENG
    • IGUCHI TSUDOITAKEMOTO KAYAOMIYAZAWA TOSHIO
    • G09F9/00G02F1/1333
    • PROBLEM TO BE SOLVED: To obtain the liquid crystal display element which has high reliability by improving the shock resistance and moisture resistance. SOLUTION: This element has a liquid crystal panel, constituted by sandwiching a liquid crystal layer (3) in the opposition gap between a common electrode formed on a 1st substrate and a drive electrode formed on a 2nd substrate 2, a package 7 formed of a frame member constituting a cavity part where the liquid crystal panel is stored and held, and a flexible printed board 5, which is connected to the common electrode and drive electrode on one side of the liquid crystal panel and has the other end free and supplies a signal voltage for image display. A light shield frame 11, which is larger than the 1st substrate 1 and 2nd substrate 2, is stuck on the opposite surface from the adhesion surfaces of the 1st substrate 1 and 2nd substrate 2 constituting the liquid crystal panel, the part of the sticking surface of the light shield frame 11 and 1st substrate 1 which projects from the 1st substrate 1 is adhered to the package 7, and the package 7 comes into direct mechanical contact with neither the 1st substrate 1 and 2nd substrate 2.
    • 6. 发明专利
    • LIQUID CRYSTAL DISPLAY DEVICE
    • JPH11352508A
    • 1999-12-24
    • JP15940998
    • 1998-06-08
    • HITACHI LTDHITACHI DEVICE ENG
    • IGUCHI TSUDOINAGATA TETSUYATAKEMOTO KAYAO
    • G02F1/1333G02F1/1345
    • PROBLEM TO BE SOLVED: To prevent the cracking of a light-proof plate, to improve product yield and to enable the use of a package consisting of a carbon filler-contg. polymer as a material. SOLUTION: This liquid crystal display device has a liquid crystal panel 1 which consists of a first substrate 2 formed with common electrodes, a second substrate 3 formed with drive electrodes and disposed to face this first substrate and a liquid crystal layer held between the first substrate and the second substrate, a package 5 which houses and holds this liquid crystal panel, a flexible printed circuit board 4 which is held at the end edges of the first substrate, and the second substrate and has common electrode connecting terminals and drive electrode connecting terminals which are respectively connected directly to the common electrodes and the drive electrodes and a spacer 9 which is used to hold and fix this flexible printed circuit board together with the package. A recessed part 50 for accepting the external shape of the spacer 9 is formed at the package 5. The spacer 9 is dropped into the recessed part 50 and is fixed by adhesion.
    • 8. 发明专利
    • SOLID-STATE IMAGE SENSING DEVICE
    • JPS6439048A
    • 1989-02-09
    • JP19446387
    • 1987-08-05
    • HITACHI LTDHITACHI DEVICE ENG
    • KADOWAKI MASAHIKOIZUMI AKIYANAKANO TOSHIOSUZUKI TOSHIKIIGUCHI TSUDOI
    • H01L23/02H01L23/12H01L27/14H04N5/335H04N5/372
    • PURPOSE:To implement the compact configuration of a device and improvement in productivity, by sealing a solid-state image sensing element chip on the mounting surface of a mounting board with a transparent sealing cap, providing a plurality of inner electrodes, which are connected to the terminals of the solid-state image sensing chip, and providing outer electrodes, which are electrically connected to the inner electrodes, on the surface facing the mounting surface of the board. CONSTITUTION:A solid-state image sensing element chip 2, which is mounted on the mounting surface of a mounting board 1, is sealed with a transparent sealing cap 3, and a packaged member is constituted. The mounting board 1 is composed of a substrate 1A, inner electrodes 1B and 1C, lead-out wirings 1D, connecting holes 1E, connecting hole wirings 1F, a coating material 1G and outer electrodes 1H. A plurality of the inner electrodes 1B are arranged on the mounting surface side of the mounting board 1 and electrically connected to the outer terminals of the solid-state image sensing element chip 2 through bonding wires 4. The inner electrode 1C is constituted at the approximately central part of the mounting surface, and the solid-state image sensing element chip 2 is bonded. The inner electrodes 1B and 1C are led out to the peripheral part with the lead-out wirings 1D and electrically connected to the outer electrodes 1H through connecting hole wirings 1F, which are formed in the connecting holes 1E. Thus, the device can be made compact, and the productivity can be improved.