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1. 发明专利

JPS6215254A OPTICAL DISK RECORDING MEDIUM 失效
公开(公告)号：JPS6215254A
公开(公告)日：1987-01-23
申请号：JP15405285
申请日：1985-07-15
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD , HITACHI MAXELL
发明人： SUDO RYOICHI , TAJIMA TETSUO , TSUCHIDA SATORU , ISHIBASHI TAKEHIKO
IPC分类号： G11B7/24 , C08G59/00 , C08L63/00 , G02B1/04 , G11B7/253
摘要： PURPOSE:To provide the titled medium composed of a transparent substrate plate having low optical resin and excellent heat-resistance, mechanical strength and transparency and produced by the thermal forming of a composition containing an epoxy resin, a hardener and a specific organic phosphorus compound and a recording film formed on the surface of the transparent substrate plate. CONSTITUTION:A transparent substrate plate is produced by adding (A) 1-10pts. wt. of an organic phosphorus compound of formula I, formula II or formula III (X is halogen, allyloxy or alkyloxy; R1-R8 are H, halogen, 1-10C univalent aliphatic or aromatic substituent group) to 100pts.wt. of a composition composed of (B) an epoxy resin which is liquid at normal temperature (e.g. bisphenol A diglycidyl ether), (C) a hardener such as amine, polybasic carboxylic acid anhydride, etc., and if necessary (D) a cure-accelerator, and casting and thermally hardening the mixture. The objective optical disk recording material can be produced by forming a recording film on the transparent substrate plate.

2. 发明专利

JPS62220901A PHOTODIFFRACTION DEVICE 失效
公开(公告)号：JPS62220901A
公开(公告)日：1987-09-29
申请号：JP6422286
申请日：1986-03-24
申请人： HITACHI LTD , HITACHI CHEMICAL CO LTD
发明人： ARIMA HIDEO , YOKONO ATARU , NORO TAKANOBU , NOTO KOICHI , SUDO RYOICHI , OKUDAIRA HIROAKI , ISHIBASHI TAKEHIKO , TSUCHIDA SATORU
IPC分类号： G02B5/18
摘要： PURPOSE:To improve transmittancy, homogeneity and moldability of a material, and to improve diffraction efficiency by forming the diffraction grating, using an epoxy resin composition contg. a specific org. phosphorous compd. CONSTITUTION:The composition comprising the epoxy resin, a curing agent, a hardening accelerator and at least one kinds of the org. phosphorous compds. shown by formulas I, II and III, is used for the grating. In the formula, X is halogen, an aryloxy or an alkyloxy group, R1-R8 are each hydrogen, halogen or 1-10C monovalent aliphatic or an aromatic group, and R1-R8 may be the same or the different each other. As the resin composition contg. org. phos phorous compd. can be effected a cast molding, the resin composition has the good moldability, and is easy to form the diffraction grating. As the resin compo sition has a high dimensional accuracy, a high diffraction efficiency is obtd, and as the production of the diffraction grating is simplified by using the pre scribed composition, the production steps thereof are remarkably reduced.

3. 发明专利

JPS61190520A EPOXY RESIN COMPOSITION 失效
公开(公告)号：JPS61190520A
公开(公告)日：1986-08-25
申请号：JP3089485
申请日：1985-02-19
申请人： HITACHI CHEMICAL CO LTD , HITACHI LTD
发明人： TSUCHIDA SATORU , YOKONO HARUKI , ISHIBASHI TAKEHIKO , SUDO RYOICHI
IPC分类号： C08G59/00 , C08G59/18 , C08L63/00
摘要： PURPOSE:An epoxy resin composition suitable as optical lens, pyrism, disc base for sealing light emitting diode, providing a cured material having improved colorless transparency, keeping initial colorless transparency even if it is allowed to stand at high temperature for a long time, obtained by blending an epoxy resin with an organic acid cobalt salt. CONSTITUTION:(A) An epoxy resin (e.g., obtained from bisphenol A and epi chlorohydrin, etc.) is blended with (B) preferably 0.1-5wt% organic acid cobalt salt (e.g., cobalt octylate, etc.), to give the aimed composition.

4. 发明专利

JP2015054951A エポキシ樹脂組成物、電子部品装置及び電子部品装置の製造方法有权
标题翻译：环氧树脂组合物，电子部件装置和电子部件装置的制造方法
公开(公告)号：JP2015054951A
公开(公告)日：2015-03-23
申请号：JP2013190589
申请日：2013-09-13
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： MASUDA TOMOYA , KONDO HIROKO , TENDO KAZUYOSHI , TSUCHIDA SATORU
IPC分类号： C08G59/18 , C08K3/00 , C08K5/5465 , C08L63/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00
摘要：【課題】電子部品装置の封止材料として使用した場合に電気接続の信頼性に優れボイドの減少するエポキシ樹脂組成物並びに電気接続の信頼性に優れボイドの少ない電子部品装置及び電気接続の信頼性に優れボイドの少ない電子部品装置の製造方法の提供。【解決手段】エポキシ樹脂と、硬化剤と、イソフタル酸化合物及びイミダゾール化合物を含む硬化促進剤と、平均粒子径が1nm〜45nmの第一の無機粒子と、平均粒子径が0.1μm〜10μmの第二の無機粒子と、を含有する、エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた電子部品装置及びその製造方法。【選択図】なし
摘要翻译：要解决的问题：提供当用作电子部件装置的密封材料时具有优异的电连接可靠性和减小的空隙的环氧树脂组合物; 电连接的可靠性低，空隙小的电子零件装置; 以及具有优异的电连接可靠性和较小空隙的电子部件装置的制造方法。解决方案：环氧树脂组合物包含环氧树脂，固化剂，包含间苯二甲酸化合物和咪唑化合物的固化促进剂，第一无机平均粒径为1nm〜45nm的粒子和平均粒径为0.1μm〜10μm的第二无机粒子。提供了使用该环氧树脂组合物的电子部件装置及其制造方法。

5. 发明专利

JP2014237837A 電子部品用樹脂組成物及び電子部品装置审中-公开
标题翻译：电子部件和电子部件装置的树脂组合物
公开(公告)号：JP2014237837A
公开(公告)日：2014-12-18
申请号：JP2014153346
申请日：2014-07-28
申请人：日立化成株式会社 , Hitachi Chemical Co Ltd
发明人： NAKAMURA SHINYA , DEGUCHI OUSHI , TSUCHIDA SATORU , TENDO KAZUYOSHI
IPC分类号： C08G59/56 , C08K3/00 , C08L63/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L24/29 , C08G59/50 , C08G59/68 , C08K3/013 , C08L63/00 , H01L23/293 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2924/00011 , H01L2924/00013 , H01L2924/01006 , H01L2924/01029 , H01L2924/0665 , H01L2924/12044 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要：【課題】ポットライフが長く、ゲルタイムが速く硬化温度の低温化が可能な電子部品用樹脂組成物及び電子部品装置の提供。【解決手段】エポキシ樹脂と、芳香族アミン化合物と、硬化促進剤として、一つ以上のフェノール性水酸基を有する化合物に、ビニルエーテル基を有する化合物としてビニルエーテル基を2つ有するジビニルエーテル化合物及びビニルエーテル基を1つ有するビニルアルキルエーテル化合物からなる群より選ばれる少なくとも1種を付加反応させた化合物を用いる組成物。【選択図】なし
摘要翻译：要解决的问题：提供一种具有长使用期和快速凝胶时间并且可降低固化温度的电子部件用树脂组合物和电子部件装置。溶液：组合物使用环氧树脂，芳香族胺化合物，作为固化促进剂，可以将具有乙烯基醚基的具有两个乙烯基醚基的二乙烯基醚化合物和具有一个乙烯基醚基的乙烯基烷基醚化合物的二乙烯基醚化合物中的至少一种与具有一个乙烯基醚基的乙烯基烷基醚化合物一起加成反应的化合物作为固化促进剂，具有一个或多个酚羟基的化合物。

6. 发明专利

JP2013001811A Resin composition for electronic component and electronic component device 有权
标题翻译：电子元件和电子元器件的树脂组合物
公开(公告)号：JP2013001811A
公开(公告)日：2013-01-07
申请号：JP2011134536
申请日：2011-06-16
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： NAKAMURA SHINYA , DEGUCHI OUSHI , TSUCHIDA SATORU , TENDO KAZUYOSHI
IPC分类号： C08L63/00 , C08G59/50 , C08K5/103 , C08K5/18 , H01L21/60 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for electronic components, which has excellent fluidity in a narrow gap, the gel time of which is quickened to be cured at low temperature, and which allows the thermal stress imposed on a chip to be reduced and void generation to be suppressed when molded.SOLUTION: The resin composition for electronic components contains an epoxy resin, an aromatic amine compound and at least one compound which is used as a curing promotor and selected from the group comprising the compounds represented by general formula (I) (wherein Lis an m-valent group comprising a carbon atom, a hydrogen atom and an oxygen atom or an m-valent hydrocarbon group; Rto Rare each a hydrogen atom or a monovalent hydrocarbon group independently; Ris a monovalent group comprising a carbon atom, a hydrogen atom and an oxygen atom, a monovalent group comprising a carbon atom, a hydrogen atom and a nitrogen atom, or a monovalent hydrocarbon group; m is an integer of 2-6).
摘要翻译：要解决的问题：为了提供一种电子部件用树脂组合物，其在窄间隙中具有优异的流动性，其凝胶时间被加快以在低温下固化，并且允许施加在芯片上的热应力在成型时被抑制的减少和产生空穴。解决方案：电子部件用树脂组合物含有环氧树脂，芳香族胺化合物和至少一种作为固化促进剂使用的化合物，选自通式（I）表示的化合物（其中L 另外，作为m价的基团，可以举出碳原子，氢原子，氧原子或m价烃基的m价基团， / SP>至R 3 分别为氢原子或一价烃基; R 4 为包含碳原子，氢原子和氧原子，包含碳原子，氢原子和氮原子的一价基团或一价烃基; m为2-6的整数）。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2002076203A WAFER-LEVEL CHIP SIZE PACKAGE AND FORMATION MATERIAL FOR SEALING FOR THE SAME 失效
公开(公告)号：JP2002076203A
公开(公告)日：2002-03-15
申请号：JP2000264364
申请日：2000-08-31
申请人： HITACHI CHEMICAL CO LTD
发明人： KOSAKA MASAHIKO , TSUCHIDA SATORU , OGATA MASAJI
IPC分类号： C08K3/00 , C08G59/42 , C08G59/50 , C08G59/62 , C08K5/00 , C08L63/00 , C08L71/02 , H01L23/14 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a formation material for sealing a wafer-level chip size package that can obtain a package, having small amount for warpage and reliable solder-resistant reflow, heat-resistant shock, and humidity-resistant properties or the like, even if the formation material is applied to the water- level chip size package, and the wafer-level chip size package that is sealed by the sealing formation material. SOLUTION: In this formation material for sealing for the water-level chip size package, the elastic modulus of a molding is set equal to 1,000 MPa or lower at 25 deg.C, and at the same time, the average thermal coefficient of expansion is 150×10-6/ deg.C or lower at -55 to 150 deg.C. The wafer level chip size package is sealed by the formation material for sealing.

8. 发明专利

JP2001031841A EPOXY RESIN COMPOSITION FOR SEALING ELECTRONIC PART 失效
公开(公告)号：JP2001031841A
公开(公告)日：2001-02-06
申请号：JP20553999
申请日：1999-07-21
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUCHIDA SATORU , KOSAKA MASAHIKO
IPC分类号： C08L63/00 , C08K3/36 , C08K5/5435 , C08K5/544 , C08K5/548 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain the subject composition excellent in adhesion with organic matters such as resist inks and various organic passivation films by including an epoxy resin, curing agent, silica powder filler and specific coupling agent. SOLUTION: This composition is obtained by including (A) an epoxy resin with >=2 epoxy groups in one molecule, (B) a curing agent where the molar ratio of the functional group in the component B to the epoxy group in the component A is 0.5-1.5, preferably 0.8-1.2, (C) 30-90 wt.% of a silica powder filler composed mainly of a spherical silica with a mean diameter of preferably

9. 发明专利

JPH09176282A PHOTOSEMICONDUCTOR-SEALING EPOXY RESIN COMPOSITION AND PHOTOSEMICONDUCTOR DEVICE PRODUCED USING THE COMPOSITION 失效
公开(公告)号：JPH09176282A
公开(公告)日：1997-07-08
申请号：JP34009295
申请日：1995-12-27
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUCHIDA SATORU , KOSAKA MASAHIKO , NAKAMURA YASUAKI , HIROKAWA KOZO
IPC分类号： C08L63/00 , C08G59/18 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a photosemiconductor-sealing epoxy resin compsn. excellent in heat resistance and moldability without detriment to transparency by using a specific epoxy resin in combination with other epoxy resin. SOLUTION: In a photosemiconductor-sealing epoxy resin compsn. comprising epoxy resins, a curing agent and a curing accelerator, the epoxy resins contain 5-50wt.% (based on the whole epoxy resins) o-cresol novolak epoxy resin of at least 90 deg.C in softening point. The epoxy resins mainly comprise a bisphenol A epoxy resin and the o-cresol novolak epoxy resin. An acid anhydride is pref. used as the curing agent, suitable examples of which include phthalic anhydride, tetrahydrophthalic anhydride, and succinic anhydride. The amt. of the acid anhydride that may be blended is usually 0.7 to 1.2 equivalents based on the epoxy resins.

10. 发明专利

JPH06279568A EPOXY RESIN COMPOSITION AND PHOTOSEMICONDUCTOR DEVICE USED THE SAME 失效
公开(公告)号：JPH06279568A
公开(公告)日：1994-10-04
申请号：JP6982093
申请日：1993-03-29
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUCHIDA SATORU , KOSAKA MASAHIKO , HIROKAWA KOZO
IPC分类号： C08G59/14 , C08G59/42 , C08L63/00 , H01L23/29 , H01L23/31 , H01L33/56 , H01L33/00
摘要： PURPOSE:To obtain a composition which is excellent in heat resistance, moisture resistance, and light transmittance, has been reduced in stress, and is useful as a sealing material for a photosemiconductor element by mixing an epoxy resin with an acid anhydride hardener, a curing accelerator, and a specific copolymer. CONSTITUTION:The composition comprises the following ingredients (A)-(D) as essential ingre diento. (A) An epoxy resin, (B) an acid anhydride hardener, (C) a curing accelerator, and (D) a copolymer of an epoxidized polybutadiene and an organopolysiloxane having per molecule at least one functional group reactive with a glycidyl group and having a mol.wt. of 500-5,000. An especially preferred example of the polymer is represented by the formula, wherein X is amino, glycidyl, etc,; R1 and R2 is a 1-2C alkyl respectively; R3 and R4 is a 1-2C alkyl or phenyl respectively; R' is a hydrocarbon residue; and m and n is an integer respectively, it means m+n=3-40.

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