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1. 发明专利

JP2009218071A Fuel cartridge, connection structure with fuel cell, and fuel supply method to fuel cell 有权
标题翻译：燃油箱，燃料电池连接结构和燃料电池供应方法
公开(公告)号：JP2009218071A
公开(公告)日：2009-09-24
申请号：JP2008060034
申请日：2008-03-10
申请人： Hitachi Ltd , Tokai Corp , 株式会社日立製作所 , 株式会社東海
发明人： MIITSU TAKESHI , KATAYAMA KAORU , KAWAZOE KATSURO , USUI HIDETO
IPC分类号： H01M8/04 , B65D83/00
CPC分类号： Y02E60/50
摘要： PROBLEM TO BE SOLVED: To provide a fuel cartridge which can dispense with a special structure for pressurizing the inside of a vessel and can reduce a cost of the fuel cartridge.
SOLUTION: The fuel cartridge 1 for supplying a fuel to a fuel cell is provided with a vessel 2 for storing a fuel, a connection portion 31 to be connected with the fuel cell, a first valve 4 which, when the connection portion is connected with the fuel cell, can open a passage for fuel supply and supplies the fuel, and a second valve 5 which, when the connection portion is connected with the fuel cell, can open a passage for supplying air to the inside of the vessel. Furthermore, there is provided a third valve 6 for adjusting the air to be supplied to the inside of the vessel when the second valve is opened.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以省略用于对容器内部加压的特殊结构的燃料盒，并且可以降低燃料盒的成本。解决方案：用于向燃料电池供应燃料的燃料盒1设置有用于存储燃料的容器2，与燃料电池连接的连接部分31，第一阀4，当连接部分与燃料电池连接，可以打开用于燃料供应的通道并供应燃料;第二阀5，当连接部分与燃料电池连接时，可以打开用于向容器内部供应空气的通道。此外，设置有第三阀6，用于当第二阀打开时调节供应到容器内部的空气。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005175475A Method of sealing up module 审中-公开
标题翻译：密封模块的方法
公开(公告)号：JP2005175475A
公开(公告)日：2005-06-30
申请号：JP2004352156
申请日：2004-12-06
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ARAI NATSUO , KATAYAMA KAORU , KIRYU EIICHI
IPC分类号： H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of installing a cooling part having improved cooling performance in a cooling structure also in which an LSI and the cooling part are bonded together with solder material etc. SOLUTION: A cooling jacket 100 is bonded with solders 110, 112 to LSI 106 mounted on a multi-layer wiring substrate 104. When bonding with solder, the LSI 106 and cooling jacket 100 are bonded together in a pressurized ambient gas, and then re-exposed to the air. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在冷却结构中安装具有改善的冷却性能的冷却部件的方法，其中LSI和冷却部分用焊料材料等粘结在一起。解决方案：冷却套管 100与焊料110,112连接到安装在多层布线基板104上的LSI 106.当与焊料接合时，LSI 106和冷却套100在加压环境气体中接合在一起，然后再暴露于空气。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2001267485A MULTI-CHIP MODULE 失效
公开(公告)号：JP2001267485A
公开(公告)日：2001-09-28
申请号：JP2000076855
申请日：2000-03-17
申请人： HITACHI LTD
发明人： NISHIKAWA TORU , KATAYAMA KAORU , MIITSU TAKESHI , YAMASHITA SHIRO
IPC分类号： H01L23/473 , H01L25/04 , H01L25/18
摘要： PROBLEM TO BE SOLVED: To suppress a contact thermal resistance in a heat-transfer path between a cooling body and a circuit element while a reliability at a solder joint is kept, related to a multi-chip module where such cooling method as a solder tight-fitting heat transfer method is employed. SOLUTION: A cap type cooling part 30 is capped over an element mounting surface 10a of a wiring board 10 from a rear surface side of a plurality of semiconductor integrated circuit elements 20. On a,joint surface 34 of the cooling part 30, a groove 36 is formed which runs between adjoining semiconductor integrated circuit elements 20 in the element mounting surface 10a of the wiring board 10. On the bottom of each groove 36, a partition wall 37 is formed which partitions the inside part of the groove of the elements 20 on both sides of the groove into one side and the other side. A metallize 38 is formed on wall surface in the groove which contacts the formation surface of a metallize 35 facing metallize 22 of each semiconductor integrated circuit element 20. The metallize 38 on the inside wall of the groove is separated from the metallize 35 by a groove edge at the outside of the groove.

4. 发明专利

JP2001259878A LASER BEAM MACHINING DEVICE 失效
公开(公告)号：JP2001259878A
公开(公告)日：2001-09-25
申请号：JP2000072098
申请日：2000-03-15
申请人： HITACHI LTD
发明人： ARAI TAKESHI , KATAYAMA KAORU , SHIBUYA TSUTOMU , HONGO MIKIO
IPC分类号： B23K26/10 , B23K101/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a laser beam machining device which realizes a uniform hole diameters and uniform hole shapes, and suppresses the clogging of chips in a drilling of an electronic circuit board by a laser beam. SOLUTION: Supporting pins 32 for supporting works mounted on grooves 31 formed on a work tray 12b which supports the electronic circuit boards 27 are able to be arbitrarily arranged in accordance with machining data, and the uniform machined hole diameters and uniform hole shapes are available uninfluenced by the work tray and clogging by machined chips are suppressed by arranging the supporting pins 32 for supporting work in a region where no holes to be machined or formed exist or a region where a precise machining is not required.

5. 发明专利

JP2000332406A APPARATUS FOR REMOVING ELECTRONIC COMPONENT 失效
公开(公告)号：JP2000332406A
公开(公告)日：2000-11-30
申请号：JP13862499
申请日：1999-05-19
申请人： HITACHI LTD
发明人： INOUE SHINJI , KATAYAMA KAORU , WATANABE NAOKI , SHIRAI MITSUGI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain an apparatus for removing electronic components from a board, wherein the consumption of an inert gas for forming a low-oxygen atmosphere is reduced. SOLUTION: An N-purging box 100 has shutters 120, 122 for making a low- oxygen concn. atmosphere in the interior. In the interior thereof, a heat block 110 is housed for heating a board 10 to which electronic components 20 have been soldered. An electronic component removing mechanism 300 is inserted in the interior from the outside of the N-purging box 100 and removes the electronic components 20 and the board 10, after melting solder for securing the electronic components 20 to the board 10.

6. 发明专利

JP2000031360A MULTI-CHIP MODULE 失效
公开(公告)号：JP2000031360A
公开(公告)日：2000-01-28
申请号：JP19265498
申请日：1998-07-08
申请人： HITACHI LTD
发明人： NISHIKAWA TORU , HARADA MASAHIDE , KATAYAMA KAORU , MIITSU TAKESHI , UDA TAKAYUKI , OGURO TAKAHIRO
IPC分类号： C04B41/88 , H01L23/36 , H01L23/433 , H01L23/40
摘要： PROBLEM TO BE SOLVED: To absorb excessive solder at a fitting part, by allowing a metalized part formed on a cooing member for solder-fitting to be larger than a rear- surface metalized part for solder-fitting of a semiconductor integrated circuit element. SOLUTION: A metalized part 4 is formed on the rear surface for electrical connection of a semiconductor integrated circuit element 3, and is connected to a metalized part 5 on a cooling structure body 6 with solder 8. The metalize 4 formed on the cooling structure body 6 prevents the solder 8 from flowing into an unnecessary region. So, when the solder is supplied by a specified amount in accordance with a part where the thickness of the solder 8 is maximum, excessive solder is discharged outside as excessive solder at a part of less thickness. To accommodate a difference in a normal (required) solder amount due to dispersion, the shape of the metalized part 5 formed on the cooling structure body 6 is made larger than the rear-surface metalized part 4 of the semiconductor integrated circuit element while fitted with their centers deviated.

7. 发明专利

JPH1154885A MANUFACTURE OF CERAMIC SUBSTRATE AND ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JPH1154885A
公开(公告)日：1999-02-26
申请号：JP20942597
申请日：1997-08-04
申请人： HITACHI LTD
发明人： MIYAUCHI TAKEOKI , HONGO MIKIO , MIZUKOSHI KATSURO , MATSUMOTO TAKASHI , SHIBUYA TSUTOMU , KATAYAMA KAORU , WAI SHINICHI , SAKAMOTO TATSUJI , SASAKI HIDEAKI
IPC分类号： B23K26/382 , B23K26/00 , B23K26/38 , B23K26/40 , H01L23/12 , H01S3/00 , H01S3/11 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve the filling characteristics of a conductor for opening a hole and to allow dried manufacture by opening a hole through irrading with a laser beam to raw ceramics, and dividing after sintering through defocused state laser light irradiation. SOLUTION: Multiple holes 3 are opened with laser beam 21 on a green ceramics substrate 1, and a conductor 4 is embedded for electrical connection in vertical direction. Then, an interconnection material 5 mounted on the surface is formed by printing on the green ceramics substrate 1. The green ceramics substrates 1 thus produced are piled up in several or tens of sheets for pressurizing, thus forming a laminate 6. After a groove 22 has been formed along a divided line on the laminate 6, it is sintered in a furnace to form a sintered ceramics 7. A condensing laser light 23 whole beam diameter is enlarged is poured along the division line of the sintered ceramics 7, so that cutting under heating stress is performed along the groove 22.

8. 发明专利

JPH09246324A METHOD FOR FORMING ELECTRONIC COMPONENT AND BUMP THEREOF 失效
公开(公告)号：JPH09246324A
公开(公告)日：1997-09-19
申请号：JP5131596
申请日：1996-03-08
申请人： HITACHI LTD
发明人： MURASE TOMOHIKO , SUZUKI TAKAMICHI , GOTO TOSHIYUKI , WAI SHINICHI , KATAYAMA KAORU , TAKAOKA ISAMU , INOUE KOSUKE , ODAJIMA HITOSHI
IPC分类号： H01L21/60 , H05K3/34 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To prevent the unconnection at the time of connecting to a circuit board, to improve the reliability of connecting and the yield of a product and to enhance the degree of freedom in designing an electronic component by controlling the bump flattened part position so as to become higher than the bump top position when the bump is heated and sphered. SOLUTION: A bump flat part 4 is provided at the site of the bump 3 on the terminal electrode 2 of an electronic component 1 at the circuit board connecting side, and the flat part is formed in the same flat surface. Particularly, the bump 3 (20) of the case that the bump forming surface of the component 1 is directed upward is the same as or higher than the bump flat part position 22 mostly protruding from the component 1. That is, when the bump forming surface is formed in the normal state, the position 22 is controlled to be higher than the bump top position 21 of the sphered bump 20 heated and sphered. Thus, unconnection at the time of connecting to the board is prevented to make it possible to enhance the degree of freedoms in designing the component.

9. 发明专利

JP2566296B2 失效
公开(公告)号：JP2566296B2
公开(公告)日：1996-12-25
申请号：JP23217788
申请日：1988-09-19
申请人： HITACHI LTD
发明人： KATAYAMA KAORU , SASAKI HIDEAKI , KOBAYASHI MAMORU
IPC分类号： B23K26/06 , B23K26/00 , B23K26/073 , B23K26/352

10. 发明专利

JPH07226577A CONNECTING TAPE AND CONNECTING METHOD OF FINE CONNECTION PART 失效
公开(公告)号：JPH07226577A
公开(公告)日：1995-08-22
申请号：JP1733694
申请日：1994-02-14
申请人： HITACHI LTD
发明人： SAKAMOTO HARUHISA , MARUYAMA SHIGENOBU , HONGO MIKIO , MIYAUCHI TAKEOKI , KATAYAMA KAORU
IPC分类号： H05K3/40 , H05K3/22
摘要： PURPOSE:To provide a connecting tape and a connection method which enable easy and accurate handling and positioning of a connecting metallic piece of a fine connection part in an electronic circuit board to position to be connected and enable connection of connection terminals of a fine connection part by using a usual bonding device. CONSTITUTION:In a circuit, a connecting metallic piece 3 ranging between single terminals which require connection is installed together with a connecting tape of a fine connection part formed in a surface of a tape-like light transmitting film 4 with the connecting tape positioned between terminals through a handling mechanism. The installed connecting tape is pressurized and heated through a bonding chip 5 from above a film constituting the connecting tape, the connecting metallic piece 3 and connection terminals 2a, 2b are bonded and a film is peeled from the connecting metallic piece 3 after bonding. Connection is performed in this way.

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