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    • 2. 发明专利
    • PRODUCTION OF FOAM
    • JPH09143509A
    • 1997-06-03
    • JP29833695
    • 1995-11-16
    • HITACHI CHEMICAL CO LTD
    • YAMADA MITSUOAIZAWA TERUKIUCHIDA TATSUYA
    • B22F5/00B22F3/11
    • PROBLEM TO BE SOLVED: To provide a producing method of a foam by which the foam of a metal or a metallic compound having uniform foam cells can be produced with a very simple process without necessitating any complicated process such as a plating process and a metallic powder attaching process. SOLUTION: A resin composition consisting of a heat resistant resin of granular or fibrous shape containing dihydrobenzooxazine rings, a granular foaming agent and a metal or a metallic compound is processed to a molded body and, then, the molded body is heated to cause ring-opening polymerization of the dihydrobenzooxazine rings of the heat resistant resin and decomposition of the foaming agent to obtain a molded foam. The molded foam is heated in the atmosphere to fire the resin part and a complex foam is obtained. The complex foam is sintered in a reductive atmosphere to obtain a foam of the metal or the metallic compound. The resin composition in which the size of the heat resistant resin containing the dihydrobenzooxazine rings is half to ten times of the foaming agent is used.
    • 3. 发明专利
    • PRODUCTION OF FOAM FOR CMP PAD
    • JPH09132661A
    • 1997-05-20
    • JP28944295
    • 1995-11-08
    • HITACHI CHEMICAL CO LTD
    • YAMADA MITSUOOIKAWA SHUNJIMIKAMI YOSHIKATSU
    • C08J9/06
    • PROBLEM TO BE SOLVED: To obtain a foam used for a CMP pad and having excellent water resistance and consequent durability by forming a mixture comprising a crosslinking agent, a heat-decomposable blowing agent and a polyolefin resin containing an abrasive into a sheet and crosslinking and foaming this sheet. SOLUTION: A crosslinking agent, a crosslinking aid (A), a heatdecomposable blowing agent (B), an abrasive (C) and a polyolefin resin (D) are melt-kneaded at the decomposition temperature of component B or below, and the resultant mixture is formed into a sheet, This sheet is crosslinked and foamed to form a foam for a CMP(chemical-mechanical polishing) pad. Examples of component D include polypropylene and polyethylene, An example of component A is tbutylcumyl peroxide. An example of component B is an organic type such as azodicarbonamide or an inorganic type such as sodium carbonate/citric acid mixture. The composition of a combination of component A with component B is desirably such that cell diameters of several tensμm or below can be realized. Component C used is desirably a finely divided silicon oxide abrasive, This foam has excellent water resistance as compared with a conventional urethane foam, so that it can give a CMP pad having durability.
    • 5. 发明专利
    • MANUFACTURE OF CONDUCTIVE COMPOSITE MATERIAL ELEMENT
    • JPH09115702A
    • 1997-05-02
    • JP27516295
    • 1995-10-24
    • HITACHI CHEMICAL CO LTD
    • YAMADA MITSUOMIYATA KAZUMASA
    • H01C7/02
    • PROBLEM TO BE SOLVED: To obtain a highly reliable conductive composite material element by subjecting an organic polymer to heat treatment in which the polymer is repeatedly heated to a temperature which falls between the glass-transition temperature of the polymer and a temperature near the melting point of the polymer and cooled a plurality of times. SOLUTION: An organic polymer is composed of single resin of polyolefin, nylon, etc., or a mixture of these resin and a conductive material is composed of carbon black or metallic alloy or a mixture of them. Firstly, a conductive composite material element is prepared by mixing the organic polymer and conductive material with each other and molding the mixture. Then the element is subject to heat treatment in which the element is repeatedly heated to a temperature which falls between the glass-transition temperature of the polymer and a temperature near the melting point of the polymer. Therefore, the continuity resistance of the element does not change much with time and the relation between the continuity resistance and temperature of the element can be reproduced excellently.