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1. 发明专利

JPH07307110A CONDUCTIVE PASTE 失效
公开(公告)号：JPH07307110A
公开(公告)日：1995-11-21
申请号：JP5589994
申请日：1994-03-25
申请人： HITACHI CHEMICAL CO LTD
发明人： KUWASHIMA HIDEJI , YAMANA SHOZO , KIKUCHI JUNICHI , WADA HIROSHI , ONO RIICHI
IPC分类号： H05K1/09 , C01G53/00 , C09D5/24 , H01B1/00 , H01B1/22
摘要： PURPOSE:To provide a conductive paste which shows low resistance, high conductivity, high migration resistance and high solder resistance and is very economical by containing composite particles in which a predetermined metal powder is nearly uniformly integrated. CONSTITUTION:A conductive paste is formed by containing composite particles in which silver powder and /nickel powder are nearly uniformly integrated at the weight ratio of 100:1 to 10:1 and the aspect ratio is not less than 3 and which particles have a flake-like form and an average particle diameter of 10mum. When it is used for a wiring base board and the like which have a through-hole, the resistance of the through-hole is reduced to make a high conductivity paste, and since an alloy of silver and palladium is not used, a conductive paste is made which shows high migration resistance and high solder resistance under the environment of high temperature and high humidity and is very economical.

2. 发明专利

JPH07307109A CONDUCTIVE PASTE 失效
公开(公告)号：JPH07307109A
公开(公告)日：1995-11-21
申请号：JP5589894
申请日：1994-03-25
申请人： HITACHI CHEMICAL CO LTD
发明人： KUWASHIMA HIDEJI , YAMANA SHOZO , KIKUCHI JUNICHI , WADA HIROSHI , ONO RIICHI
IPC分类号： H05K1/09 , C09D5/24 , H01B1/00 , H01B1/22
摘要： PURPOSE:To provide a conductive paste which shows low resistance, high conductivity, high migration resistance and high solder resistance and is very economical by containing composite particles in which a predetermined metal powder is nearly uniformly integrated. CONSTITUTION:A conductive paste is formed by containing composite particles in which silver powder and titanium powder are nearly uniformly integrated at the weight ratio of 100:1 to 20:1 and the aspect ratio is not less than 10 and which particles have a flake-like form and an average particle diameter of not more than 10mum. When it is used for a wiring base board and the like which have a through-hole, the resistance of the through-hole is reduced to make a high conductivity paste, and since an alloy of silver and palladium is not used, a conductive paste which shows high migration resistance and high solder resistance under the environment of high temperature and high humidity and is very economical is made.

3. 发明专利

JPH01305830A GLAZED SUBSTRATE 失效
公开(公告)号：JPH01305830A
公开(公告)日：1989-12-11
申请号：JP13533488
申请日：1988-06-01
申请人： HITACHI CHEMICAL CO LTD
发明人： UEHARA HIDEAKI , HORIBE YOSHIYUKI , ONO RIICHI , YABUKI TAKAYOSHI
IPC分类号： C04B41/86 , C03C8/04
摘要： PURPOSE:To obtain a lead-and alkali-free glazed substrate having superior surface smoothness by glazing the surface of an alumina substrate with amorphous glass contg. prescribed mol percentages of SiO2, Al2O3, ZnO and BaO+ SrO and having a specified softening point and a specified average coefft. of thermal expansion. CONSTITUTION:The surface of an alumina substrate is glazed with amorphous glass contg., by mol, 50-70% SiO2, 1-20% Al2O3 (Al2O3/SiO2 =900 deg.C softening point and 65X10 -80X10 deg.C average coefft. of thermal expansion in the temp. range of 50-300 deg.C to form a glaze film having a hardly swollen edge part without rapid cooling. the resulting glazed substrate has the glaze film having the above- mentioned properties.

4. 发明专利

JPH07262822A CONDUCTIVE PASTE 失效
公开(公告)号：JPH07262822A
公开(公告)日：1995-10-13
申请号：JP5172494
申请日：1994-03-23
申请人： HITACHI CHEMICAL CO LTD
发明人： YAMANA SHOZO , KUWASHIMA HIDEJI , KIKUCHI JUNICHI , ONO RIICHI
IPC分类号： C09D5/24 , H01B1/00 , H01B1/24 , H05K1/09 , H01B1/22
摘要： PURPOSE:To provide a conductive paste which has a high conductivity and excellent economical efficiency, and can prevent or reduce a short circuit between electrodes or between wirings under the ambiance of a high temperature and a high humidity, by containing a specific graphite powder in the conductive paste. CONSTITUTION:The conductive paste includes a flake form graphite powder, and a minute graphite powder, and although the form of the flake form graphite powder has no limitation, it is preferable that the mean aspect ratio is about 10 or higher, being more preferable to be 20 or higher. Although the form of the minute graphite powder has no limitation, it is preferable that the form is the undifined form, and the mean grain size is less than 10mum, being more preferable to be less than 5mum. The using method of the flake form graphite powder and the minute graphite powder is preferable to mix the materials together evenly by a ball mill and the like, and then added to a resin composite, because the dispersion property of the powder is improved in such a process.

5. 发明专利

JPH0714429A ELECTRICALLY CONDUCTIVE COATING MATERIAL AND ITS MANUFACTURE 失效
公开(公告)号：JPH0714429A
公开(公告)日：1995-01-17
申请号：JP15673993
申请日：1993-06-28
申请人： HITACHI CHEMICAL CO LTD
发明人： ONO RIICHI , WATANABE YOSHIHIRO , KUWAJIMA HIDEJI
IPC分类号： C09D5/24 , H01B1/22 , H05K1/09
摘要： PURPOSE:To improve the thixotropy of a conductive coating material, to increase the screen printing adaptability and the soldering strength, and to prevent a migration, by adding a specific amount of furancarboxylic acid to a silver powder mixture. CONSTITUTION:A binder including a synthetic resin and an organic solvent is mixed to a silver powder. In this case, a mixture of a scaly silver powder and a spherical sliver powder is used as the silver powder, and 0.01 to 8 pts.wt. of furancalbxylic acid is added to 20 to 80 pts.wt. of the silver powder mixture. When such a conductive paint is manufactured, a binder including the synthetic resin and the organic solvent is added to the silver powder mixture including the scaly silver powder and the spherical silver powder, and they are mixed and kneaded, and then, 0.01 to 8 pts.wt. of furancarboxylic acid is added to 20 to 80 pts.wt. of the silver powder mixture.

6. 发明专利

JPH0714423A CONDUCTIVE PASTE 失效
公开(公告)号：JPH0714423A
公开(公告)日：1995-01-17
申请号：JP15208093
申请日：1993-06-23
申请人： HITACHI CHEMICAL CO LTD
发明人： KUWAJIMA HIDEJI , WATANABE YOSHIHIRO , ONO RIICHI
IPC分类号： C09D5/24 , H01B1/00 , H01B1/22 , H05K1/09
摘要： PURPOSE:To reduce the resistance of through holes in a wiring board, by including a specific grain size of particulates on which a nickel plating is applied, and a silver plating is applied thereover. CONSTITUTION:This conductive paste includes a spherical form of particulates with the grain size less than 30mum, a nickel plating is applied on the surfaces, and a sliver plating is applied thereover; a flake form silver powder; a copper powder; and a nitrophenol sort. The almost spherical form of particulates are composed of a plastics or an inorganic material, and they are favorable to have the longer diameter less than 30mum, and to be conductive. The flake form silver powder is favorable to have the aspect ratio about 3 or higher, and the longer diameter of the grain size is less than 40mum. The copper powder is favorable to have the grain size as small as possible. As the nitrophenol sort, one sort or a mixture of several sorts of ortho-nitrophenol, meta-nitrophenol, para- nitrophenol, and 2, 4-dinitrophenol is used. By using this conductive paste, the through holes of a paper phenol copper-plated layered plate are filled so as to obtain a wiring board.

7. 发明专利

JPS5355996A METHOD OF POLARIZING PIEZOOELECTRIC TRANSFORMER 失效
公开(公告)号：JPS5355996A
公开(公告)日：1978-05-20
申请号：JP13142076
申请日：1976-10-30
申请人： HITACHI CHEMICAL CO LTD
发明人： ONO RIICHI , KOBAYASHI MASARU , YAMAMOTO KIKUO
IPC分类号： H01L41/107 , H01L41/08 , H02M3/24

8. 发明专利

JPH07307112A CONDUCTIVE PASTE 失效
公开(公告)号：JPH07307112A
公开(公告)日：1995-11-21
申请号：JP5590194
申请日：1994-03-25
申请人： HITACHI CHEMICAL CO LTD
发明人： YAMANA SHOZO , KUWASHIMA HIDEJI , KIKUCHI JUNICHI , WADA HIROSHI , ONO RIICHI
IPC分类号： H05K1/09 , C01G51/00 , C09D5/24 , H01B1/00 , H01B1/22
摘要： PURPOSE:To provide a conductive paste which shows a low resistance, high conductivity, high migration resistance and high solder resistance and is very economical by containing composite particles in which a predetermined metal powder is nearly uniformly integrated. CONSTITUTION:A conductive paste is formed by containing composite particles in which 7 silver powder and cobalt powder are nearly uniformly integrated at the weight ratio of 100:1 to 20:1 and the aspect ratio is not less than 3 and which particles have a flake-like form and an average particle diameter of 10mum. When it is used for a wiring base board and the like which have a through-hole, the resistance of the through-hole is reduced to make a high conductivity paste, and since an alloy of silver and palladium is not used, a conductive paste is made which shows high migration resistance and high solder resistance under the environment of high temperature and high humidity and is very economical.

9. 发明专利

JPH08330181A CAPACITOR FOR ELECTRIC CIRCUIT AND ITS PRODUCTION 失效
公开(公告)号：JPH08330181A
公开(公告)日：1996-12-13
申请号：JP13236495
申请日：1995-05-30
申请人： HITACHI CHEMICAL CO LTD
发明人： KIKUCHI JUNICHI , YAMANA SHOZO , KUWAJIMA HIDEJI , ONO RIICHI , UEDA TOYOICHI
IPC分类号： H01G4/33 , H01G4/20 , H01G4/30
摘要： PURPOSE: To provide a thin flexible capacitor having sufficient capacity and stabilized breakdown strength by providing one or a plurality of units, each comprising a conductive layer and a dielectric layer including a resin film layer and a dielectric paste layer, on a basic material and then forming another conductive layer. CONSTITUTION: A conductive layer 2 is formed on a basic material 1 by applying a conductive paste containing conductive metal powder and a resin. A resin film 3 is pasted on the conductive layer 2 and a dielectric paste containing high dielectric powder and resin is applied onto the resin film thus forming a dielectric layer containing the resin film layer 3 and the dielectric paste layer 4. The two layers constitute a unit and one or a plurality of units are provided on the basic material 1. Another conductive layer 2 is further formed on it by applying a conductive paste containing conductive metal powder and resin.

10. 发明专利

JPH08293429A CAPACITOR FOR ELECTRIC CIRCUIT AND ITS MANUFACTURE 失效
公开(公告)号：JPH08293429A
公开(公告)日：1996-11-05
申请号：JP9872495
申请日：1995-04-24
申请人： HITACHI CHEMICAL CO LTD
发明人： KIKUCHI JUNICHI , YAMANA SHOZO , KUWASHIMA HIDEJI , ONO RIICHI , UEDA TOYOICHI
IPC分类号： H05K1/16 , H01G4/12 , H01G4/33
摘要： PURPOSE: To provide a capacitor for electric circuits which is thin and not damaged even in case of it being bent, and provide its manufacturing method. CONSTITUTION: A capacitor for electric circuits wherein conductive layers containing a conductive metallic powder and resin composite and a dielectric layer 3 containing a high-dielectric-constant powder and resin composite are formed respectively on a plastic base material 1. A manufacturing method wherein conductive pastes containing the conductive metallic powder and resin composite and a dielectric paste containing the high-dielectric-constant powder and resin composite are printed respectively on the surface of the plastic base material 1 and thereafter the pastes are hardened.

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