专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPH01120852A PLASTIC CHIP CARRIER 失效
公开(公告)号：JPH01120852A
公开(公告)日：1989-05-12
申请号：JP27887787
申请日：1987-11-04
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWASHIMA YUTAKA
IPC分类号： H01L23/12 , H05K3/24 , H05K3/34 , H05K3/42
摘要： PURPOSE:To form a plastic chip carrier at a low cost, by forming solder projections at through holes of a plurality of matrixes which are formed from the surfaces to the rears of package bases to form each solder bump, thereby causing the solder bump to serve as a point of contact. CONSTITUTION:Each copper plated through hole is formed at a substrate 2 through systems of electroless copper-plating and electrolytic copper plating and circuit formation is carried out by using substractive processing. Further, a solder resist 4 is formed at both sides of the substrate 2 by using a printing process or a baking process and so on. After that, high purity Ni-Au plating process 5 and 6 for wire bonding are carried out at required places. Then, solder projections 7 are performed to each through hole by using a dip brazing process, a wave soldering, a reflow process, and the like. The solder projections allow a package to perform hermetic seal and the package having input/output terminals is formed toward the rear of the substrate.

2. 发明专利

JPS617688A Method of producing printed circuit board 失效
公开(公告)号：JPS617688A
公开(公告)日：1986-01-14
申请号：JP12834484
申请日：1984-06-21
申请人： Hitachi Chemical Co Ltd
发明人： IWASAKI YORIO , FUKUTOMI NAOKI , KIDA AKINARI , TSUBOMATSU YOSHIAKI , KAWASHIMA YUTAKA
IPC分类号： H05K3/06 , H05K3/08 , H05K3/18

3. 发明专利

JPS612383A METHOD OF FORMING RESIST PATTERN 失效
公开(公告)号：JPS612383A
公开(公告)日：1986-01-08
申请号：JP12284584
申请日：1984-06-14
申请人： HITACHI CHEMICAL CO LTD
发明人： IWASAKI YORIO , FUKUTOMI NAOKI , KIDA AKINARI , KOJIMA FUJIO , KAWASHIMA YUTAKA
IPC分类号： H05K3/06 , H05K3/18

4. 发明专利

JPS59101888A Method of producing flexible printed circuit board with terminal 失效
标题翻译：用端子生产柔性印刷电路板的方法
公开(公告)号：JPS59101888A
公开(公告)日：1984-06-12
申请号：JP21164082
申请日：1982-12-02
申请人： Hitachi Chemical Co Ltd
发明人： KAWASHIMA YUTAKA , KIKUCHI TSUTOMU
IPC分类号： H05K1/11 , H01B13/00 , H05K1/02 , H05K3/00

5. 发明专利

JPH04206686A MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD WITH SMALL DIAMETER VIA HOLE 失效
公开(公告)号：JPH04206686A
公开(公告)日：1992-07-28
申请号：JP32978290
申请日：1990-11-30
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWASHIMA YUTAKA
IPC分类号： H05K3/06 , H05K3/46
摘要： PURPOSE:To prevent an etching solution from soaking resultant from a deviated photo mask due to printing by burying a resin layer into a small hole and a through a hole, covering the land of each hole with tenting resist and then etching. CONSTITUTION:After a through hole and a small-sized via hole 3 are formed on a base material 7, liquid sensitivity resin is applied to the whole surface of the base material prior to a print process. During this process, resin soaks into the small hole and the small-sized via hole 3. After the resin is cured, only the cured resin on the surface of the base material 7 is eliminated where a resin layer 8 is formed. Then, a dry film is laminated on copper cladding 9 and developed, thereby forming tenting resist 1, which covers the lands of the through hole and the small-sized via hole 3. After it is etched with an etching solution 2, the resist 1 is separated and the resin layer 8 is also removed.

6. 发明专利

JPH04120791A MANUFACTURE OF MULTILAYER PRINTER CIRCUIT BOARD 失效
公开(公告)号：JPH04120791A
公开(公告)日：1992-04-21
申请号：JP24223090
申请日：1990-09-12
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWASHIMA YUTAKA
IPC分类号： H05K3/42 , H05K1/09 , H05K3/06
摘要： PURPOSE:To eliminate an overhang of a gold plating by covering a pattern gold plating with peelable etching resist formed in the same pattern shape wider than that of the pattern of the gold plating when the copper plating is pattern gold plated and then again copper plated. CONSTITUTION:An inner layer circuit forming board and an outer layer copper foil are adhered to one another by laminating and thermally press-bonding. Subsequently, an outer layer hole 3 is opened at a predetermined position of a base material 1, smeared, deburred, honed, electrolessly copper-plated and electrically copper-plated to be panel copper plated 4. An outer layer circuit is electrolytically nickel-plated 7 and gold plated 6, and photosensitive etching resist is peeled. Photosensitive etching resist 2 is again laminated on its outer layer. A negative pattern is printed, developed, and the resist 2 of the same pattern shape having a wider width about 20-40mum than the pattern width is tented.

7. 发明专利

JPH01222497A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH01222497A
公开(公告)日：1989-09-05
申请号：JP4843788
申请日：1988-03-01
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWASHIMA YUTAKA
IPC分类号： H05K3/46
摘要： PURPOSE:To realize a desirable characteristic impedance efficiently by a method wherein a prepreg is interposed between a power source layer and a copper plated base material, and the thickness of the copper plated base material is made to be two-thirds or more of the total thickness of the copper plated base material and the prepreg. CONSTITUTION:A prepreg 14, composed of a glass cloth base material impregnated with epoxy resin or polyimide resin, is used as an interlayer adhesive, and a multilayer structure is formed through hot pressing employing the prepreg 14. In this process, the interlayer prepreg 14 is made thin and the thickness of a copper plated laminate 12 is made to be two-thirds or more of the total thickness of the laminate 12 and the prepreg 14. By these processes, the interlayer thickness can be restrained in the rate of change at the laminating press, so that the characteristic impedance of a multilayer printed wiring board can be controlled within the range of error of + or -10%.

8. 发明专利

JPS616895A Multilayer printed circuit board with inner layer resistor 失效
标题翻译：具有内层电阻的多层印刷电路板
公开(公告)号：JPS616895A
公开(公告)日：1986-01-13
申请号：JP12667684
申请日：1984-06-20
申请人： Hitachi Chemical Co Ltd
发明人： KAWASHIMA YUTAKA , FUKUTOMI NAOKI , IWASAKI YORIO , KIDA AKINARI , OKADA NAOTO
IPC分类号： H05K3/46

9. 发明专利

JPH0158878B2 失效
公开(公告)号：JPH0158878B2
公开(公告)日：1989-12-13
申请号：JP12020484
申请日：1984-06-12
申请人： HITACHI CHEMICAL CO LTD
发明人： TSUBOMATSU YOSHIAKI , FUKUTOMI NAOKI , IWASAKI YORIO , KIDA AKINARI , KAWASHIMA YUTAKA
IPC分类号： H05K3/20 , H05K3/18 , H05K3/24

10. 发明专利

JPH01192513A MANUFACTURE OF HIGH-DENSITY MULTI-LAYER PRINTED WIRING BOARD 失效
公开(公告)号：JPH01192513A
公开(公告)日：1989-08-02
申请号：JP1812988
申请日：1988-01-28
申请人： HITACHI CHEMICAL CO LTD
发明人： KAWASHIMA YUTAKA
IPC分类号： B29C43/20 , B29K105/06 , B29L9/00 , B29L31/34 , H05K3/46
摘要： PURPOSE:To improve working efficiency in a lamination press process by controlling interlaminar positional deviation of a base material, by making use of a stud made of a soft metal or heat-resistant resin as a pin for pin lamination at the time of lamination press. CONSTITUTION:A guide hole for pin lamination is bored into a copper plated laminated board 8 and also a through hole for a stud is bored at the same time. Then an inner layer circuit is formed and copper oxide treatment is performed. Then an inner layer circuit layer is fixed with the stud 7 made of either a softer metal as compared with SUB or heat-resistant resin through prepreg. In this instance, the stud 7 is buried into a part where there is no inner layer copper foil on the inside of a product or that outside of the product. Lamination press is performed by standing up pins 1 for pin lamination around the board further. Boring of an outer layer, smear treatment, deburring, honing, chemical copper plating and electroplating with copper are performed continuously. The used stud 7 is left behind within the product without performing etching at a point of time of formation of an outer layer circuit.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式