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    • 2. 发明专利
    • MANUFACTURE OF COLLECTOR FOR LEAD ACCUMULATOR
    • JPH04206360A
    • 1992-07-28
    • JP33374990
    • 1990-11-30
    • HITACHI CHEMICAL CO LTD
    • DOSONO TOSHINORIUCHIDA TOSHIOSUGIMOTO MITSUAKI
    • H01M4/82
    • PURPOSE:To manufacture a collector suitable to a lead accumulator having a high energy density by etching a lead or lead alloy foil stuck to an acid resisting film into a collector form, and making a negative electrode plate thinner than a positive electrode plate by etching. CONSTITUTION:A laminated film of a lead or lead alloy foil 4 and an acid resisting film 3 having polyethylene as an outer layer is prepared, an etching resist 5 is formed on the lead or lead alloy foil side surface of the laminated film, etching is conducted by use of a mixture of acetic acid, hydrogen peroxide and water, and the resist is then removed by caustic soda aqueous solution or a solvent such as trichlene. Thereafter, the etching resist is again formed only on a positive electrode collector 1, a negative electrode collector 2 is etched to make the negative electrode collector 2 thinner than the positive electrode collector 1, and the resist is removed to make the positive and negative electrode collectors 1, 2. Thus, the volume ratio and weight ratio of the active material to the whole battery are largely improved, and the energy density of the battery can be enhanced.
    • 3. 发明专利
    • MANUFACTURE OF COLLECTOR FOR LEAD ACCUMULATOR
    • JPH04206359A
    • 1992-07-28
    • JP33374890
    • 1990-11-30
    • HITACHI CHEMICAL CO LTD
    • DOSONO TOSHINORIUCHIDA TOSHIOSUGIMOTO MITSUAKI
    • H01M4/82
    • PURPOSE:To manufacture a collector having a high yield of a material suitable for a lead accumulator by printing a creamy solder consisting of powdery lead or a lead alloy and a solvent on a base body worked into a determined form, removing the solvent, and then resolving the lead or lead alloy to form the similar form to the foundation base body. CONSTITUTION:On a copper foil 4 stuck to an acid resisting film 3, an etching resist 5 is formed, ferric chlorite aqueous solution is sprayed to etch the resist non-coat part of the copper foil 4, and the etching resist 5 is then removed to form the pattern of the foundation copper foil 4. On the foundation copper foil 4, a creamy lead alloy powder 6 mixed with a solvent and a flux is printed by use of a metal mask or screen, the solvent is removed by preliminarily heating, the creamy lead alloy powder 6 is then dissolved by reheating and recoagulated. Finally, an epoxy resin 8 is applied near the exposed part of the foundation copper foil 4 and hardened to form a collector. Thus, as the removed part of the lead or lead alloy is eliminated in the manufacture of the collector, the yield of the lead or lead alloy can be highly improved.
    • 4. 发明专利
    • MANUFACTURE OF COLLECTOR FOR LEAD ACCUMULATOR
    • JPH04206357A
    • 1992-07-28
    • JP33374490
    • 1990-11-30
    • HITACHI CHEMICAL CO LTD
    • DOSONO TOSHINORIUCHIDA TOSHIOSAITO SHINJISUGIMOTO MITSUAKI
    • H01M4/82
    • PURPOSE:To dispense with solvent treatment and waste solution treatment other than etching solution in the process of forming and removing an etching resist by pressing an acid resisting rubber elastic body having a determined form onto lead or a lead alloy to conduct etching, and removing the pressure after the etching to remove the body. CONSTITUTION:A mask consisting of a silicone rubber 3 and a stainless press mold 4 in which the pressing side surface of the silicone rubber 3 has a protruded form, and the press mold side surface has a form further protruded more than that of the rubber, and this mask is pressed onto a lead alloy foil 5 having a resin film 2 stuck to the reverse and dipped in a mixture of acetic acid and hydrogen peroxide, and etching is conducted while stirring the solution. After the etching, the etching solution is removed by washing, and the resin film 2 stuck onto the lead alloy foil 5 is warped from the end and peeled to separate the resist of the silicone rubber 3 from the lead alloy foil 5. Thus, no solvent is used for the formation and removal of the etching resist, and waste solutions other than the etching solution can be eliminated.