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1. 发明专利

JP2000332188A COMPOUND LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME 失效
公开(公告)号：JP2000332188A
公开(公告)日：2000-11-30
申请号：JP14104099
申请日：1999-05-21
申请人： HITACHI CABLE
发明人： YONEMOTO TAKAHARU , SASAKI SATOSHI , KAWANOBE SUNAO , WATABIKI TERUYUKI
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a compound lead frame that is composed by combining a wiring board and a lead frame, and a semiconductor device using the lead frame. SOLUTION: The semiconductor device is provided with a lead frame with an inner lead 16, an outer lead 17, a die pad 18, a film insulation layer 12 with a lower adhesive layer 13 that adheres to the die pad on a lower surface, and a wiring board 5 with a wiring pattern 30 being formed on the upper adhesive layer 11 being provided on the film insulation layer. A semiconductor chip is mounted to the compound lead frame where the line part/space part of a connection pattern and a dummy pattern formed on the wiring pattern is set to 80 μm/80 μm or less, and the lower and upper adhesive layers of the wiring board are composed by a thermoplastic adhesive, the electrode of the semiconductor chip and the bonding pad of the pattern for connection and then the inner lead of the load frame and the bonding pad of the connection pattern are connected by a bonding wire.

2. 发明专利

JP2000188354A MANUFACTURE OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000188354A
公开(公告)日：2000-07-04
申请号：JP36488498
申请日：1998-12-22
申请人： HITACHI CABLE
发明人： TAKEYA NORIAKI , YASUDA TOMO , SHIMAZAKI HIRONORI , SASAKI SATOSHI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package with which the deformations such as warpage, etc., of a flexible circuit substrate can be eliminated, even after the flexible circuit substrate is adhered to an opening of a metallic frame. SOLUTION: A sheet-like flexible circuit substrate 7 is adhered to the opening of a metallic frame 1 with an adhesive agent and is used as an intermediate product for semiconductor package. Furthermore, the intermediate product is transferred to respective steps for manufacturing a semiconductor package such as mounting of semiconductor element 9, wire bonding, resin packaging, etc. In such a manufacturing method, before the flexible substrate 7 is adhered to the metallic frame 1, the substrate 7 is moistened and is thereafter is adhered to the metallic frame 1. It is left for a fixed period or longer under normal environment or under a low-moisture environment, thus reducing warpage of the substrate 7.

3. 发明专利

JPH09116082A LEAD FRAME AND SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH09116082A
公开(公告)日：1997-05-02
申请号：JP26660895
申请日：1995-10-16
申请人： HITACHI CABLE
发明人： KAWAMURA TOSHIO , SUZUMURA TAKASHI , SASAKI SATOSHI , IMAI NOBORU , KAWANOBE SUNAO
IPC分类号： H01L21/52 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor package which is easy to handle and can be built up at low cost and which has no warp in a lead frame and has no crack after it is finished by improving the adhesive structure at a semiconductor chip mounting section. SOLUTION: A thermoplastic adhesive 6 is preliminarily applied to a semiconductor chip mounting section 4 of a lead frame 1 and then is dried. At that time, the thickness of the thermoplastic adhesive after being dried is preferably 30μm or above. Using this lead frame, a semiconductor chip 3 is mounted on the semiconductor chip mounting section 4 where the thermoplastic adhesive 6 is applied and dried and then all the components are sealed with resin to build up a semiconductor package.

4. 发明专利

JPH08213414A RESIN LAYER FORMING METHOD FOR LEAD FRAME 失效
公开(公告)号：JPH08213414A
公开(公告)日：1996-08-20
申请号：JP1494695
申请日：1995-02-01
申请人： HITACHI CABLE
发明人： KAWAMURA TOSHIO , SUZUMURA TAKASHI , SASAKI SATOSHI
IPC分类号： H01L21/52
摘要： PURPOSE: To provide a method for forming a resin layer in a lead frame in which a resin layer of the complicated shape can be formed without burr or warpage at the layer to be formed. CONSTITUTION: If a resin layer 3 made of adhesive coating film is formed on the surface of a lead frame 1, when the adhesive 11 is discharged from an adhesive supply unit 12, the excess of the adhesive discharged simultaneously is sucked to be removed by a sucking unit 13, and a precise coating film is formed by the synergistic action of the units 12 and 13.

5. 发明专利

JPH08125107A APPARATUS FOR APPLYING FILM TO LEAD FRAME 失效
公开(公告)号：JPH08125107A
公开(公告)日：1996-05-17
申请号：JP26046194
申请日：1994-10-25
申请人： HITACHI CABLE
发明人： SASAKI SATOSHI , WATABIKI TERUYUKI , YONEMOTO TAKAHARU
IPC分类号： C09J5/00 , H01L23/50
摘要： PURPOSE: To eliminate burr from a punched film and to prevent the burr from adhering to the lead part of a lead frame by mounting the film on the surface of a die through a buffer layer before punching the film. CONSTITUTION: The apparatus for applying a film to a lead frame comprises a punch 2 and a die 3 being lowered through an air cylinder 1, an aluminum buffer layer 4 provided on the surface of the die 3 while having same shape as that being punched by the die 3, and a heat plate 5. When the air cylinder 1 is operated to lower the punch 2, a film 6 mounted on the surface of the die 3 through the butter layer 4 is punched and the punched film 6 is fed to a lead frame 7 mounted on the heat plate 5. Compression stress is relaxed through the buffer layer 4 and burr, caused by the compression stress, is eliminated when the film 6 is punched. The film 6 being fed is pushed by the punch 2 and applied to the lead frame 7 through thermocompression.

6. 发明专利

JPH088390A METHOD AND APPARATUS FOR APPLYING FILM TO LEAD FRAME OR THE LIKE 失效
公开(公告)号：JPH088390A
公开(公告)日：1996-01-12
申请号：JP13850394
申请日：1994-06-21
申请人： HITACHI CABLE
发明人： SASAKI SATOSHI , WATABIKI TERUYUKI , YONEMOTO TAKAHARU , KAWAMURA TOSHIO
IPC分类号： H01L23/50
摘要： PURPOSE:To apply pressure uniformly to the surface of an insulating film, when it is pressed against a heated member, by deforming a planar member made of a material having lower hardness than the heated member depending on the level difference on the surface of heated member thereby absorbing the level difference on the surface of lead frame. CONSTITUTION:A lead frame 20 is mounted on a heat plate 1 applied with an aluminium plate 2 and punched 16 to produce an insulating film 13 which is then pressed, along with an underlying lead frame 20, by means of the heat plate 1. In this regard, the aluminium plate 2 applied to the surface of the heat plate 1 is deformed plastically according to the irregularities on the surface of the lead frame 20 caused by partial plating. Consequently, the level difference on the surface of the lead frame 20 is absorbed and a pressure can be applied uniformly to the surface of an insulating film.

7. 发明专利

JPH06350018A METHOD FOR STICKING FILM TO LEAD FRAME 失效
公开(公告)号：JPH06350018A
公开(公告)日：1994-12-22
申请号：JP16600093
申请日：1993-06-11
申请人： HITACHI CABLE
发明人： KAWAMURA TOSHIO , KANEKO KENICHI , IMAI NOBORU , SASAKI SATOSHI , KOSAKA HIROYUKI
IPC分类号： C09J5/00 , H01L23/50
摘要： PURPOSE:To improve the accuracy of the sticking position of a film without cumbersome working by positioning the adhesive film so that a lead frame has a minute distance, which prevents the deviation of the adhesive film, to a die when the adhesive film is stuck to the lead frame. CONSTITUTION:A heater block 5 is lifted with an actuator 9. Thus, a lead frame 6 is lifted up. A lead frame 6 is arranged so as to have a distance C downward from a die 2. When a punch 1 is lowered, the punch cuts a film 7 into a specified shape in cooperation with the die 2. Thereafter, the punched film 2 and the lead frame 6 which is arranged at the distance C at the lower side of the die 2 are pushed to the heater block 5, which is lifted with the actuator 9 and held. The film is stuck to the specified position of the lead frame 6 by thercompressing bonding. Thus, the accuracy of the sticking position of the film 7 to the lead frame 6 can be enhanced.

8. 发明专利

JPH06291157A METHOD OF APPLYING INSULATING MATERIAL TO LEAD FRAME AND MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH06291157A
公开(公告)日：1994-10-18
申请号：JP7929493
申请日：1993-04-06
申请人： HITACHI CABLE
发明人： SUGIMOTO HIROSHI , SUZUMURA TAKASHI , KAWAMURA TOSHIO , SASAKI SATOSHI
IPC分类号： B05D7/00 , H01L21/52 , H01L23/50
摘要： PURPOSE:To form an insulating material with a minimum volume on the portion for fixing semiconductor elements on an inner lead by applying the insulating material having adhesion by using transcribing means such as stamp. CONSTITUTION:An applying surface 12 of a stamp 11 as transcribing means is dipped in a vanish or liquid insulating material 8 placed in a liquid container 10 and the insulating material 8 is supplied to the applying surface 12. Then, the applying surface 12 is pressed against a portion for fixing semiconductor elements 6 on a lead frame 2 for coating the insulating material 8. This coated portion is dried and fixed for forming an insulating material layer 9. By doing this, the insulating material layer 9 can be made thinner and moreover the layer can be formed with a minimum volume without striding the whole of a plurality of inner leads 3 disposed in parallel.

9. 发明专利

JPH04313554A POSITIONING FEEDING DEVICE FOR LONG LINE BODY 失效
公开(公告)号：JPH04313554A
公开(公告)日：1992-11-05
申请号：JP8000291
申请日：1991-04-12
申请人： HITACHI CABLE
发明人： SATO TAKUMI , SUZUMURA TAKASHI , SASAKI SATOSHI , SHINODA TSUTOMU
IPC分类号： B65H23/038
摘要： PURPOSE:To provide a positioning feeding device for a long line body which eliminates a defect wherein the end of the line is bitten through by a guide, reduces the fluctuation in width of the line to a very low value, and improves precision and reliability. CONSTITUTION:A plurality of rollers 13 for positioning the reference end in the direction width of a line 6 are located in juxtaposition with each other, and at least one roller 9 having a shaft positioned obliquely to the direction of width of the line 6 and pressing the line in the direction of the thickness of the line 6 is arranged. This constitution suppresses the fluctuation in width of the line to a value being 1/10 of that of a conventional one and prevents the damage of the line because of a guide biting through the line end.

10. 发明专利

JPH03180484A STRIPE PLATING DEVICE 失效
公开(公告)号：JPH03180484A
公开(公告)日：1991-08-06
申请号：JP31865789
申请日：1989-12-07
申请人： HITACHI CABLE
发明人： SASAKI SATOSHI , HAGITANI SHIGEO , SUZUMURA TAKASHI
IPC分类号： C25D5/02
摘要： PURPOSE:To regulate the temp. of plating liquid to the specified temp. and to perform stripe plating which is free from unevenness of luster and has uniform appearance by providing a plating liquid recovery path having a cooler between a plating liquid tank and a plating liquid auxiliary tank in the case of producing a stripe plating streak in an injection system of plating liquid. CONSTITUTION:Plating liquid 12 in a plating tank 8 is force-fed into an auxiliary tank 2 by a pump 10 and sprayed on a plating face 5 wherein the face to be plated is covered by a masking tape 4 from the tip of a nozzle 3. The plating face 5 is plated with metal contained in the plating liquid 12 by conducting electricity between a cathode formed of a streak 6 to be plated and an anode 13 in the auxiliary tank 2. The plating liquid is passed through a recovery path 7 and recovered into the plating liquid tank 8. The plating liquid whose temp. is raised in the process of plating work is cooled by a water cooling pipe 71 provided to the recovery path 7 and heated by a heater 9 according to necessity. The temp. of the plating liquid which is circulated through the tank 8, the auxiliary tank 2 and the recovery path 7 is always held at the specified temp. Thereby luster of stripe plating on the plating face 5 of the streak 6 to be plated is uniformed and generation of plating unevenness is prevented.

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