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1. 发明专利

JPS62227593A ORGANIC SOLDER 失效
公开(公告)号：JPS62227593A
公开(公告)日：1987-10-06
申请号：JP7204486
申请日：1986-03-28
申请人： HARIMA CHEMICALS INC , OHARA KINZOKU KOGYO KK
发明人： KONO MASANAO , SUMIYOSHI EIJI , ARIMOTO KUNIO , MIZUTA TATSUJI , OBARA KAZUAKI , OBARA SHINSUKE
IPC分类号： B23K35/22 , B23K35/14 , B23K35/36 , B23K35/363
摘要： PURPOSE:To uniformly supply solder and to prevent short circuiting by constituting the org. solder of maleic rosin or fumaric rosin and the salt of tin and lead and specifying the content of metallic tin and metallic lead to specific weight % or above. CONSTITUTION:The org. solder is constituted of the rosin deriv. of the maleic rosin or fumaric rosin and the salt of tin and lead. The content of the metallic tin in the solder is compounded to >=12% and the content of the metallic tin therein to >=4%. The salt substantially contg. tin and lead can be obtd. by adding the salt of tin and lead to the alkaline salt of the rosin deriv. and subjecting the same to double decomposition. The tin salt and lead salt of the rosin deriv. are decomposed to form the molten solder alloy when such org. solder is heated to 300-400 deg.C. Joining of metals is thus executed. Since the formation of the liberated metallic particles is prevented, the solder is uniformly supplied and the short circuiting is prevented.

2. 发明专利

JPH106074A SOLDER PASTE COMPOSITION 失效
公开(公告)号：JPH106074A
公开(公告)日：1998-01-13
申请号：JP18158996
申请日：1996-06-20
申请人： HARIMA CHEMICALS INC
发明人： ANADA TAKAAKI , AIHARA MASAMI , SHIMA TOSHINORI , KONO MASANAO
IPC分类号： B23K35/22 , B23K35/36 , B23K35/363
摘要： PROBLEM TO BE SOLVED: To prevent the reduction of solderability generating due to the reaction between an activator or the like and a zinc in a flux and to maintain an age- based preservation and stability of a paste by adding an antioxidant into the flux in the zinc contained solder paste for soldering. SOLUTION: The solder paste is composed of a zinc contained soldering alloy powder and the flux mainly consisting of a natural resin or synthetic resin. The antioxidant of phenol, phosphorus, amine and sulfur is independently or are jointly added into the flux. The suitable adding amount is specified to be, by wt., 20-40% to the flux, and the preferable amount is specified to be, by wt., 5-30%. By this way, it is prevented that the antioxidant forms a chelate complex with a metal on the surface of soldering powder and the zinc in the soldering alloy reacts with the activator in the flux under the ordinary temperature. Also, at the time of soldering, as the result of evaporation by heating, the surface of the metal to be soldered is effectively cleaned, whereby solderability is improved.

3. 发明专利

JPH05308184A 失效
公开(公告)号：JPH05308184A
公开(公告)日：1993-11-19
申请号：JP13564292
申请日：1992-04-30
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： KOSUGE IZUMI , SHINOHARA TOMOSANE , OBARA YUICHI , FUSE KENICHI , KONO MASANAO
IPC分类号： H01L21/52 , H05K3/34
摘要： PURPOSE:To eliminate the separation of a lead from a circuit board (causing an open circuit) in a component mounting operation by a method where in a pad includes a wide part in the length-wise direction and a solder bump is formed on a solder layer of the wide part of the pad. CONSTITUTION:A solder layer 3 having a thickness required to solder a component lead is formed on a pad 2 formed on an insulating board 1 by pattern- etching a copper foil. In this case, the pad 2 includes a wide part in the length wise direction of the pad, and a solder bump 3a is formed on the wide part 2a. Thereby, the position of the solder bump 3a can be formed in a predetermined part, the thickness and the shape of the solder layer are made uniform in each pad, and a solder amount on the pad 2 can be increased. Since the solder layer 3 is swollen locally, it is possible to prevent the solder layer from being swollen and to eliminate an open defect.

4. 发明专利

JPH04297089A SOLDER COATING PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH04297089A
公开(公告)日：1992-10-21
申请号：JP8438491
申请日：1991-03-26
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： FUKUNAGA TAKAO , FUSE KENICHI , SHIROISHI HIROKAZU , KONO MASANAO , IRIE HISAO
IPC分类号： B23K35/14 , H05K3/24 , H05K3/34
摘要： PURPOSE:To solder leads of a component with sufficient wettability without flux by providing a solder layer having a necessary thickness to solder the leads on pads, and gold-plating it on its surface. CONSTITUTION:A printed circuit board having a copper pad row is manufactured, the row is coated with pastelike solder precipitated composition containing organic acid lead salt and tin powder as main ingredients, and heated. Thus, a solder layer is formed on each pad. Then, after oil and grease components on the surface of the layer are removed in a degreasing step, a solder-coated printed circuit board is dipped in gold electroless plating solution, and gold- plated on the surface. Thereafter, it is washed, sufficiently dried, and Sb-Pb- plated leads of a component are heated while being pressed on the solder layer, the gold-plated pads. Here, no flux is used.

5. 发明专利

JPH03171792A METHOD OF FORMING SOLDER LAYER ON PAD OF CIRCUIT BOARD 失效
公开(公告)号：JPH03171792A
公开(公告)日：1991-07-25
申请号：JP30905689
申请日：1989-11-30
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： FUSE KENICHI , FUKUNAGA TAKAO , KONO MASANAO , IRIE HISAO
IPC分类号： H05K3/34 , H05K3/24
摘要： PURPOSE:To realize surface mounting of an electronic component having an extremely short lead pitch by forming a relatively thick solder layer of the degree which does not expose an intermetallic compound even if it is heated in a uniform thickness on a pad of a circuit board. CONSTITUTION:A pad arraying part of a circuit board is coated with pastelike composition containing organic Pb and Sn powder, and an Sn-Pb alloy solder layer is selectively precipitated on the pad by heating. In this method, a liquid reservoir in which Sn powder is precipitated is generated on the part when the composition becomes liquid state by heating, and solder precipitation is advanced in a state that the Sn powder is covered with the liquid. Thus, a relatively thick solder layer can be formed in a uniform thickness without any bridge occurring to fine patterns of 0.5mm or shorter of pad arraying pitch.

6. 发明专利

JPH02310991A SURFACE MOUNTING METHOD FOR ELECTRONIC COMPONENT 失效
公开(公告)号：JPH02310991A
公开(公告)日：1990-12-26
申请号：JP13146889
申请日：1989-05-26
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： FUKUNAGA TAKAO , NAKAJIMA HISAO , FUSE KENICHI , KONO MASANAO , IRIE HISAO , INOUE MAKOTO
IPC分类号： B23K3/06 , B23K35/363 , H05K3/34
摘要： PURPOSE:To perform a surface mounting of an electronic component without generating a bridge even if the pitch of pads is very small by selectively precipitating tin-lead alloy only on the pads of a printed circuit board by a specific method. CONSTITUTION:After the pads 3 of a printed circuit board 1 are coated with tin powder-mixed organic acid lead salt paste 4, when they are heated, for example, at approx. 220 deg.C for 2-4min, tin-lead alloy 5 is selectively precipitated only on the surfaces of the pads 3. The alloy 5 is tin-rich tin-lead alloy containing more quantity of tin than that of the alloy to be eventually obtained. Then, the leads 6 of an electronic component are placed on the tin-rich alloy 5, then coated with organic acid lead salt paste 7, and then heated at approx. 220 deg.C for 1-3min. Then, the tin-rich alloy 5 is reacted with lead ions in the paste 7 to precipitate tin-lead alloy 8, and the pads 3 are soldered to the leads 6.

7. 发明专利

JPH02180979A HOT MELT ADHESIVE COMPOSITION AND ITS PRODUCTION 失效
公开(公告)号：JPH02180979A
公开(公告)日：1990-07-13
申请号：JP33336688
申请日：1988-12-30
申请人： HARIMA CHEMICALS INC
发明人： IKEDA NORIHITO , SANADA YASUYOSHI , KONO MASANAO
IPC分类号： C09J123/08 , C09J131/04 , C09J191/06 , C09J193/00 , C09J193/04
摘要： PURPOSE:To obtain the title composition of excellent heating stability by using an ethylene/vinyl acetate copolymer, a wax and a specified tackifying resin as the principal components. CONSTITUTION:The addition reaction of rosin, desirably purified rosin, with desirably 2.3-45mol% acrylic acid is performed, and the adduct is disproportionated and esterified with a polyalcohol (e.g. pentaerythritol) to obtain a tackifying resin desirably of a softening point of 100-140 deg.C, which is a polyalcohol ester of a disproportionated rosin/acrylic acid partial adduct. This tackifying resin, an ethylene/vinyl acetate copolymer and a wax (e.g. paraffin wax) are mixed together as the principal components.

8. 发明专利

JPH01157796A SOLDER DEPOSITING COMPOSITION AND SOLDER DEPOSITION METHOD 失效
公开(公告)号：JPH01157796A
公开(公告)日：1989-06-21
申请号：JP15668888
申请日：1988-06-27
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： FUKUNAGA TAKAO , NAKAJIMA HISAO , KOBAYASHI KENZO , KONO MASANAO , IRIE HISAO , INOUE MAKOTO
IPC分类号： B23K35/22 , B23K35/26 , B23K35/34 , H05K3/34
摘要： PURPOSE:To obtain the title solder depositing composition having an excellent fine pattern follow-up property by utilizing a metal deposition phenomenon due to a difference in ionization tendency. CONSTITUTION:The powder of the metal having the greatest ionization tendency among the metals constituting solder and the salt of the other metal and a carboxylic acid are mixed, and the mixture is deposited on the part to be soldered and heated. As a result, the metal salt is thermally decomposed, a metal ion is liberated, the metal ion is transferred to the metal powder particles due to a difference in ionization tendency and deposited as a metal on the surface of the metal particle by a substitution reaction, and the materials are melted, mixed, and deposited as solder. Accordingly, the tinned 6 lead 5 of an electronic part 4 is brought into contact with the tinned 3 pad 2 of a printed board 1, the composition 7 is deposited on the part and heated, hence the solder 8 is deposited in the form of a fillet, and the pad 2 and the lead 5 can be soldered.

9. 发明专利

JPS6417496A METHOD OF SOLDERING ELECTRONIC COMPONENT 失效
公开(公告)号：JPS6417496A
公开(公告)日：1989-01-20
申请号：JP17299787
申请日：1987-07-13
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： KOBAYASHI KENZO , FUKUNAGA TAKAO , NAKAJIMA HISAO , KONO MASANAO , IRIE HISAO , INOUE MAKOTO
IPC分类号： B23K35/34 , B23K1/00 , H05K3/34
摘要： PURPOSE:To solder at a low temperature and to prevent an electronic component from thermally damaging by dipping mixture of solder powder in a solution prepared by dissolving rosin acid lead salt in a solvent and heating it in a state that a lead is brought into contact with a pad. CONSTITUTION:Rosin acid lead salt solution 18 mixed with tin powder is filled in a vessel 28, placed on a hot plate 29 to be heated to 180-200 deg.C, and agitated by a stirrer 30. A printed circuit substrate 11 and an electronic component 21 are held from above and below by a jig 23, and dipped in the solution 18 mixed with the tin powder. When it is dipped for approx. 1-3min, solder of sufficient amount for soldering is precipitated at the contact of a pad 13 with a lead 17. Accordingly, its entirety is removed out of the solution 18, and the solder is cooled to be solidified. Thus, the soldering at low temperature is performed to prevent the component from thermally damaging.

10. 发明专利

JPS624765A ROSIN DERIVATIVE, PRODUCTION THEREOF AND ANTISTATIC AGENT 失效
公开(公告)号：JPS624765A
公开(公告)日：1987-01-10
申请号：JP14301885
申请日：1985-06-29
申请人： HARIMA CHEMICALS INC
发明人： SANADA YASUYOSHI , KONO MASANAO , ARIMOTO KUNIO , INOUE MAKOTO , SUMIYOSHI EIJI
IPC分类号： C09F1/00 , C09F1/04 , C09K3/16
摘要： NEW MATERIAL:Rosin derivatives of formula I, wherein R1 is a hydrocarbon group of rosin; R2 is a direct bond, a 1-10C alkylene with or without ether linkage in its chain, phenylene; X is halogen. USE:Compounds for pressure-sensitive adhesive and antistatic agent having excellent stainproofness, electric shock resistance and compatibility with rubber. PREPARATION:Rosin such as purified disproportionated rosin is reacted with a glycidylamine contg. a glycidyl group at one end and a halogenated ammonium group at other end, represented by formula II, in an org. solvent contg. at least 20wt% 1-5C lower alcohol (e.g. ethanol) at 60-120 deg.C for 2-3hr.

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