专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013026427A Lead frame for optical semiconductor device and method of manufacturing the same 有权
标题翻译：用于光学半导体器件的引线框架及其制造方法
公开(公告)号：JP2013026427A
公开(公告)日：2013-02-04
申请号：JP2011159512
申请日：2011-07-21
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： KOBAYASHI YOSHIAKI
IPC分类号： H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a lead frame for an optical semiconductor device of which sulfurization speed is equal to or less than a half of a conventional silver film, with initial optical reflectivity being excellent, and to provide a lead frame for an optical semiconductor of which a long-term reliability is excellent by two times or more than the conventional silver film, a wire bonding property is equivalent to the conventional silver film, and soldering property is excellent at a point which is exposed to the outside, resulting in requirement for no armor plating.SOLUTION: Relating to the lead frame for optical semiconductor device, a reflecting layer 2 made from silver-indium alloy, silver-tin alloy, or silver-indium-tin alloy is formed on a substance 1. An indium and/or tin oxide layer 3 is formed as a top surface layer by thickness of 0.0004-0.001 μm on the reflective layer 2.
摘要翻译：解决的问题：为了提供硫化速度等于或小于常规银膜的一半的光学半导体器件的引线框架，其初始光学反射率优异，并且提供用于长期可靠性优于常规银膜的两倍或更多的光学半导体，引线接合性能等同于传统的银膜，并且在暴露于外部的点处的焊接性能优异，导致不需要装甲电镀。解决方案：关于光半导体器件的引线框架，在物质1上形成由银 - 铟合金，银 - 锡合金或银 - 铟 - 锡合金制成的反射层2，铟和/或氧化锡层3在反射层2上形成厚度为0.0004-0.001μm的顶表面层。（C）2013，JPO＆INPIT

2. 发明专利

JP2012049041A Silver coating material for movable contact component and method for manufacturing the same 审中-公开
标题翻译：用于可移动接触部件的镀银材料及其制造方法
公开(公告)号：JP2012049041A
公开(公告)日：2012-03-08
申请号：JP2010191579
申请日：2010-08-27
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： KOSEKI KAZUHIRO , KOBAYASHI YOSHIAKI , KIKUCHI SHIN
IPC分类号： H01H1/04 , H01H11/04
摘要： PROBLEM TO BE SOLVED: To provide a silver coating material for a movable contact component and a manufacturing method therefor, in which a silver layer on a surface is not peeled and the contact resistance is not increased even after long-term use under an environment where switching is repeated.SOLUTION: The silver coating material for a movable contact component is constituted by sequentially laminating an underlayer 2 made of any one of nickel, a nickel alloy, cobalt, and a cobalt alloy, an intermediate layer 3 made of any one of copper, a copper alloy, tin, and a tin alloy, and an outermost layer 5 made of silver or a silver alloy, on a conductive base 1 made of copper, a copper alloy, iron, or an iron alloy. An intermediate oxide layer 4 as a second intermediate layer exists between the intermediate layer and the outermost layer.
摘要翻译：要解决的问题：为了提供一种用于可动接触部件的银涂层材料及其制造方法，其中表面上的银层不被剥离，并且即使在长期使用后接触电阻也不增加重复切换的环境。解决方案：用于可移动接触部件的银涂料通过依次层压由镍，镍合金，钴和钴合金中的任一种制成的底层2，由铜中的任一种制成的中间层3 ，铜合金，锡和锡合金，以及由银或银合金制成的最外层5，在由铜，铜合金，铁或铁合金制成的导电基体1上。作为第二中间层的中间氧化物层4存在于中间层和最外层之间。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2012033919A Lead frame for optical semiconductor device, method of manufacturing the same, and optical semiconductor device 有权
标题翻译：用于光学半导体器件的引线框架，其制造方法和光学半导体器件
公开(公告)号：JP2012033919A
公开(公告)日：2012-02-16
申请号：JP2011150461
申请日：2011-07-06
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： KOBAYASHI YOSHIAKI , SUZUKI SATOSHI , TACHIBANA AKIRA , KIKUCHI SHIN , ZAMA SATORU
IPC分类号： H01L33/62 , H01L23/48
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high brightness lead frame exhibiting excellent heat dissipation for an optical semiconductor device used in an LED, a photocoupler or a photointerrupter in which overall reflectivity is higher than that of a conventional silver coating in visual light range (wavelength 400-800nm), and reflectivity is good especially when a chip emitting light near the wavelength of 450nm is mounted, and to provide a method of manufacturing the same.SOLUTION: The lead frame for an optical semiconductor device has a reflective layer formed partially or entirely on at least on one side or both sides of the outermost surface of a conductive substrate. On the outermost surface in a region where at least the light emitted from an optical semiconductor element is reflected, the reflective layer has such a texture as at least the surface of a plating texture consisting of silver is deformed plastically. At least on the surface thereof, the area ratio of plating texture consisting of silver remaining by plastic deformation is 50% or less.
摘要翻译：要解决的问题：为了提供一种在用于LED，光耦合器或光断续器中的光学半导体器件表现出优异的散热的高亮度引线框架，其中总体反射率高于常规的银色涂层在视觉上的反射率范围（波长400-800nm），并且特别是当安装发射波长为450nm的光的芯片时，反射率是很好的，并且提供其制造方法。解决方案：用于光学半导体器件的引线框架具有在导电基板的最外表面的至少一侧或两侧上部分或全部形成的反射层。在至少从光半导体元件发射的光被反射的区域中的最外表面上，反射层具有至少由银构成的电镀纹理的表面塑性变形的纹理。至少在其表面上，由通过塑性变形剩余的银构成的电镀纹理的面积比为50％以下。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012023355A Led component material having plating film with high reflectance and led component 有权
标题翻译： LED组件材料具有高反射和LED组件的镀膜
公开(公告)号：JP2012023355A
公开(公告)日：2012-02-02
申请号：JP2011133716
申请日：2011-06-15
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： TACHIBANA AKIRA , KOBAYASHI YOSHIAKI , KIKUCHI SHIN , SUZUKI SATOSHI
IPC分类号： H01L33/60 , H01L23/50 , H01L33/62
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a lead frame which is sufficient in reflectance and superior in high luminance and heat dissipation when a chip emitting light to a near-ultraviolet region (wavelength of 340 to 400 nm), especially around wavelength of 375 nm in a lead frame for optical semiconductor device, which is used for an LED, a photocoupler and a photointerrupter, and to provide a manufacturing method of the lead frame and an LED component using the lead frame for optical semiconductor device.SOLUTION: An LED component material is obtained by depositing a plating film through electrocrystallization on, partially or entirely, at least one face or both faces of a metal base and smoothing a surface of the plating film. Reflectance and adhesion with a sealing material are improved by making surface roughness Ra in measurement by a stylus surface roughness meter to be 0.010 μm or above and surface roughness Sa in measurement by an atomic force microscope to be 50 nm or below in the LED component material.
摘要翻译：要解决的问题：为了提供一种引线框架，当将芯片发射到近紫外区域（波长为340-400nm）的光线，特别是波长的波长范围内时，提供足够的反射率和优异的高亮度和散热性在用于LED，光电耦合器和光断续器的光半导体装置的引线框架中，375nm，并且提供引线框架的制造方法和使用光半导体器件的引线框架的LED部件。解决方案：通过在部分或全部金属基底的至少一个面或两面上进行电结晶沉积电镀膜，并平滑电镀膜的表面，获得LED部件材料。通过使用针式表面粗糙度计测量的表面粗糙度Ra为0.010μm以上，通过原子力显微镜测定的表面粗糙度Sa为50nm以下，可以提高与密封材料的反射率和粘合性。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2009247067A Member of commutator for motor, and motor 有权
标题翻译：电机和电机委员会成员
公开(公告)号：JP2009247067A
公开(公告)日：2009-10-22
申请号：JP2008088642
申请日：2008-03-28
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： KOBAYASHI YOSHIAKI , SUZUKI SATOSHI
IPC分类号： H02K13/00 , H01R39/14
摘要： PROBLEM TO BE SOLVED: To provide a member of a commutator for a motor which is high in joining strength between a commutator piece and a conductor, can be suppressed in a variation of the strength, and is improved in the strength of stable and reliable spot joining.
SOLUTION: In the member of the commutator for the motor in which a membrane 3 formed of Sn or an Sn alloy at a joining part with a winding coil is formed on a base body 1 composed of Cu or a Cu alloy, the member which is improved in the strength of the spot joining is constituted in such a manner that; Ni or an Ni alloy, or Co or a Co alloy is arranged as an intermediate layer 2 in the middle of the base body 1 composed of the Cu or the Cu alloy and the membrane 3 composed of the Sn or the Sn alloy; and the thickness of the intermediate layer is 0.005 to 0.1 μm.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供换向器片和导体之间的接合强度高的电动机的换向器的构件，可以抑制强度的变化，并且提高稳定的强度可靠的现场加盟。解决方案：在由Cu或Cu合金构成的基体1上形成有由Sn或Sn合金在与卷绕线圈的接合部形成的膜3的电动机的换向器的构件中，点连接强度提高的构件构成为： Ni或Ni合金或Co或Co合金作为中间层2设置在由Cu或Cu合金构成的基体1的中间以及由Sn或Sn合金构成的膜3上; 中间层的厚度为0.005〜0.1μm。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009230930A Metallic material for connector, and method of manufacturing the same 有权
标题翻译：用于连接器的金属材料及其制造方法
公开(公告)号：JP2009230930A
公开(公告)日：2009-10-08
申请号：JP2008072545
申请日：2008-03-19
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： KITAGAWA SHUICHI , MITOSE KENGO , KOBAYASHI YOSHIAKI
IPC分类号： H01R13/03 , C25D5/12 , C25D5/50 , C25D7/00 , H01R43/16
CPC分类号： C25D5/10 , C22C1/02 , C22C9/02 , C25D5/12 , C25D5/48 , H01R13/03 , Y10T428/12389 , Y10T428/12715
摘要： PROBLEM TO BE SOLVED: To provide a metallic material for connector which has both low insertion force and connection reliability, and to provide a method of manufacturing the same. SOLUTION: The metallic material for connector uses a bar or a square wire rod formed of copper or copper alloy as a matrix and a copper tin alloy layer is formed in stripe shape in longitudinal direction of the metallic material on a part of the surface of the metallic material, and a tin layer or a tin alloy layer is formed on the rest of the surface of the metallic material. Moreover, in the manufacturing method of the metallic material for connector, a bar or a square wire rod of copper or copper alloy is used as a matrix and a tin plated layer or a tin alloy plated layer is formed on this matrix to obtain an intermediate material. Then, reflow processing of stripe shape is carried out in the longitudinal direction of the intermediate material and a copper tin alloy is exposed at a part of the surface. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低插入力和连接可靠性的连接器用金属材料，并提供其制造方法。解决方案：用于连接器的金属材料使用由铜或铜合金形成的棒或方形线材作为基体，并且铜锡合金层沿着金属材料的纵向方向形成条状，在金属材料的其余表面上形成金属材料的表面，以及锡层或锡合金层。此外，在连接器用金属材料的制造方法中，使用铜或铜合金的棒状或方棒，作为基体，在该基体上形成镀锡层或锡合金镀层，得到中间体材料。然后，在中间材料的长度方向上进行条纹状的回流处理，在表面的一部分露出铜锡合金。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009167501A Partial plating device and partial plating method 有权
标题翻译：部分镀层器件和部分镀层法
公开(公告)号：JP2009167501A
公开(公告)日：2009-07-30
申请号：JP2008009888
申请日：2008-01-18
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： WADA TETSUO , KOBAYASHI YOSHIAKI
IPC分类号： C25D5/02 , C25D7/06
摘要： PROBLEM TO BE SOLVED: To provide a partial plating device and a partial plating method which achieve partial plating to a metal strip without causing deformation in metal strip holes. SOLUTION: In the partial plating device where a long-length metal strip 11 is wound along the outer circumferential part of a cylindrical drum 110, and a plating liquid is fed via plating holes provided at the cylindrical drum, so as to plate a part of the long-length metal strip, a ring-shaped belt 12 in which ring-shaped belt holes 12a are formed at prescribed intervals in the longitudinal direction, and also, a part thereof is connected to a driving mechanism is wound around the outer circumferential part of the cylindrical drum in a state of being arranged with the long-length metal strip in parallel, and, in the wound state, a plurality of projection parts 113 provided at the outer circumferential part of the cylindrical drum are inserted into the ring-shaped belt holes. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种部分电镀装置和部分电镀方法，其在金属带状孔中不会发生变形而实现部分电镀到金属带。解决方案：在沿着圆筒形鼓110的外圆周部分卷绕长条金属带11的局部电镀装置中，并且通过设置在圆筒形滚筒上的电镀孔供给电镀液，长条状金属带的一部分，环状带12，其环状带状孔12a以长度方向规定的间隔形成，并且其一部分与驱动机构连接，圆筒形滚筒的外圆周部分处于与长条状金属条平行布置的状态，并且在卷绕状态下，设置在圆筒形滚筒的外圆周部分的多个突出部分113插入环形皮带孔。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2014164969A Method of manufacturing terminal, terminal material, terminal obtained using terminal material, method of manufacturing terminal connection structure of wire and terminal connection structure of wire, and copper or copper alloy plate material for terminal 审中-公开
标题翻译：使用端子材料制造终端，终端材料，终端的方法，制造线的终端连接结构的方法和线的终端连接结构，以及用于终端的铜或铜合金板材料
公开(公告)号：JP2014164969A
公开(公告)日：2014-09-08
申请号：JP2013034066
申请日：2013-02-24
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社 , Furukawa Automotive Systems Inc , 古河As株式会社
发明人： SUZAI KYOTA , KOBAYASHI YOSHIAKI , TACHIBANA AKIRA , MITOSE KENGO
IPC分类号： H01R43/048 , H01B5/02 , H01R4/18 , H01R4/62
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a terminal exhibiting excellent welding efficiency of laser welding, and to provide a terminal material, a terminal obtained by using the terminal material, a method of manufacturing the terminal connection structure of a wire and the terminal connection structure of a wire, and a copper or a copper alloy plate material for terminal.SOLUTION: A method of manufacturing a terminal having a tube body caulking portion being crimped to a wire includes a step for preparing a terminal material composed of a copper or a copper alloy base terminal and including a tube development part for forming the tube body caulking portion by being bent, a step for forming a tin layer or a tin alloy layer having a large number of recesses in the surface, as the outermost layer, on the tube development part so that the bottom of the recess remains in the tin layer or tin alloy layer, a step for shaping into a tube body by bending and butting the tube development part, and a step for forming the tube body caulking portion by joining the butting part by laser welding of near-infrared laser light irradiation. The steps are carried out in this order.
摘要翻译：要解决的问题：为了提供一种制造出具有优异的激光焊接焊接效率的端子的方法，并且提供端子材料，使用端子材料获得的端子，制造导线的端子连接结构的方法和导线的端子连接结构，以及用于端子的铜或铜合金板材。解决方案：一种制造端子的方法，该端子具有卷绕在线材上的管体铆接部分，包括制备由铜或铜合金基端子，并且包括用于通过弯曲形成管体铆接部的管显影部，用于形成表面上具有大量凹部的锡层或锡合金层的步骤作为最外层，在管显影部上，使得凹部的底部保留在锡层或锡合金层中，通过弯曲和对接管成形为管体的步骤显影部分，以及通过近红外激光照射的激光焊接接合对接部分而形成管体铆接部分的步骤。步骤按此顺序进行。

9. 发明专利

JP2014164936A Terminal and manufacturing method therefor 审中-公开
标题翻译：终端及其制造方法
公开(公告)号：JP2014164936A
公开(公告)日：2014-09-08
申请号：JP2013034011
申请日：2013-02-23
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社 , Furukawa Automotive Systems Inc , 古河As株式会社
发明人： TACHIBANA AKIRA , NAKATSUGAWA TATSUYA , KOBAYASHI YOSHIAKI
IPC分类号： H01R13/03 , H01R4/18 , H01R4/62 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a terminal having a tubular crimp portion which achieves enhancement of laser weldability and prevention of missing wire, and to provide a method of manufacturing the same.SOLUTION: A terminal has a tubular crimp portion 30 for crimping a wire. The tubular crimp portion 30 is composed of a metal base 1, and an Sn plating film 2 is formed at least on one side of the metal base 1 partially or entirely. The Sn plating film 2 has an arithmetic average roughness Ra, as a macro surface roughness 3, of 0.020 μm or more, and a surface roughness Sa, as a micro surface roughness 4, of 30-100 nm.
摘要翻译：要解决的问题：提供一种具有管状压接部分的端子，其实现激光焊接性的提高和防止缺失的焊丝，并提供其制造方法。解决方案：端子具有用于压接焊丝的管状压接部分30 。管状压接部30由金属基体1构成，并且部分或全部在金属基体1的至少一侧形成Sn镀膜2。 Sn镀膜2具有作为宏观表面粗糙度3的算术平均粗糙度Ra为0.020μm以上，作为微观表面粗糙度4的表面粗糙度Sa为30〜100nm。

10. 发明专利

JP2013036072A Coated composite material for moving contact part, moving contact part, switch, and method for production thereof 有权
标题翻译：用于移动接触部件的移动接触部件，开关及其制造方法的涂覆复合材料
公开(公告)号：JP2013036072A
公开(公告)日：2013-02-21
申请号：JP2011171627
申请日：2011-08-05
申请人： Furukawa Electric Co Ltd:The , 古河電気工業株式会社
发明人： SUZUKI SATOSHI , MATSUDA AKIRA , KOBAYASHI YOSHIAKI
IPC分类号： C25D7/00 , C25D5/26 , C25D5/50 , H01H1/04 , H01H11/04
摘要： PROBLEM TO BE SOLVED: To provide a silver-coated composite material for a moving contact part, in which the adhesion of a plating film is well resistant to repeated shear stress, the contact resistance remains low and stable over a long term, and the life of a switch is improved, and to provide a moving contact part.SOLUTION: In the silver-coated composite material for a moving contact part, an undercoat comprising any one of nickel, cobalt, a nickel alloy, and a cobalt alloy is formed on at least a part of the surface of a stainless steel substrate, an intermediate layer comprising copper or a copper alloy is formed thereon, and a silver or silver alloy layer as the outermost layer is formed thereon, wherein the thickness of the intermediate layer is 0.05-0.3 μm, and the average crystal grain diameter of the silver or the silver alloy formed as the outermost layer is 0.5-5.0 μm.
摘要翻译：要解决的问题：为了提供一种用于移动接触部分的银涂复合材料，其中镀膜的粘附性对反复的剪切应力具有良好的抵抗力，接触电阻长期保持低并且稳定，并且提高了开关的寿命，并提供了一个移动的接触部分。解决方案：在用于活动接触部分的银涂复合材料中，在不锈钢表面的至少一部分上形成包括镍，钴，镍合金和钴合金中的任一种的底涂层在其上形成包含铜或铜合金的中间层，并且在其上形成作为最外层的银或银合金层，其中中间层的厚度为0.05-0.3μm，平均晶粒直径为形成为最外层的银或银合金为0.5〜5.0μm。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式