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1. 发明专利

JP2004244710A Copper foil for chip on film 有权
公开(公告)号：JP2004244710A
公开(公告)日：2004-09-02
申请号：JP2003038290
申请日：2003-02-17
申请人： Furukawa Circuit Foil Kk , Furukawa Techno Research Kk , 古河サーキットフォイル株式会社 , 古河テクノリサーチ株式会社
发明人： YOSHIHARA YASUHISA , KIMIJIMA HISAO
IPC分类号： C25D5/10 , C25D3/56 , C25D7/06 , H05K3/00 , H05K3/38
CPC分类号： C25D3/562 , C25D7/0614 , H05K3/384 , H05K3/389 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , Y10T428/12028 , Y10T428/12063 , Y10T428/12438 , Y10T428/12472 , Y10T428/12493 , Y10T428/12861 , Y10T428/1291 , Y10T428/12993 , Y10T428/31663
摘要： PROBLEM TO BE SOLVED: To provide a copper foil which has a high etching factor, is superior in the linearity of the bottom line of a circuit pattern, does not leave the copper particles of the copper foil for forming the circuit pattern in a resin, can form a fine pattern, does not reduce an adhesive strength between the copper foil and a resin substrate occurring when a soldering ball is formed, is superior in visibility and suitable for mounting an IC on the fine pattern. SOLUTION: The copper foil for a Chip On Film has a roughening fine alloy-particle layer comprising a copper-cobalt-nickel alloy containing an equal amount of cobalt and nickel to or more than the amount of copper, provided on at least one surface of the copper foil. Specifically, the copper foil preferably has the roughening fine alloy-particle layer comprising copper of 5-13 mg/dm 2 -cobalt of 6-13 mg/dm 2 -nickel of 5-12 mg/dm 2 , provided on the surface to be bonded with the resin substrate of the copper foil. COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004260068A Copper foil for shielding electromagnetic wave, and electromagnetic wave shielding structure 有权
标题翻译：屏蔽电磁波铜箔和电磁波屏蔽结构
公开(公告)号：JP2004260068A
公开(公告)日：2004-09-16
申请号：JP2003050987
申请日：2003-02-27
申请人： Furukawa Circuit Foil Kk , Furukawa Techno Research Kk , 古河サーキットフォイル株式会社 , 古河テクノリサーチ株式会社
发明人： YOSHIHARA YASUHISA , KIMIJIMA HISAO
IPC分类号： H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a copper foil for shielding electromagnetic waves which is excellent in an electromagnetic wave shielding capability and is high in transmittance of the electromagnetic waves, and enjoys no powder omission, and further provide an electromagnetic wave shielding structure preferably usable for a PDP using it.
SOLUTION: The electromagnetic wave shielding is adapted such that there is provided an alloy miniaturizing/roughening particle layer comprising copper-cobalt, cobalt-nickel or copper-cobalt-nickel on at least one surface of the copper foil, and is provided a smoothing layer comprising cobalt or a cobalt-nickel alloy on the alloy miniaturizing/roughening particle layer. It is preferable to apply a rustproof processing and a silane coupling agent processing onto the smoothing layer of the copper foil for protecting the surface of the copper foil.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：解决的问题：提供一种屏蔽电磁波的铜箔，其电磁波屏蔽能力优异，电磁波的透射率高，不漏电，并且还提供电磁波屏蔽结构优选可用于使用它的PDP。解决方案：电磁波屏蔽适于在铜箔的至少一个表面上提供包含铜 - 钴，钴 - 镍或铜 - 钴 - 镍的合金小型化/粗糙化颗粒层，并且提供在合金微细化/粗糙化颗粒层上包含钴或钴 - 镍合金的平滑层。优选在铜箔的平滑层上进行防锈处理和硅烷偶联剂处理，以保护铜箔的表面。版权所有（C）2004，JPO＆NCIPI

3. 发明专利

JP2004119961A Copper foil for chip-on film, plasma display panel, and high-frequency printed wiring board 审中-公开
公开(公告)号：JP2004119961A
公开(公告)日：2004-04-15
申请号：JP2003282470
申请日：2003-07-30
申请人： Furukawa Circuit Foil Kk , Furukawa Techno Research Kk , 古河サーキットフォイル株式会社 , 古河テクノリサーチ株式会社
发明人： NAKAOKA TADAO , SUZUKI AKITOSHI , OTSUKA HIDEO , KIMIJIMA HISAO
IPC分类号： B32B15/01 , C25D7/00 , C25D7/06 , H01L21/60 , H05K3/00
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a most suitable copper foil for a chip-on-film (COF) and a high-frequency printed wiring board, an optimal copper foil for an electromagnetic shield plate of a plasma display panel (PDP), and further provide a printed wiring board, a PDP electromagnetic shield plate, and a high-frequency printed wiring board which use the copper foils.
SOLUTION: The copper foil is used for the chip-on-film, which is obtained by performing rolling on the copper foil and flattening the surface of the foil so as to have a surface area 1.30 times or smaller than the ideal smooth surface, and the plasma display panel. Alternatively the copper foil is used for the chip-on-film whose surface is smoothed so as to have a high-frequency wave, the plasma display panel, or the high-frequency printed wiring board.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2008199051A Copper foil for electromagnetic-wave shielding, and manufacturing method therefor 审中-公开
标题翻译：电磁波屏蔽铜箔及其制造方法
公开(公告)号：JP2008199051A
公开(公告)日：2008-08-28
申请号：JP2008100445
申请日：2008-04-08
申请人： Furukawa Circuit Foil Kk , 古河サーキットフォイル株式会社
发明人： YOSHIHARA YASUHISA , KIMIJIMA HISAO
IPC分类号： H05K9/00 , B32B15/01 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a copper foil for an electromagnetic-wave shielding which has superior electromagnetic-wave shielding capability and high transmittivity and from which dust is not dropped, and to provide an electromagnetic-wave shielding body suitably used for a PDP that uses the copper foil.
SOLUTION: In the copper foil for the electromagnetic-wave shielding, a fine roughened particle layer, in which a copper-alloy fine roughened particle layer consisting of the Cu alloy is laminated on a copper fine roughened particle layer composed of Cu is formed on at least one surface of the copper foil; and a smoothened layer composed of Co, Ni and In or these alloy is formed on the fine roughened particle layer. It is preferable that rustproof treatment and silane coupling-agent treatment be carried out on the smoothened layer of the copper foil, as required, and the surface of the copper foil is protected.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种具有优异的电磁波屏蔽能力和高透射率并且不会掉落灰尘的电磁波屏蔽铜箔，并且提供一种适用于电磁波屏蔽体的电磁波屏蔽体使用铜箔的PDP。解决方案：在用于电磁波屏蔽的铜箔中，将由Cu合金构成的铜合金细粗糙微粒层层压在由Cu构成的铜微细微粒子层上的细微粗糙化颗粒层是形成在铜箔的至少一个表面上; 由Co，Ni和In组成的平滑层，或者在微细的粗糙化颗粒层上形成这些合金。优选根据需要在铜箔的平滑层上进行防锈处理和硅烷偶联剂处理，并且保护铜箔的表面。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2005150155A Copper foil for electromagnetic-wave shielding, its manufacturing method and electromagnetic-wave shielding body made of copper foil 有权
标题翻译：电磁波屏蔽铜箔及其制造方法和铜箔电磁波屏蔽体
公开(公告)号：JP2005150155A
公开(公告)日：2005-06-09
申请号：JP2003381398
申请日：2003-11-11
申请人： Furukawa Circuit Foil Kk , 古河サーキットフォイル株式会社
发明人： YOSHIHARA YASUHISA , KIMIJIMA HISAO
IPC分类号： B32B15/01 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To provide a copper foil for an electromagnetic-wave shielding which has an excellent electromagnetic-wave shielding capacity and a high transmittivity and from which dust is not dropped, and to provide an electromagnetic-wave shielding body preferably used for a PDP using the copper foil.
SOLUTION: In the copper foil for the electromagnetic-wave shielding, a fine roughened particle layer composed of Cu or a Cu alloy is formed on at least one surface of the copper foil, and a smoothened layer composed of Co, Ni and In or these alloy is formed on the particle layer. The fine roughened particle layer in which a copper-alloy fine roughened particle layer consisting of the Cu alloy is laminated on the copper fine roughened particle layer composed of Cu is used as the particle layer, and it is preferable that the fine roughened particle layer is formed of a Cu-Co-Ni alloy. It is preferable that a rustproof treatment and a silane coupling-agent treatment are carried out on the smoothened layer of the copper foil as required and the surface of the copper foil is protected.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种具有优异的电磁波屏蔽能力和高透射率并且灰尘不会掉落的电磁波屏蔽的铜箔，并且优选地提供电磁波屏蔽体用于使用铜箔的PDP。解决方案：在用于电磁波屏蔽的铜箔中，在铜箔的至少一个表面上形成由Cu或Cu合金构成的细小粗糙颗粒层，并且由Co，Ni和 In或这些合金形成在颗粒层上。使用将由Cu合金构成的铜合金微细粗糙粒子层层叠在由Cu构成的铜微细化微粒层上的细微粗糙化粒子层作为粒子层，优选微小的粗糙粒子层为由Cu-Co-Ni合金形成。优选地，根据需要在铜箔的平滑层上进行防锈处理和硅烷偶联剂处理，并且铜箔的表面被保护。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2006278881A Copper foil for shielding electromagnetic wave and electromagnetic wave shielding body produced thereby 有权
标题翻译：用于屏蔽电磁波和电磁波屏蔽体的铜箔
公开(公告)号：JP2006278881A
公开(公告)日：2006-10-12
申请号：JP2005098237
申请日：2005-03-30
申请人： Furukawa Circuit Foil Kk , 古河サーキットフォイル株式会社
发明人： KIMIJIMA HISAO , NAKAOKA TADAO
IPC分类号： H05K9/00 , B32B15/01 , C25D7/06 , G09F9/00
摘要： PROBLEM TO BE SOLVED: To provide a copper foil for shielding electromagnetic wave which is excellent in electromagnetic wave shielding property and high in transmission without causing powder omission and bleeding of light, and an electromagnetic wave shielding body provided with the same on a PDP (Plasma Display Panel) and capable of being used optimally.
SOLUTION: The copper foil for shielding electromagnetic wave is provided with a black or brown processing layer consisting of Cu or alloy, on one side of a copper foil (original foil) or a copper alloy foil (original foil), and a smoothing layer consisting of Cu, Co, Ni, In or the alloy of them is provided on the black or brown processing layer if necessary.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：为了提供一种屏蔽电磁波的铜箔，其电磁波屏蔽性优异且传输率高而不会引起粉末的漏光和光的渗出，并且在其上设置有电磁波屏蔽体的电磁波屏蔽体 PDP（等离子显示面板），能够被最佳地使用。解决方案：用于屏蔽电磁波的铜箔在铜箔（原始箔）或铜合金箔（原始箔）的一面上设置有由Cu或合金构成的黑色或棕色处理层，以及如果需要，在黑色或棕色处理层上提供由Cu，Co，Ni，In组成的平滑层或它们的合金。版权所有（C）2007，JPO＆INPIT

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