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1. 发明专利

JP2004077242A Contactor, its manufacturing method, method for repairing contactor, and prober 有权
公开(公告)号：JP2004077242A
公开(公告)日：2004-03-11
申请号：JP2002236526
申请日：2002-08-14
申请人： Fujitsu Autom Ltd , Fujitsu Ltd , 富士通オートメーション株式会社 , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , FUKUDA KEISUKE , WATANABE NAOYUKI , KUMATAHARA TAKUMI , MATSUSHITA NAOHISA , IMAKADO MASAYUKI , TAMAKI KYOHEI , NOZAWA HIROSHI
IPC分类号： G01R31/26 , G01R1/067 , G01R1/07 , G01R1/073 , G01R3/00 , H01L21/66
CPC分类号： G01R1/0675 , G01R1/06733 , G01R1/07342 , G01R3/00
摘要： PROBLEM TO BE SOLVED: To provide a contactor (a probe card, a socket) capable of easily dealing with a narrow-pitch terminal or an area array terminal by employing laser beam machining.
SOLUTION: A conducting material 1A is fixedly connected with a contact substrate 2 in a standing state. A contact electrode 1 is bent by irradiating a laser beam, and formed in a prescribed shape. By changing laser irradiation condition, the contact electrode 1 can be bent to both sides, even when the laser beam is irradiated from the same direction. Accordingly, the contact electrode 1 can be deformed in an optional shape.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2007121180A Testing device test method for semiconductor device 审中-公开
标题翻译：用于半导体器件的测试器件测试方法
公开(公告)号：JP2007121180A
公开(公告)日：2007-05-17
申请号：JP2005315995
申请日：2005-10-31
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , ARISAKA GIICHI , TASHIRO KAZUHIRO , KATAYAMA TAKAYUKI , OZAWA TORU , KIMURA YUSHIN
IPC分类号： G01R1/073 , G01R31/26 , H01L21/66
CPC分类号： G01R1/0433
摘要： PROBLEM TO BE SOLVED: To provide a probe card capable of performing a testing process of a plurality of semiconductor elements (for instance, 4 elements) with same performance as that when one element is tested to a plurality of semiconductor elements formed on a semiconductor substrate; and to provide a testing method thereof.
SOLUTION: The probe card 100 has a configuration with a plurality (for instance, 4 elements) of testing units TU corresponding to the number of simultaneous electrical measurements and mounted independently to each other, of which one unit comprises a probe needle 13, arranged corresponding to semiconductor elements to be tested, a power supply conductive layer 52, connected to the probe needle 13, a ground conductive layer 51, and a signal wring layer 53.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够执行与将一个元件测试时相同性能的多个半导体元件（例如，4个元件）的测试处理的探针卡到形成在多个半导体元件上的多个半导体元件半导体衬底; 并提供其测试方法。解决方案：探针卡100具有与多个（例如4个元件）的测试单元TU相对应的配置，该测试单元TU与同时电测量的数量相对应并彼此独立地安装，其中一个单元包括探针13 ，与被测试的半导体元件相对应，连接到探针13的电源导电层52，接地导电层51和信号拧紧层53.版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005214753A Semiconductor device and its test method 审中-公开
标题翻译：半导体器件及其测试方法
公开(公告)号：JP2005214753A
公开(公告)日：2005-08-11
申请号：JP2004020734
申请日：2004-01-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TASHIRO KAZUHIRO , MARUYAMA SHIGEYUKI , OGIWARA KOJI , ARISAKA GIICHI , KUMATAHARA TAKUMI , HIRANO DAISAKU , NAKAITA HIROSHI
IPC分类号： G01R31/26 , G01R31/28 , H01L21/66
CPC分类号： H01L24/06 , H01L2224/05554 , H01L2924/14 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent generation of a contact flaw on a pad or a crack on a layer under the pad caused by pushing a probe in several times onto the pad for the test at the inspection test time, concerning a miniaturized semiconductor device. SOLUTION: A plurality of pads are provided to one external connection terminal on the semiconductor chip surface, and some of them are used as the pads for the test. Hereby, since contact positions of a probe needle in the test can be dispersed, a damage applied to a pad region can be prevented, and the semiconductor chip and this semiconductor device having high reliability can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止在检查试验时间内将探针多次推入到用于测试的焊盘上的焊盘或焊盘下面的裂纹上产生接触缺陷，关于小型化半导体器件。解决方案：将多个焊盘设置在半导体芯片表面上的一个外部连接端子上，其中一些焊盘用作测试焊盘。因此，由于测试中的探针的接触位置可以分散，所以可以防止施加到焊盘区域的损伤，并且可以提供具有高可靠性的半导体芯片和该半导体器件。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2005326222A Electrical connection method 有权
标题翻译：电气连接方法
公开(公告)号：JP2005326222A
公开(公告)日：2005-11-24
申请号：JP2004143742
申请日：2004-05-13
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , NISHINO TORU
IPC分类号： G01R31/26 , G01R1/073 , G01R31/02 , G01R31/28 , H01R33/76
CPC分类号： G01R31/2875 , G01R1/0735
摘要： PROBLEM TO BE SOLVED: To obtain reliable electrical connection with relatively small press force, and to separate a contact from a terminal regarding an electrical connection method.
SOLUTION: In the electrical connection method for bringing the contact 18 connected to an electrical circuit 14 into contact with the terminal 12 of an electronic component 10, energizing the terminal through the contact 18 for performing desired treatment, and then separating the contact from the terminal, energy is applied to the contact or the terminal, thus performing the desired treatment with the contact section of the terminal 12 to the contact 18 locally softened.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了以相对小的压力获得可靠的电连接，并且为了将电气接头与电气连接方法分开。解决方案：在将连接到电路14的触点18与电子部件10的端子12接触的电连接方法中，通过触点18对端子通电以进行所需的处理，然后将触点分离从终端，能量被施加到触点或端子，从而通过端子12的接触部分对局部软化的触点18进行所需的处理。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005116762A Method for protecting semiconductor device, cover for semiconductor device, semiconductor device unit, and packaging structure of semiconductor device 审中-公开
标题翻译：用于保护半导体器件的方法，用于半导体器件的封装，半导体器件单元和半导体器件的封装结构
公开(公告)号：JP2005116762A
公开(公告)日：2005-04-28
申请号：JP2003348796
申请日：2003-10-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TASHIRO KAZUHIRO , FUKUDA KEISUKE , KOBASHI NAOTO , MARUYAMA SHIGEYUKI
IPC分类号： G01R31/26 , H01L21/50 , H01L21/66 , H01L21/673 , H01L23/00 , H01L23/04 , H01L23/544 , H01L23/58
CPC分类号： H01L21/67333 , H01L21/50 , H01L22/20 , H01L23/04 , H01L23/544 , H01L25/0655 , H01L2223/54473 , H01L2924/0002 , H01L2924/014 , H01L2924/15311 , H01L2924/16153 , H01L2924/1616 , H01L2924/166 , Y10T29/49826 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve a reliability of a test and to securely prevent a damage of a semiconductor device in shipping package in relation to a packaging structure of a cover for semiconductor device, a semiconductor device unit, and the semiconductor device, and a method for protecting the semiconductor device. SOLUTION: An IC cover 10A is fixed to the semiconductor device 11A having an irregular surface as a semiconductor chip 14 is formed on the surface of the device. The IC cover 10A has a protrusion 21 formed so as to contact a contact-available position 16 existing within the surface of the device 11A, and a base part 20A supported on the surface by the protrusion 21 so as to detach from the surface in the fixed condition. Further, the IC cover 10A is detachable to the semiconductor device 11A. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提高测试的可靠性并且相对于用于半导体器件的盖的封装结构，半导体器件单元和半导体器件可靠地防止运输封装中的半导体器件的损坏，以及保护半导体器件的方法。解决方案：IC器件盖10A固定到具有不规则表面的半导体器件11A上，因为半导体芯片14形成在器件的表面上。 IC盖10A具有形成为与设备11A的表面内存在的可触及位置16接触的突起21以及由突起21支撑在表面上的基部20A，以便从该表面脱离固定条件。此外，IC盖10A可拆卸到半导体器件11A。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2006269404A Contactor for electronic parts and contact method 有权
标题翻译：电子部件接触器和接触方式
公开(公告)号：JP2006269404A
公开(公告)日：2006-10-05
申请号：JP2005295639
申请日：2005-10-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KOBASHI NAOTO , MARUYAMA SHIGEYUKI , ARISAKA GIICHI , MUROTANI HIROYUKI , ONO KATSUHIKO
IPC分类号： H01R13/24 , G01R1/073 , G01R31/26 , H01R33/76
CPC分类号： G01R1/0466 , G01R1/0483
摘要： PROBLEM TO BE SOLVED: To provide a contactor, and a contact method, capable of making a suitable and uniform contact with all terminals of electronic parts such as ICs. SOLUTION: The contactor for electronic parts 10 is provided with a base 12, a plurality of through-holes 12a, 12b formed in the base 12, and a plurality of contactors 11 equipped with a first contact part 11a at one end and a second contact part 11b at the other, each contained in the through hole 12a, 12b. The first contact part 11a has a concave part for housing an electrode terminal 15a of an IC 15, made movable in a horizontal direction in the through-holes 12a, 12b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够与诸如IC的电子部件的所有端子适当和均匀接触的接触器和接触方法。解决方案：电子部件10的接触器设置有基部12，形成在基部12中的多个通孔12a，12b，以及多个接触器11，其在一端配备有第一接触部11a，另一方面，第二接触部分11b包含在通孔12a，12b中。第一接触部分11a具有用于容纳IC 15的电极端子15a的凹部，该电极端子15a可在通孔12a，12b中沿水平方向移动。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005019384A Contactor for electronic part, and testing method using the same 有权
标题翻译：电子部件接触器及使用其的测试方法
公开(公告)号：JP2005019384A
公开(公告)日：2005-01-20
申请号：JP2004125850
申请日：2004-04-21
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TASHIRO KAZUHIRO , MARUYAMA SHIGEYUKI , KOIZUMI DAISUKE , KUMATAHARA TAKUMI , FUKUDA KEISUKE
IPC分类号： G01R31/26 , G01R1/04 , G01R1/06 , G01R1/067 , G01R1/073 , H01R33/76
CPC分类号： G01R1/0483 , G01R1/0441
摘要： PROBLEM TO BE SOLVED: To provide a contactor capable of easily changing sizes and shapes of contact electrodes in accordance with sizes and shapes of external terminals of an IC package to be contacted.
SOLUTION: The contactor is electrically connected to the terminals of an IC package 22. A plurality of the contact electrodes 30 are constructed so as to contact the terminals 22a of the IC package. A plurality of contact pins 23 have conductive springs 26 generating pressure for making the contact electrodes 30 press the terminals of the IC package. The contact electrode 30 can be separated from the contact pin 23, and it is possible to exchange only the contact electrode 30.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够根据要接触的IC封装的外部端子的尺寸和形状容易地改变接触电极的尺寸和形状的接触器。
解决方案：接触器电连接到IC封装22的端子。多个接触电极30构造成与IC封装的端子22a接触。多个接触销23具有产生用于使接触电极30按压IC封装的端子的压力的导电弹簧26。接触电极30可以与接触销23分离，并且仅可以更换接触电极30.版权所有：（C）2005，JPO＆NCIPI

8. 发明专利

JP2008026336A Contactor 审中-公开
标题翻译：接触器
公开(公告)号：JP2008026336A
公开(公告)日：2008-02-07
申请号：JP2007252015
申请日：2007-09-27
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , WATANABE NAOYUKI , TASHIRO KAZUHIRO , KOBASHI NAOTO , IGAWA OSAMU , FUJISAWA TETSUYA
IPC分类号： G01R1/067 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a contactor that can arrange contact electrodes by inflection needle type at a fine pitch and can be formed inexpensively.
SOLUTION: The contactor comprises a contactor substrate 11, and a plurality of contact electrodes 10 formed on the contactor substrate. Each of contact electrodes 10 is a bar-like member whose one end is joined to the contactor substrate. The other end of the contact electrode 10 has two inclined planes inclined mutually oppositely with respect to the axis of the contact electrode, and the tip formed by two inclined planes is off the center of the cross section of the bar-like member.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种接触器，其能够以细间距以弯针形式布置接触电极，并且可以廉价地形成。解决方案：接触器包括接触器基板11和形成在接触器基板上的多个接触电极10。每个接触电极10是其一端接合到接触器基板的棒状部件。接触电极10的另一端具有相对于接触电极的轴线相对地倾斜的两个倾斜面，由两个倾斜面形成的尖端偏离棒状部件的截面的中心。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006145551A Carrier for test and mounting method of semiconductor device to carrier for test 有权
标题翻译：用于测试载体的半导体器件的测试和安装方法的载体
公开(公告)号：JP2006145551A
公开(公告)日：2006-06-08
申请号：JP2005379579
申请日：2005-12-28
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MARUYAMA SHIGEYUKI , FUKAYA FUTOSHI
IPC分类号： G01R31/26
摘要： PROBLEM TO BE SOLVED: To fix a semiconductor device into a substrate for a test, without shifting the semiconductor device, in a supporting device of the semiconductor device used for a burn-in test or the like. SOLUTION: The system comprises the substrate 111 for mounting the semiconductor device 40 having a plurality of the electrode terminals 40a, the plurality of contact terminals 115 which are mounted on the substrate 111 corresponding to an arrangement pattern of the electrode terminals 40a, the plurality of the test wiring patterns connecting to the contact terminals 115 mounted on the substrate 111, and a flexible material. A supporting body 112 presses the semiconductor device 40 into the substrate 111 and covers the semiconductor device 40. An adhesive 113 bonds the supporting body 112 and the substrate 111 together. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在用于老化测试等的半导体器件的支撑装置中，将半导体器件固定在用于测试的基板中而不移动半导体器件。解决方案：该系统包括用于安装具有多个电极端子40a的半导体器件40的基板111，对应于电极端子40a的布置图案的多个接触端子115安装在基板111上，连接到安装在基板111上的接触端子115的多个测试布线图案和柔性材料。支撑体112将半导体器件40按压到衬底111中并覆盖半导体器件40.粘合剂113将支撑体112和衬底111结合在一起。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2006140294A Semiconductor substrate, and manufacturing method and test method for semiconductor apparatus 审中-公开
标题翻译：半导体基板，半导体器件的制造方法和测试方法
公开(公告)号：JP2006140294A
公开(公告)日：2006-06-01
申请号：JP2004328061
申请日：2004-11-11
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FUJII SHIGERU , ARISAKA GIICHI , IZURU HITOSHI , TASHIRO KAZUHIRO , MARUYAMA SHIGEYUKI
IPC分类号： H01L21/301
CPC分类号： H01L21/78 , H01L23/544 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To increase the number of semiconductor devices that can be arranged in one reticle region by eliminating a restriction due to a scribe line width. SOLUTION: On a semiconductor substrate 10, a plurality of semiconductor devices 12 are formed in a plurality of exposure printing regions 14. Each second scribe line 20 extending between adjacent exposure printing regions 14 is wider than each first scribe line 18 extending between adjacent semiconductor devices 12 in each exposure printing region (reticle region) 14. The first scribe line 18 is as wide as a minimum width that allows cutting of the semiconductor substrate 10. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过消除由于划线宽度引起的限制，增加可以布置在一个掩模版区域中的半导体器件的数量。解决方案：在半导体衬底10上，多个半导体器件12形成在多个曝光打印区域14中。在相邻的曝光打印区域14之间延伸的每个第二划线20比每个第一划线18之间延伸相邻的半导体器件12在每个曝光打印区域（标线片区域）14中。第一划线18与允许切割半导体衬底10的最小宽度一样宽。（C）2006，JPO＆NCIPI

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