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    • 1. 发明专利
    • Manufacturing method of semiconductor device with thin film transistor
    • 具有薄膜晶体管的半导体器件的制造方法
    • JP2014175463A
    • 2014-09-22
    • JP2013046797
    • 2013-03-08
    • Fujifilm Corp富士フイルム株式会社
    • NAKAYAMA MASAYAMOCHIZUKI FUMIHIKOTANAKA ATSUSHISUZUKI MASAYUKI
    • H01L21/336G02F1/1368H01L21/02H01L21/285H01L29/786
    • PROBLEM TO BE SOLVED: To manufacture a semiconductor device having high performance, high definition and flexibility by a batch method with high yield.SOLUTION: A semiconductor device 1 is manufactured by sequentially performing: an attachment process of attaching a flexible substrate 10 to one surface of a rigid support medium 12 via an adhesive 11; a thin film transistor element formation process of forming a thin film transistor element 20 on the flexible substrate 10; a peeling process of separating the flexible substrate 10 on which the thin film transistor element 20 is formed and the support medium 12; and an annealing process of performing annealing on the flexible substrate 10 after the peeling process at a temperature higher than a maximum temperature during the thin film transistor element formation process and the peeling process. In the thin film transistor element formation process, deposition of a gate electrode 30, a gate insulation film 40, an active layer 50, a source electrode and a drain electrode 70 is performed by a sputtering method.
    • 要解决的问题:通过间歇法以高产率制造具有高性能,高清晰度和柔性的半导体器件。解决方案:通过依次执行以下步骤制造半导体器件1:将柔性衬底10附接到一个表面的附接过程 的刚性支撑介质12; 在柔性基板10上形成薄膜晶体管元件20的薄膜晶体管元件形成工艺; 分离其上形成有薄膜晶体管元件20的柔性基板10和支撑介质12的剥离处理; 以及在薄膜晶体管元件形成处理和剥离处理期间,在高于最高温度的温度下在剥离处理之后对柔性基板10进行退火的退火处理。 在薄膜晶体管元件形成工序中,通过溅射法进行栅极30,栅极绝缘膜40,有源层50,源电极和漏极70的沉积。