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    • 1. 发明专利
    • Pattern forming method, pattern exposure method and device, and electromagnetic interference shield material
    • 图案形成方法,图案曝光方法和装置以及电磁干扰屏蔽材料
    • JP2008250313A
    • 2008-10-16
    • JP2008055830
    • 2008-03-06
    • Fujifilm Corp富士フイルム株式会社
    • AJINO SATOSHIFUJITA YOSHIHIROOKAZAKI KENTARO
    • G09F9/00H05K9/00
    • PROBLEM TO BE SOLVED: To form a pattern of a core so as not to increase thickness of plating in both end parts in a width direction of a belt-shaped work by concentration of a current to the core in these parts when electroplating a surface of the core provided on the belt-shaped work.
      SOLUTION: Laser light S radiated from a laser output device 38 is caused to scan in a direction of an arrow G by a polygon mirror 41 to expose the pattern of the core onto a photosensitive layer of a belt-shaped work 11 through a photomask 29. The laser light S during scanning start is detected by a photo diode 45, and the laser power of laser light S radiated to neighbors of both end parts in a width direction of the belt-shaped work 11 is controlled so as to be gradually reduced toward both end edges. A latent image of the pattern of the core is made gradually thin or narrow toward neighbors of both end parts or is not formed in neighbors of both end parts.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了形成芯的图案,以便在电镀时在这些部分中通过浓度到芯的电流而在带状工件的宽度方向上不增加两端部的电镀厚度 设置在带状工件上的芯的表面。 解决方案:使从激光输出装置38辐射的激光S通过多面镜41沿箭头G的方向扫描,以将芯的图案暴露在带状工件11的感光层上,通过 扫描开始期间的激光S由光电二极管45检测,并且辐射到带状工件11的宽度方向上的两个端部的相邻部分的激光的激光功率S被控制为 逐渐减小到两端边缘。 芯的图案的潜像对于两个端部的相邻部分逐渐变薄或变窄,或者不形成在两个端部的邻近部分中。 版权所有(C)2009,JPO&INPIT
    • 2. 发明专利
    • Transparent conductive film, and forming method of transparent conductive film
    • 透明导电膜和透明导电膜的形成方法
    • JP2009205812A
    • 2009-09-10
    • JP2008043956
    • 2008-02-26
    • Fujifilm Corp富士フイルム株式会社
    • FUJITA YOSHIHIRONISHIMURA NAOYA
    • H01B5/14B32B15/04H01B13/00
    • PROBLEM TO BE SOLVED: To form a transparent conductive film capable of carrying out electroless plating treatment in a short time, and reducing a defect caused by an adhesion failure of an electroless plated layer continuously by a simple process and inexpensively even in the case of a lengthy transparent conductive film. SOLUTION: This has a printing process of pattern-forming a second printed layer by printing a metal compound containing paste for printing on an ink receiving layer of a transparent base body, a reduction treatment process of forming metal from the upper face successively to the side face of the second printed layer by carrying out reduction treatment to the second printed layer, a substitute plating process of adhering catalyst metal from the upper face successively to the side face of the second printed layer by carrying out the substitute plating process to the second printed layer that has finished the reduction treatment, and an electroless plating process of forming the electroless plated layer on the catalyst metal adhered on the second printed layer by carrying out the electroless plating treatment. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了形成能够在短时间内进行化学镀处理的透明导电膜,并且通过简单的工艺连续地减少由化学镀层的粘附破坏引起的缺陷,并且即使在 长透明导电膜的情况。 解决方案:具有通过在透明基体的油墨接收层上印刷含有金属化合物的浆料以进行印刷的图案形成第二印刷层的印刷方法,从上表面依次形成金属的还原处理工艺 通过对所述第二印刷层进行还原处理而将所述第二印刷层的侧面附着到所述第二印刷层的侧面,所述替代电镀工艺通过进行所述替代电镀工艺将催化剂金属从所述上表面依次附着到所述第二印刷层的侧面 完成了还原处理的第二印刷层,以及通过进行无电镀处理,在附着在第二印刷层上的催化剂金属上形成化学镀层的化学镀处理。 版权所有(C)2009,JPO&INPIT