会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明专利
    • NiP PLATED ALUMINUM ALLOY SUBSTRATE FOR MAGNETIC DISK
    • 用于磁盘的NiP镀铝合金基板
    • JP2003272130A
    • 2003-09-26
    • JP2002078107
    • 2002-03-20
    • Kobe Steel Ltd株式会社神戸製鋼所
    • KATO YOSHINORIFUJIMOTO HIDEOOKAMOTO HITOSHI
    • C23C18/52C22C21/06G11B5/73G11B5/738
    • PROBLEM TO BE SOLVED: To provide a NiP plated aluminum alloy substrate for a magnetic disk wherein fine undulation does not occur on the surface of a NiP plated film and the surface having high flatness and high smoothness can be obtained even when a magnetic film is deposited by increasing the temperature of a substrate for enhancing magnetic characteristics and higher recording density can be realized. SOLUTION: A Zn layer, a Cu layer and the NiP plated film are successively formed on the surface of an aluminum alloy substrate and the Cu layer has 0.2 to 4 g/m 2 deposit. The Cu layer is formed by a nonelectrolytic plating method. The aluminum alloy substrate contains 2.0 to 6.0% by mass of Mg and 0.01 to 0.2% by mass of Cr and further contains at least one selected from the group consisting of Cu and Zn so that 3[Cu]+[Zn]=0.2 to 1.5% by mass is satisfied, when the contents of Cu and Zn are defined as [Cu] and [Zn], respectively, and the balance Al and inevitable impurities. COPYRIGHT: (C)2003,JPO
    • 要解决的问题:为了提供一种用于磁盘的NiP镀铝合金基板,其中在NiP镀膜的表面上不会发生细微波动,并且即使当磁性材料具有高平坦度和高平滑度的表面时,也可以获得 通过增加用于增强磁特性的基板的温度来沉积膜,并且可以实现更高的记录密度。 解决方案:在铝合金基板的表面上依次形成Zn层,Cu层和NiP镀膜,Cu层的厚度为0.2〜4g / m 2。 Cu层通过非电解电镀法形成。 铝合金基板含有2.0〜6.0质量%的Mg和0.01〜0.2质量%的Cr,并且还含有选自Cu和Zn中的至少一种,使得3 [Cu] + [Zn] = 0.2〜 当Cu和Zn的含量分别被定义为[Cu]和[Zn],余量为Al和不可避免的杂质时,满足1.5质量%。 版权所有(C)2003,JPO
    • 5. 发明专利
    • SPACER FOR HARD DISK
    • JP2001319444A
    • 2001-11-16
    • JP2000135730
    • 2000-05-09
    • KOBE STEEL LTD
    • UEDA HIROKIFUJIMOTO HIDEOUMEDA HIDETOSHI
    • G11B23/00
    • PROBLEM TO BE SOLVED: To provide a spacer for hard disk which is simple in structure, little in reduction of performance due to temperature rise in rotation, and excellent in fitting precision, little in the surface shake of a substrate in rotation and capable of reducing an out-of-plane vibration effectively. SOLUTION: The spacer consists of an intermediate layer 2 and a surface part 3 insert-holding the layer 2 mutually in the state of layers to form a ring shape. The layer 2 is formed of a thermally stable resin member and is insert- held by the part 3 (3a and 3b) consisting of electrically conductive members. The electrically conductive members are selected from material of a young's modulus higher than that of the thermally stable resin and joined to each other through a joining part 4. The part 4 is jointed to the other one with its projecting part projecting at an outer peripheral part and an inner peripheral part from one of the part 3. The spacer is interposed between a disk and a spindle surrounding the spindle in a ring form.
    • 9. 发明专利
    • PRETREATMENT IN POLISHING OF ALUMINUM SUBSTRATE FOR HDD
    • JPH0963048A
    • 1997-03-07
    • JP20962595
    • 1995-08-17
    • KOBE STEEL LTD
    • HAYASHI YUICHIFUJIMOTO HIDEO
    • G11B5/84
    • PROBLEM TO BE SOLVED: To accelerate the substrate working (polishing) speed of a blank, to improve the productivity of the substrate and to decrease the margins for polishing of an Ni-P plating film after Ni-P plating by limiting a phosphoric acid bath before polishing, the temp. of a mixed acid bath, the concn. of phosphoric acid, the concn. of nitric acid, the concn. of the total acids and immersion time. SOLUTION: The aluminum substrate (blank) for HDD is immersed for 10 to 180 seconds in the phosphoric acid bath of 3 to 30wt.% phosphoric acid concn. at 30 to 80 deg.C or the mixed acid bath (total acid concn.: 5 to 40wt.%) contg. 3 to 30wt.% phosphoric acid concn. and 2 to 30% nitric acid concn. at 30 to 80 deg.C prior to polishing. The oxidized film layer of the blank is thus removed by one time of the immersion stage without the occurrence of overetching of the surface. As a result, the polishing speed of the blank is accelerated, the productivity of the substrate is improved and the margins for polishing of the Ni-P plating film after the Ni-P plating on the substrate are decreased.