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1. 发明专利

JPH05206201A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH05206201A
公开(公告)日：1993-08-13
申请号：JP3853792
申请日：1992-01-28
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01L21/60
摘要： PURPOSE:To improve bonding workability and durability of a chip carrier, by arranging a theremally conductive penetration post which penetrates a flexible film part, on the rear side of an inner lead part of metal wiring. CONSTITUTION:Metal wiring 1 is radially arranged in four directions in the manner in which inner lead parts la are positioned inside and outer lead parts 1b are positioned outside. The inner lead parts 1a are bonded to bumps 7 of a semiconductor chip 6, and the outer lead parts 1b are connected with a lead frame, terminal parts of an external circuit board, etc. Coating and exposure of cyclized isoprene rubber are repeated on the surface of a compound tape on which surface metal wiring 1 is formed and on the surface of a flexible tape 2, thereby forming through holes, sprocket holes 5, and outer lead holes 1b. After the wall surface of the through hole is subjected to conduction treatment, the hole is filled by electroplating, and a penetration post 8 is formed. At the time of bonding, a tool is made to abut against the penetration post 8, heat and pressure are applied, and the bump of the chip 6 is bonded to the inner lead part 1a. Sufficient finger strength can be obtained and the metal wiring can be made fine.

2. 发明专利

JPH06203659A MANUFACTURE OF TAPE WIRE FOR HIGH FREQUENCY 失效
公开(公告)号：JPH06203659A
公开(公告)日：1994-07-22
申请号：JP25073692
申请日：1992-08-25
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01B7/08 , H01B13/00 , H05K1/02 , H05K3/00 , H05K3/46
摘要： PURPOSE:To easily provide a tape wire for high frequency enhanced in density by etching a metal foil layer and an insulator layer provided on a base, and opposing a plurality of the resulting bases to each other followed by integration. CONSTITUTION:The one-side metal foil layer 31 of a base 1 with double metal foil is etched to form a conductor circuit 21. The exposed insulator layer is etched to a desired depth to form a groove part 23. A base with double metal foil having a circuit substantially having the negative-positive relation with this circuit formed on one side is formed. These two bases are stuck and integrated together by use of an adhesive 4 with the conductor circuit 21 surfaces being mutually opposed. Thus, the thickness of the insulator layer can be optionally regulated.

3. 发明专利

JPH0574865A MANUFACTURE OF TAPE CARRIER 失效
公开(公告)号：JPH0574865A
公开(公告)日：1993-03-26
申请号：JP25862791
申请日：1991-09-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a sprocket hole from clogging due to falling of a resist into the sprocket hole or prevent the sprocket hole from expanding during a manufacturing process of a tape carrier, by providing an auxiliary sprocket hole outside the width of a normal tape carrier. CONSTITUTION:Auxiliary sprocket holes 18 are perforated within an auxiliary region (u) at the opposite ends of a composite tape with a continuous press punching machine, using a material tape having a width (t) longer than the width (s) of a tape employed as a normal tape carrier. The auxiliary sprocket holes 18 are used for a rough alignment for positioning when a normal sprocket hole and the other necessary elements formed by using the hole as a reference mark are provided. Since the sprocket hole can be prevented from clogging due to falling of a resist into the sprocket hole, thus, a good and productive application of the resist can be performed.

4. 发明专利

JPH0574864A MANUFACTURE OF TAPE CARRIER 失效
公开(公告)号：JPH0574864A
公开(公告)日：1993-03-26
申请号：JP25862691
申请日：1991-09-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To minimize a dimensional error in placement of a sprocket hole itself or a dimensional error between the sprocket holes, by providing an auxiliary sprocket hole having a diameter shorter than one of a normal sprocket hole at a predetermined region before forming the normal sprocket hole. CONSTITUTION:Auxiliary sprocket holes 8 are perforated on both ends of a copper foil tape longitudinally at a given interval with a continuous press punching machine. This is done so that a resist layer is not formed at a position of a normal sprocket hole (a predetermined region 205 of the sprocket hole) and a metal wiring pattern region 203. Then, the predetermined region 205 of the sprocket hole is formed so that the auxiliary sprocket hole 8 is surrounded. For a dimensional error of manufacture of a tape carrier, thus, accuracy can be improved remarkably as compared with a conventional method.

5. 发明专利

JPH0669644A METHOD OF MANUFACTURING LAMINATED MATERIAL FOR CIRCUIT BOARD 失效
公开(公告)号：JPH0669644A
公开(公告)日：1994-03-11
申请号：JP23633592
申请日：1992-08-13
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H05K3/16 , H05K3/38
摘要： PURPOSE:To realize a method of manufacturing a laminated material for a circuit board which can provided sufficient adhesion strength between a high polymer material layer and a metallic layer and in which an interlayer separation is not caused by various treatments and processings in manufacturing the circuit board. CONSTITUTION:After a low temperature plasma processing is performed on the high polymer material surface such as polyimide, etc., the high polymer material is soaked into a solvent, an aqueous solution, or the like (for example, an interface activator solvent in which soda pyro-sulfite is added to an anion group interface activator such as alkylbenzene sulfonic acid soda etc., degreasing agent such as an alkali group aqueous solution, etc., comprising sodium hydroxide, sodium carbonate, soda orthosilicic acid, interface activator or the like) to remove degenerated matter caused near the high polymer material layer surface when the plasma processing is performed. Thereafter, a metallic layer is provided on the high polymer material layer to obtain a laminated material for a circuit board.

6. 发明专利

JPH05200574A MANUFACTURE OF INSULATING SUBSTRATE WITH BOTH SURFACE CONDUCTOR LAYERS HAVING THROUGH HOLE 失效
公开(公告)号：JPH05200574A
公开(公告)日：1993-08-10
申请号：JP3854092
申请日：1992-01-28
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI , OGIWARA YOSHIAKI
IPC分类号： B23K26/382 , H05K3/00 , H05K3/42
摘要： PURPOSE:To provide the method which can easily manufacture the insulating substrate with both surface conductor layers having the through hole without needing both surface exposure and the troublesome positioning. CONSTITUTION:At the time forming a through hole piercing through an insulating substrate that conductor layers are formed on both surfaces of an insulation, the thickness of the 1st conductor layer formed at one side surface of the insulating substrate is preliminarily made different from the thickness of the 2nd conductor layer formed at the other side surface, a non-formed part of conductor layer is arranged at the prescribed place at the thicker side among these conductor layers, the laser beam irradiates to the area including this conductor layer non-formed part, the insulating layer of non-formed part and the thinner side conductor layer of the under layer are removed at the same time and the through hole is formed.

7. 发明专利

JPH0574872A METHOD OF MANUFACTURING CHIP CARRIER 失效
公开(公告)号：JPH0574872A
公开(公告)日：1993-03-26
申请号：JP25862491
申请日：1991-09-11
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： SEKI OSAMU , OTANI KENICHI , MUGISHIMA TOSHIO
IPC分类号： H01L21/60 , H01L23/50
摘要： PURPOSE:To contrive to simplify a process and to improve producibility and reduce manufacturing cost when a metallic layer and an insulating film are respectively patterned to manufacture a chip carrier. CONSTITUTION:On both surfaces of two-layer master roll on which a metallic foil layer and a plastic film are directly laminated, a solvent developing resist (for example, a cyclized isoprene rubber group resist) having resistance against strong-alkali is applied and dried. Next, metallic foil and plastic film surfaces are respectively exposed to light with predetermined patterns, and developed in the same process using developing liquid such as xylene or the like. Thereafter, the plastic film is etched (an outer lead hole 3, a device hole 4) with etching liquid such as a potassium hydroxide aqueous solution or the like, and successively the metallic foil layer is etched (a circuit pattern 1) with a ferric chloride aqueous solution or the like. Thereafter, the resist on the both sides is processed with separation liquid such as dichlormethane or the like and separated.

8. 发明专利

JPH06236905A TAPE CARRIER 失效
公开(公告)号：JPH06236905A
公开(公告)日：1994-08-23
申请号：JP4177093
申请日：1993-02-08
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60 , H05K1/00 , H05K3/00
摘要： PURPOSE:To provide a tape carrier, which can withstand the tension at carriage of a tape by sprocket without particular rise in product cost, using a flexible carrier tape consisting of a film or a material low in tensile strength. CONSTITUTION:This is a tape carrier on which a metallic wiring layer 13 and a resin insulating layer 14 for electric insulation, for plating resist, or for solder resist are formed on an electric insulating flexible tape 10, and sprocket holes 12 at specified pitches are formed in the longitudinal direction at both sides of the tape 10. One part of the insulating layer is left in a band shape in longitudinal direction on both sides of the tape 10, as a band-shaped reinforcing layer 15 including the sprocket holes 12 within its width.

9. 发明专利

JPH0629353A MANUFACTURE OF FILM CHIP CARRIER 失效
公开(公告)号：JPH0629353A
公开(公告)日：1994-02-04
申请号：JP2960393
申请日：1993-01-27
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： C08J5/18 , H01L21/60
摘要： PURPOSE:To simplify a manufacturing step of a film chip carrier and improve a productivity and reduce a manufacturing cost, by forming first and second parts through one chemical etching under a condition in which a double-layer resist layer is formed. CONSTITUTION:When a through hole 14 and a thin part 15 are formed on a flexible film member 1, a first resist layer 3 having an insolubility or impermeability to an etching solution is formed on a region other than a forming region of the through hole 14 and the thin part 15. Then, a second resist layer 4 having a solubility or permeability to the etching solution is formed on the thin forming region 15. By treating one chemical etching under condition, the through hole 14 and the thin part 15 are simultaneously formed. Therefore, since a film etching treatment can be performed by the one chemical etching treatment, redundant steps such as drying curing and peeling of a resist are omitted as compared with the case of treating the etching in each separate step conventionally.

10. 发明专利

JPH06334335A THROUGH HOLE PLATING METHOD 失效
公开(公告)号：JPH06334335A
公开(公告)日：1994-12-02
申请号：JP14673493
申请日：1993-05-27
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKITSUTO FOIL KK
发明人： MUGISHIMA TOSHIO , OTANI KENICHI , SEKI OSAMU
IPC分类号： H01L21/60 , H05K3/14 , H05K3/40
摘要： PURPOSE:To enable applying a continuous through plating method to the manufacture of a continuous length double-sided TAB carrier tape, by forming evaporation layer of conductive material on the inner surface of a through hole and the surface of an insulating layer, by physical evaporation treatment. CONSTITUTION:A circular aperture part 17c is formed by etching. and eliminating a through hole forming part of a metal conductor layer 17a by photolithography for a double-sided tape. The metal conductor layer 17a is used as a mask, and a through hole 14 is formed by etching an insulator layer 16. Conductor layers 17a and 17b on the surface and the rear are all etched and eliminated, and the whole surface of the insulator layer 16 is exposed. After washing and drying, both surfaces of the insulator layer 16 and the inner wall surface of the through hole are all coverd with a copper film. By electrolytic plating on the copper film, metal conductor layers 12a, 12b on the surface and the rear and a conductor layer 10 on the inner wall surface of the through hole are formed. A specified circuit pattern is formed by using a dry film 19 as resist.

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