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1. 发明专利

JPH03255690A HEAT PIPE BURIED CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH03255690A
公开(公告)日：1991-11-14
申请号：JP24864490
申请日：1990-09-20
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： YAMAMOTO MASAAKI , KOBAYASHI KENZO , SOTANI JIYUNJI , NODA HAJIME
IPC分类号： H05K7/20 , H05K1/02 , H05K3/00
摘要： PURPOSE:To improve a circuit board in thermal conductivity to the heat absorbing part of a heat pipe and to make the circuit board thin by a method wherein the heat absorbing part of the heat pipe is formed flat. CONSTITUTION:A circuit board 11 is provided with circuit patterns 12 and 26 formed on both the sides of a board 18, and a heat absorbing part 17a of a heat pipe formed so flat as to be provided with a plane in parallel with the plane of the board 18 is buried inside an insulating board 16. The heat pipe 17 is formed circular in cross section before it is buried and previously annealed. The heat absorbing part 17a of the heat pipe 17 is inserted into a recess 28 provided to an insulating board 22, and a cladding piece is laminated on both the upside and the underside of the inserted heat absorbing part 17a respectively, which is thermocompressed by a hot press to make the heat absorbing part 17a of the heat pipe flat and as thick as the insulating board 22, adhesive material sheets are fused, and all are bonded into an integral structure.

2. 发明专利

JPH01310587A ELECTRONIC CIRCUIT UNIT PROVIDED WITH PLANE ANTENNA 失效
公开(公告)号：JPH01310587A
公开(公告)日：1989-12-14
申请号：JP14045188
申请日：1988-06-09
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： KOBAYASHI KENZO , SHIROISHI HIROKAZU , NISHIBASHI ATSUSHI , SUGAWARA HIDEO , ASHIDA HIDEO
IPC分类号： H05K1/02 , H01Q1/24 , H01Q1/38 , H01Q23/00 , H04B1/08 , H05K5/00
摘要： PURPOSE:To decrease components in number and a unit in cost by a method wherein a dielectric layer of a plane antenna and a case which houses a circuit substrate are formed into one piece. CONSTITUTION:A circuit substrate 15 is provided, where a circuit pattern 17 mounted with an electronic component 19 is provided to one side of an insulating plate 16 and an earth layer 18 is provided to the other side, and an antenna pattern 13 is electrically connected with the circuit pattern 17 through a lead pin 14. And, in this electronic circuit unit provided with a plane antenna, a dielectric layer between the antenna pattern 13 and the earth layer 18 and a case 22 which houses the circuit substrate 15 are molded into one piece. By these processes, components can be decreased in number and a unit of high dimensional accuracy can be obtained.

3. 发明专利

JPH01230289A ELECTRONIC CIRCUIT UNIT 失效
公开(公告)号：JPH01230289A
公开(公告)日：1989-09-13
申请号：JP9809688
申请日：1988-04-22
申请人： FURUKAWA ELECTRIC CO LTD , FUJITSU LTD
发明人： KOBAYASHI KENZO , YATABE HIROSHI , SHIROISHI HIROKAZU , NISHIBASHI ATSUSHI , YABE NORIO
IPC分类号： H05K3/28 , H05K1/00 , H05K1/18 , H05K3/30 , H05K3/46
摘要： PURPOSE:To increase mounting density, by mounting surface mounting type parts on one surface, molding and forming resin, mounting insertion mounting type parts by inserting them into through holes from above the resin, and mounting surface mounting type parts on the other surface. CONSTITUTION:Circuit patterns 16, 17 are formed on both surfaces of an insulating film 15. Through holes 18 are formed at positions where insertion mounting type parts are mounted. Solder resist 20, 21 is printed on both surfaces in the manner in which pat parts 19 are left at parts of mounting positions. Firstly, the surface mounting type parts 13A, 13B are mounted, and a resin substrate 12 is formed on the surface. In the substrate 12, lead inserting holes 24 are formed at positions corresponding with the through holes 18. This hole 24 sets a pin on a metal mold to mold and form the substrate 12. A surface mounting type parts 13C is mounted on the other surface of a circuit film 11. An insertion mounting type parts are mounted by inserting lead parts 14' of the insertion mounting type parts 14 into the lead inserting holes 24 and the through holes 18 from the substrate 12.

4. 发明专利

JPH06310888A HEAT DISSIPATING TYPE CIRCUIT BOARD 失效
公开(公告)号：JPH06310888A
公开(公告)日：1994-11-04
申请号：JP12032893
申请日：1993-04-26
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , KOBAYASHI KENZO , TANAKA SUEMI , SOTANI JIYUNJI
IPC分类号： H05K1/02 , H05K1/05 , H05K7/20
摘要： PURPOSE:To enable double-sided board mounting in a low heat-resistant component region, by a method wherein the heat absorption region of a radiation plate is bonded to the heat generating component mounting region of a printed wiring board, a radiation fin is fixed to the heat generating region of the radiation plate, and a heat pipe is buried in the radiation plate. CONSTITUTION:A heat generating component mounting region 5a where heat generating parts are mounted and a low heat-resistant component mounting region 5b where low heat-resistant component 15 whose heat resistance is lower than the heat generating component 11 are mounted are formed in a printed circuit board 5. A heat absorbing region 3a of a radiation plate 3 is bonded to the heat generating component mounting region 5a, and a radiation region 3b of the radiation plate 3 is positioned outside the printed circuit board 5. A radiation fin 17 is fixed to the radiation region 3b, and a heat pipe 19 is buried in the radiation plate 3 so as to connect the heat absorbing region 3a with the radiation region 3b. Since the radiation plate 3 is not present in the low heat-resistant component mounting region 5b, the low heat-resistant parts 15 is not damaged, and high density mounting of parts is enabled.

5. 发明专利

JPH06309546A FLUORESCENCE DETECTOR 失效
公开(公告)号：JPH06309546A
公开(公告)日：1994-11-04
申请号：JP12352693
申请日：1993-04-27
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI TAKAO , SAKAI KATSUTOSHI , KOBAYASHI KENZO
IPC分类号： G06K7/12 , G06T1/00 , G07D7/00 , G07D7/12 , G07D7/20 , G06F15/64
摘要： PURPOSE:To miniaturize a device, to easily align an optical system, and to suppress an influence of shake for carrying of an object to be detected as much as possible. CONSTITUTION:A single prismatic glass block 4 which does not display a fluorescent color by ultraviolet rays is used in the optical system. The glass block 4 is provided with an incidence face 5 through which exciting light is transmitted, a reflection and exit face 6 which reflects exciting light but allows the fluorescence generated from a fluorescent material of an object 1 to be detected to pass through, and a detection face 7 facing the object 1 to be detected, and exciting light reflected by the reflection and exit face 6 is transmitted through this detection face 7 and is thrown to the object 1 to be detected, and the fluorescence generated from the fluorescent material of the object 1 to be detected can be transmitted through this detection face 7. The incidence face 5 is provided with the filter function which intercepts light in visible region components of exciting light and allows only the ultraviolet area to pass through. A filter 10 which intercapts light in visible region components of exciting light and allows only the ultraviolet area to pass through is arranged on the exciting light source side of the incidence face 5.

6. 发明专利

JPH06267602A POWER DEVICE MOUNTED CIRCUIT SUBSTRATE 失效
公开(公告)号：JPH06267602A
公开(公告)日：1994-09-22
申请号：JP7501893
申请日：1993-03-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： KOBAYASHI KENZO , YAMAMOTO MASAAKI , YATABE HIROSHI
IPC分类号： H01L23/32 , H05K3/00 , H01R9/09 , H01R23/68
摘要： PURPOSE:To simplify the mounting of a power device, and to obtain the power device mounting condition with high reliability by inserting an output terminal and an input terminal of a power device into a circuit substrate collectively for connection. CONSTITUTION:A pin terminal 9 as an output terminal and a tab terminal 11 as an input terminal are stood respectively on the surface of a power device 3 opposite to a circuit substrate 1. On the other hand, various parts 13 are mounted on the substrate 1 before mounting the power device 3. At the time of mounting the device 3, a connector 15 for output terminal and a connector 17 for input terminal are mounted on the substrate 1 simultaneously. The connector 15 is formed by incorporating an cylindrical terminal 21 into a housing 19, and the connector 17 is formed by incorporating a Faston terminal 33 into a housing 31. Mounting of the power device 3 is facilitated with the insertion of the terminal 9 into the terminal 21 and the insertion of the terminal 11 into the terminal 33 by mounting the part 13 and the connectors 15, 17 on the substrate 1 and standing the terminals 9, 11 on the device 3 previously.

7. 发明专利

JPH06196882A PRINTED CIRCUIT BOARD WITH HEAT SINK 失效
公开(公告)号：JPH06196882A
公开(公告)日：1994-07-15
申请号：JP35723992
申请日：1992-12-24
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , YAMAMORI KAZUYUKI , HAMADA HIROKI , KOBAYASHI KENZO
IPC分类号： H05K1/02 , H05K7/20
摘要： PURPOSE:To provide a printed circuit board of improved cooling efficiency by using a heat sink on which cooling fins are arranged near the printed circuit board. CONSTITUTION:A printed circuit board 5 is bonded integrally with a heat sink 3 made of an aluminum or copper plate, and cooing fins 21 are provided near the printed circuit board on the heat sink. The fins, bent rectangular pieces of aluminum, are laid preferably in two layers. The bonding between the fins and between the fins and the heat sink is carried out by aluminum brazing. In manufacture of this printed circuit board 1 with a heat sink, the fins are first brazed to the heat sink, and then the printed circuit board is attached to the heat sink using a prepreg of low flow type.

8. 发明专利

JPH06181397A HEAT PIPE SYSTEM COOLING DEVICE FOR CIRCUIT BOARD 失效
公开(公告)号：JPH06181397A
公开(公告)日：1994-06-28
申请号：JP35366092
申请日：1992-12-14
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , YAMAMORI KAZUYUKI , KOBAYASHI KENZO
IPC分类号： F28D15/02 , H05K7/20
摘要： PURPOSE:To make thin the plate thickness of a circuit board to be mounted with a heating component, such as a semiconductor element, as well as to make possible removal of a heat pipe and to make it possible to maintain the expected cooling efficiency of a heat pipe system cooling device. CONSTITUTION:A heat pipe system cooling device for a circuit board is provided in such a way as to connect the flat part of a heat pipe 17 to a heat dissipation plate 19 on the upper part of a substrate 18 having a circuit pattern 12 on its surface by a terminal 20.

9. 发明专利

JPH05198900A HIGH FREQUENCY LARGE CURRENT CIRCUIT BOARD 失效
公开(公告)号：JPH05198900A
公开(公告)日：1993-08-06
申请号：JP3127292
申请日：1992-01-23
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , SAKAI KATSUTOSHI , KOBAYASHI KENZO , YATABE HIROSHI
IPC分类号： H05K1/02 , H05K3/20
摘要： PURPOSE:To restrain heat generation when a high frequency current is made to flow in a thick-walled circuit conductor, by forming slits in the same direction as current flow in the thick-walled circuit conductor of large current circuit board constituted by integrally forming, in a unified body, the thick-walled circuit conductor for a large current and an insulating board. CONSTITUTION:A large current circuit board is constituted by integrally forming, in a unified body, a thick-walled circuit conductor 13 for a large current which constitutes a power supply circuit and the like, and a thin-walled circuit conductor 15 for a fine current which constitutes a signal circuit and the like, on the surface of an insulating board 11 composed of glass epoxy, paper phenol, etc. A plurality of slits 19 are formed in the same direction as current flow in the thick-walled circuit conductor 13. Said slits are formed by press punching or etching work, and preferably by water jet cutting work. Thereby the surface area of the thick-walled circuit conductor 15 is enlarged, and the effective resistance for a high frequency current can be reduced, so that heat generation when the high frequency current is made to flow can be restrained.

10. 发明专利

JPH05162078A CUTTING METHOD FOR MEMBER TO BE CUT 失效
公开(公告)号：JPH05162078A
公开(公告)日：1993-06-29
申请号：JP32604191
申请日：1991-12-10
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAMOTO MASAAKI , YAMAMORI KAZUYUKI , KOBAYASHI KENZO
IPC分类号： B24C9/00 , B26F3/00
摘要： PURPOSE:To accurately perform cutting work of a plurality of piled metallic thin plates by utilizing water jet, so as to prevent deformation of a cut pattern. CONSTITUTION:In a cutting method for members to be cut by water jet cutting by which metallic thin plates 10 are cut by jet-injecting high pressure water mixed with abrasives from an injection nozzle 13 to the metallic thin plates, a presser jig having a pressing member 21 to press the circumference of the cutting part of the metallic thin plates to be cut is provided, the jig is interlocked with the injection nozzle 13 to be moved on the metallic thin plates 10, and after pressing the metallic thin plates 10 with the pressing member 21, high pressure water is jet-injected from the injection nozzle 13 so as to cut the prescribed cutting part of the metallic thin plates 10.

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