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1. 发明专利

JP2002217979A CLAD TEST SYSTEM 失效
公开(公告)号：JP2002217979A
公开(公告)日：2002-08-02
申请号：JP2001015453
申请日：2001-01-24
申请人： FUJITSU LTD , NIPPON TELEGRAPH & TELEPHONE , NTT COMM KK
发明人： KOYANAGI TOSHINORI , IDE SHOTARO , SUKEGAWA AYA , WATANABE JUNJI , AOKI HIROATSU , UCHIDA KAZUHIRO , RYU KAZUYA , YOSHIDA YUKIHIRO , KAMATA KATSUJI
IPC分类号： H04L12/70 , H04L12/66 , H04L29/14 , H04L12/56
摘要： PROBLEM TO BE SOLVED: To provide a reliable network having no non-test section, where related to a CLAD test system, a test function interlocked with a CLAD part is realized, which is combined with conventional STM and ATM transfer methods, in a device and network having an STM-ATM conversion function. SOLUTION: In a system, where an ATM device 1 is connected to an STM device 2 via an STM-ATM conversion device 3 for transferring information, at least a test means 30 for testing inside a CLAD part 20 is provided in the STM-ATM conversion device 3.

2. 发明专利

JP2574474B2 失效
公开(公告)号：JP2574474B2
公开(公告)日：1997-01-22
申请号：JP20700589
申请日：1989-08-11
申请人： FUJITSU LTD
发明人： AOKI HIROATSU , KINOSHITA YOSHINORI
IPC分类号： G02B6/32 , G02B6/42 , G02B7/02

3. 发明专利

JPH0555609A OPTICAL MODULE 失效
公开(公告)号：JPH0555609A
公开(公告)日：1993-03-05
申请号：JP21864391
申请日：1991-08-29
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： G02B6/42 , H01L31/02 , H01L31/12 , H01L33/58 , H01L33/64 , H01S5/022
摘要： PURPOSE:To improve long-term reliability by reducing the fluctuation of the optical output after mounting, concerning the optical module used for optical communication system. CONSTITUTION:An optical module 1 is provided where main optical parts such as a light emitting element 4, a condensing lens 6, etc., are provided on a stem 2 and are sealed, a recess 15 is made in the mounting face of the stem 2 in the case of mounting the optical module 1 on a printed board.

4. 发明专利

JPH10190141A OPTICAL SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH10190141A
公开(公告)日：1998-07-21
申请号：JP34203596
申请日：1996-12-20
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： H01L23/36 , G02B6/42 , H01L23/373 , H01L33/48 , H01S5/00 , H01S3/18 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To prevent the deformation of the optical systemholding section of a frame which is formed adjacently to a cooling device and an optical semiconductor device on a heat sink by a strain at the time of assembling an optical semiconductor module by continuously and integrally forming the section of the same material as that of the heat sink. SOLUTION: A mount carrier 33 which carries a laser diode 34, a photodiode 35, and an optical system 36 is formed in a tightly adhering state on a Peltier cooler 32 which is stuck to the upper surface of the heat sink 31 of an optical semiconductor module 30. In addition, a frame 37 is formed on the heat sink 31 so as to surround the Peltier cooler 32 and the laser diode 34, photodiode 35, and optical system 36 formed on the cooler 32 and an optical window element 38 which carries an optical window 38A in a state where the window is matched to the optical axis of a lens 36A is provided through the frame 37. The frame 37 is integrally formed with the heat sink 31 of the same material. Therefore, the occurrence of such a trouble that the optical system 36 on the frame 37 is deviated from the optical axis of the lens 36A due to a strain caused by welding can be eliminated.

5. 发明专利

JPH01183129A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01183129A
公开(公告)日：1989-07-20
申请号：JP685288
申请日：1988-01-18
申请人： FUJITSU LTD
发明人： SANO YOSHIAKI , AOKI HIROATSU
IPC分类号： H01L21/60 , H01L23/28
摘要： PURPOSE:To prevent a wire from touching a wire chip fixing portion by a method wherein a short wire which does not hang down easily by nature pushes up a long wire which easily hangs down, to control the hanging amount of the long wire. CONSTITUTION:There is a semiconductor device in which a chip fixing portion 7 and a lead frame 8 are on the same plane, a semiconductor chip 2 having a plural number of pads to be connected via a wire to the same lead frame is fixed on a chip fixing portion 7, and respective pads are electrically connected to the same lead frame via different wires and sealed with resin. In this semiconductor device, wires are composed so that a long wire 11 crosses over a short wire 12. Therefore, the long wire 11 which easily hangs down is pushed up by the short wire 12 which does not easily hang down by nature to control the hanging amount of the long wire 11. This prevents an unnecessary contact of the load frame with the chip firing portion even if the lead frame is plane.

6. 发明专利

JPH05241050A 失效
公开(公告)号：JPH05241050A
公开(公告)日：1993-09-21
申请号：JP4486092
申请日：1992-03-02
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： G02B6/32 , G02B6/42 , H01L33/58 , H01L33/00
摘要： PURPOSE:To provide an optical semiconductor module constituted by welding and coupling a module main body and an optical fiber through an optical lens, where deviation to an optical direction is not caused at the time of welding respective optical parts and high coupling efficiency is realized. CONSTITUTION:A laser beam L outputted from the module main body 7 is condensed by the optical lens 9 housed in a lens holder 8, and inputted to the tip of the optical fiber 11. The tip of the optical fiber 11 is fixed on a metallic piece 12, which is welded at the side part of a slit 10b formed on a holder 10 and fixed in the holder 10.

7. 发明专利

JPH05329673A LASER WELDING METHOD AND OPTICAL SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH05329673A
公开(公告)日：1993-12-14
申请号：JP14187892
申请日：1992-06-03
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： B23K26/21 , H01L33/00 , H01L33/58 , H01S5/00 , B23K26/00 , H01S3/18
摘要： PURPOSE:To avoid deterioration in optimum optical coupling such as the deviation of an optical axis in laser welding between members composing an optical semiconductor module. CONSTITUTION:At the time of fitting a member with a small outer dimension into a member with a large outer dimension and welding them together by a laser beam, by tapering the surface in the proximity of the welding part of the member with a large outer dimension, the tensile force that is actuated on both the members at the time of welding is reduced. In the optical semiconductor module, by tapering the tip end part of the side panels in 15A and 15B of a lens holder guide 15, a force D to draw in a lens holder 14 into the lens holder guide 15 is reduced. In like manner, by tapering the end part of an optical fiber guide, the force by which the optical fiber holder is drawn in the optical fiber guide is reduced, as the optical fiber guide is pulled and a space is caused between the guide and the lens holder in the case where the optical fiber holder is fixed by a chuck. Thus, the optimum optical coupling is maintained by avoiding deteriorations including the deviation in the optical axis among a light emitting element, lens and optical fiber.

8. 发明专利

JPH04223415A OPTICAL MODULE 失效
公开(公告)号：JPH04223415A
公开(公告)日：1992-08-13
申请号：JP40700390
申请日：1990-12-26
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： G02B6/32 , G02B6/42 , H01L33/58
摘要： PURPOSE:To easily fix a lens to a substrate, to avoid misalignment of the optical axes and to improve the reliability of an optical module to be used for an optical communication system. CONSTITUTION:A holder guide 11 is welded onto a substrate 2, a holder guide 5 for holding a lens 4 is welded to the guide 11 to constitute an optical module 10, and projecting connections 12a-12d or 14a and 14b are formed on both sides of the guide 11.

9. 发明专利

JPH02139506A OPTICAL MODULE 失效
公开(公告)号：JPH02139506A
公开(公告)日：1990-05-29
申请号：JP20700589
申请日：1989-08-11
申请人： FUJITSU LTD
发明人： AOKI HIROATSU , KINOSHITA YOSHINORI
IPC分类号： G02B6/32 , G02B6/42 , G02B7/02
摘要： PURPOSE:To eliminate the accidental displacement and shifting of a lens after adjustment by inserting a cylindrical holder which supports the lens into an annular lens holder guide fixed to a substrate and fixing the guide and holder after the adjustment. CONSTITUTION:The lens 24 is inserted into the insertion hole 23 of the lens holder 20 and fixed by inward pressing or soldering. The upper part 21 of the lens holder guide 21 which guides this lens 20 is formed annularly. When the lens 24 is adjusted, the holder 20 is fitted in the holder guide 21 and adjusted vertically and horizontally in the guide, and light from a light emitting element 26 is entered into an optical fiber 27 to adjust the lens. The holder guide 21 is laser-welded 33 to the substrate 25 after the adjustment and after the position of the holder 20 is confirmed, the holder is laser-welded 33 to an upper holder guide 21. Consequently, there is no gap between the guide 21 and substrate 25 and the lens is not displaced accidentally even in various environmental tests such as a temperature test.

10. 发明专利

JPH0282207A PRODUCTION OF LIGHT EMITTING ELEMENT CONNECTOR 失效
公开(公告)号：JPH0282207A
公开(公告)日：1990-03-22
申请号：JP23358188
申请日：1988-09-20
申请人： FUJITSU LTD
发明人： AOKI HIROATSU
IPC分类号： G02B6/42
摘要： PURPOSE:To enhance welding joint strength without increasing laser output and to decrease welding points by forming recesses to respective joint parts and irradiating the recesses with a laser, thereby welding the joint parts. CONSTITUTION:The V-shaped recesses 5 are formed to the peripheral part at the top end of a laser releasing end 11 and the peripheral part of the joint surfaces of the joint part 2a of the laser releasing end 11 and a lens holder 2. The joint part 2a of the lens holder 2 is thereafter superposed on the laser releasing end 11. The recesses 5 are thereafter formed similarly to the peripheral part of the respective joint parts. These recesses 5 are irradiated with the laser. Since the surface area of the joint part subjected to the irradiation of the layer is widened in this way, the joint strength is improved. The strength to torsion and bend in particular is increased.

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