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1. 发明专利

JPH07152043A LIQUID CRYSTAL DISPLAY PANEL AND METHOD FOR PACKAGING TO THIS PANEL 失效
公开(公告)号：JPH07152043A
公开(公告)日：1995-06-16
申请号：JP29921893
申请日：1993-11-30
申请人： FUJITSU LTD
发明人： MARUYAMA YOSHIAKI , MAJIMA NIWAJI , ANDO SHIZUHITO , SUKETA TOSHIAKI , KASAHARA SHINICHI
IPC分类号： G02F1/1345
摘要： PURPOSE:To easily take a countermeasure against static electricity through panel process stages and an LSI chip packaging stage even if the liquid crystal display panel deals with COG packaging and LSI chips for driving liquid crystals are packaged on all the sides thereof. CONSTITUTION:Signal wirings 1b extending outward from the display region of the liquid crystal display panel 1 of the liquid crystal display panel formed by directly packaging the LSI pair chips 2 for driving liquid crystals on the liquid crystal display panel 1 are further extended outward from electrodes 1c facing the output terminals of the LSI pair chips 2 for driving liquid crystals and are all connected to common patterns 1d formed to pass the lower parts of the packaging parts of the LSI pair chips 2 for driving liquid crystals along the outer periphery of the panel. In addition, the parts 1e between the electrodes 1c and the common patterns 1d are cut.

2. 发明专利

JPH05297397A 失效
公开(公告)号：JPH05297397A
公开(公告)日：1993-11-12
申请号：JP11705992
申请日：1992-05-11
申请人： FUJITSU LTD
发明人： KASAHARA SHINICHI , SUKETA TOSHIAKI , MARUYAMA YOSHIAKI , WATANABE HIROMICHI , HINOBORI EIJI , MATSUNAGA AKIFUMI , YUDA TAKASHI , SAKATA TOSHIO , IMAI SATORU , KUROIWA KENICHI , KOBAYASHI HIROAKI
IPC分类号： G02F1/1345 , G02F1/1362 , H05K3/22
摘要： PURPOSE:To improve the operability and reliability by eliminating the need for wire bonding and also eliminating the need for bonding pads for repair. CONSTITUTION:Chips 11 for repair are mounted at the right end part and left end part of a bus conductor 3a which is formed on a transparent substrate 1 and cut halfway by using an adhesive 15. The chips 11 have conductor bumps 13 projected on the reverse surfaces of insulating plates 12, conductor layers 14 are provided on the top surfaces of the insulating plates 12, and the bumps 13 conduct to conductor layers 14. The bumps 13 abut on the electric conductor 3a and the conductor layers 14 of a couple of chips 11 are connected by conductors 16 which by-pass the display area of the transparent substrate 1. Wiring films 19 for repair are joined with the right end part and left end part of the electric conductors 3a on the transparent substrate 1. Wiring patterns 20 are formed on the reverse surfaces of a couple of films 19, the internal ends of the patterns 20 are connected to the electric conductors 3a, and the external edges of the wiring patterns 20 are connected by the conductors 16 which by-pass the display area of the transparent substrate 1.

3. 发明专利

JPH04130636A CHIP BONDING DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04130636A
公开(公告)日：1992-05-01
申请号：JP25250190
申请日：1990-09-20
申请人： FUJITSU LTD
发明人： IMAI SATORU , HIRANO SHIGEKAZU , KITAZAWA YASUTOSHI , SUKETA TOSHIAKI , MARUYAMA YOSHIAKI
IPC分类号： H01L21/60 , H01L21/52
摘要： PURPOSE:To reduce the quantity of an adhering adhesive and prevent the dislocation of a chip to bond it with accuracy in positioning by providing the chip with an adhesive layer, and pressing the adhesive layer after positioning it while making it abut on a substrate. CONSTITUTION:An adhesive supplier 3 advances right below a chip holding means 5, which is holding a substrate 1. The means 5 falls right above the supplier 3, and the surface of a chip 4 is soaked in an adhesive 31, and it rises, and the surface of the chip 4 is coated with an adhesive layer 32. Then, the adhesive supplier 3 retreats. The substrate supporting table 2 retreats so that the region, where the chip 4 is mounted, of the substrate 1 may come right below the means 5. The means 5 falls, and it stops at the position where the surface of a layer 32 abuts on the specified position of the substrate 1. While detecting the position with a position detector 6, the table 2 is inched so that the substrate 1 may be positioned in the specified place. The means 5 falls vertically, and presses the bump 41 of the chip 4 so as to bond it. When the vacuum suction of the chip 4 is relieved and the means are elevated, the chip 4 is placed on the substrate 1 through the adhesive layer 32.

4. 发明专利

JPH0381231B2 失效
公开(公告)号：JPH0381231B2
公开(公告)日：1991-12-27
申请号：JP8284986
申请日：1986-04-10
申请人： FUJITSU LTD
发明人： SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08

5. 发明专利

JPH0215949B2 失效
公开(公告)号：JPH0215949B2
公开(公告)日：1990-04-13
申请号：JP9610284
申请日：1984-05-14
申请人： FUJITSU LTD
发明人： KAMISHIRO KOEI , SUKETA TOSHIAKI , IMAI SATORU , TAKAI SHIGERU , MAEKAWA HARUMI
IPC分类号： G11C11/14 , G11C19/08

6. 发明专利

JPS6357880B2 失效
公开(公告)号：JPS6357880B2
公开(公告)日：1988-11-14
申请号：JP7039884
申请日：1984-04-09
申请人： FUJITSU LTD
发明人： IMAI SATORU , SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08

7. 发明专利

JPS62114188A MAGNETIC BUBBLE MEMORY DEVICE 失效
公开(公告)号：JPS62114188A
公开(公告)日：1987-05-25
申请号：JP25400585
申请日：1985-11-13
申请人： FUJITSU LTD
发明人： KASAHARA SHINICHI , SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08
摘要： PURPOSE:To reduce noise and to improve S/N by using a multilayer substrate to make the area of sense wiring that connects a detector and a differential amplifier nearly equal to the area of dummy wiring. CONSTITUTION:A ceramic multilayer substrate 11 is constituted of three layers of ceramic having a conductor pattern, and a pattern is formed on the surface conductor layer 12 and circuit connected to the third conductor layer 14 through a contact hole 13. The second layer is used as an earth layer 15. The area of sense wiring connecting a detector and a differential amplifier is made nearly equal to the adjusted area of dummy wiring extended through the hole 13. Accordingly, noise is canceled and lowered, and S/N of the magnetic bubble memory device is improved.

8. 发明专利

JPS6160510B2 失效
公开(公告)号：JPS6160510B2
公开(公告)日：1986-12-20
申请号：JP15487882
申请日：1982-09-06
申请人： FUJITSU LTD
发明人： IMAI SATORU , SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08

9. 发明专利

JPS6160505B2 失效
公开(公告)号：JPS6160505B2
公开(公告)日：1986-12-20
申请号：JP16282779
申请日：1979-12-17
申请人： FUJITSU LTD
发明人： SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08

10. 发明专利

JPS59217285A Magnetic bubble memory device 失效
标题翻译：磁性气泡存储器件
公开(公告)号：JPS59217285A
公开(公告)日：1984-12-07
申请号：JP9020483
申请日：1983-05-23
申请人： Fujitsu Ltd
发明人： SUKETA TOSHIAKI
IPC分类号： G11C11/14 , G11C19/08
CPC分类号： G11C11/14
摘要： PURPOSE:To obtain the structure of a bubble memory device which uses a plane coil and is suitable to mass-production by adhering an insulating substrate where a magnetic bubble memory chip and the plane coil are packaged and a metallic plate which has a permanent magnet together, and storing them in a shield case. CONSTITUTION:A bonding pad is provided to a step part 11 at the circumferential part of the square hole 10 in the ceramic substrate 9, and the pad is connected to a lead terminal 8 by multilayered wiring. The top surface of a conductor plate formed by aluminum die casting is plated with copper 14 for producing the video effect of the plane coil, and a magnetism adjusting plate 16 and the permanent magnet 17 are fitted in the recessed part 15 on the reverse surface side. Namely, the recessed part 15 is formed by die casting in the impression direction of a hold magnetic field. The ceramic substrate 9 and conductor plate 13 are sealed airtightly. The upper part of the square hole 10 is sealed by deposition after a chip 19 is attached. The plane coil is inserted into the recessed part in the top surface of the substrate 9, a copper plate 25 having a square hole 24 is inserted thereupon, and a ferrite plate 26 is fitted in the square hole 24. Then, the substrate 9, etc., are united together and stored in the shield case 27.
摘要翻译：目的：为了获得使用平面线圈的气泡存储装置的结构，并且适合于通过粘合绝缘基板（其中包含磁性气泡存储芯片和平面线圈）以及具有永磁体的金属板并将其存储在屏蔽盒中。构成：在陶瓷基板9的方孔10的周向部分的台阶部11设置接合焊盘，焊盘通过多层布线与引线端子8连接。由铝压铸件形成的导体板的顶表面镀有用于产生平面线圈的视频效果的铜14，并且磁调节板16和永磁体17装配在反面侧的凹部15中。也就是说，凹部15通过在保持磁场的压印方向上的压铸而形成。将陶瓷基板9和导体板13密封地密封。在连接芯片19之后，方孔10的上部被沉积物密封。将平面线圈插入到基板9的上表面的凹部中，在其上插入具有方孔24的铜板25，将铁素体板26嵌合在方孔24中。然后，结合在一起并存储在屏蔽壳体27中。

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