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    • 1. 发明专利
    • STRUCTURE OF ELECTRONIC EQUIPMENT HOUSING SHELF
    • JPH01199498A
    • 1989-08-10
    • JP2289688
    • 1988-02-04
    • FUJITSU LTD
    • YAMAGATA TOSHIOOKAMOTO ITSUOOKA AKIRA
    • H05K7/14
    • PURPOSE:To decrease components in numbers and make a printed board guide rail excellent in a positional accuracy with ease by a method wherein an extrusion molded piece provided with many rail grooves previously formed inside is cut off into two or more frame members, which are arranged in parallel with each other at a certain space between them, and an upper and a lower cover and a left right side board are fixed to two or more frame members. CONSTITUTION:A extrusion molded piece 20 with many rail grooves 10a previously formed inside it is cut off perpendicularly to the rail grooves 10a into two or more frame members 10-12, which are arranged in parallel with each other at a certain distance between them, and an upper and a lower covers 15 and 16 and a left and right side boards 13 and 14 are fixed to two or more parallel frame members 10-12. For instance, the extrusion molded piece 20 is pipe-shaped and nearly rectangular in section, which is cut off into the rectangular frames 20a. And, when the molded piece 20 is molded using aluminum or the like, many parallel rail grooves 10a are provided inside an upper and a lower frame respectively corresponding to each other at an extrusion molding. And, many air vent holes 15a and 15b are provided to the upper and the lower covers 15 and 16, and mounting metal pieces 13a which assemble a shelf to a perpendicular frame are fixed to the left and the right side boards 13 and 14.
    • 3. 发明专利
    • HEAT DISSIPATION FIN STRUCTURE WITH BUILT-IN MICRO-HEAT-PIPE
    • JPS6367760A
    • 1988-03-26
    • JP21074286
    • 1986-09-09
    • FUJITSU LTD
    • YAMAGATA TOSHIOOKAMOTO ITSUO
    • F28D15/02H01L23/427H05K7/20
    • PURPOSE:To achieve highly efficient heat dissipation by a method wherein a heat-pipe is composed of a part which is in contact with the upper surface of an electronic device and a part which penetrates the body of a heat dissipation fin main part is built in the heat dissipation fin main part which is composed of a plurality of plate- shape fin parts provided with certain intervals and the body which links the fin parts. CONSTITUTION:The lower part of a micro heat-pipe 20 is formed into a flat spiral 21 and warped upward from the center of the spiral. If the micro heat-pipe 20 is inserted into a heat dissipation fin main part 10, the lower spiral part 21 is fitted in the opening 14 of the heat dissipation fin main part 10 and the part 22 extended upward penetrates through the hole 15 of the body 13 of the heat dissipation fin main part 10. As the spiral part 21 is directly in contact with the upper surface of an electronic device 1, it receives the heat from the electronic device 1 and the liquid in the spiral part 21 is vaporized and quickly transferred to the upper part 22. As the upper part 22 is close to fin parts 11, the part 22 is always cooled and the vaporized liquid is condensed and transferred to the lower spiral part 21 through capillaries by gravity. By repeating this cycle, highly efficient heat dissipation can be achived in a short period.