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1. 发明专利

JP2013131561A Radiator, lamination type electronic device, and electronic equipment 有权
标题翻译：散热器，层压型电子设备和电子设备
公开(公告)号：JP2013131561A
公开(公告)日：2013-07-04
申请号：JP2011278755
申请日：2011-12-20
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKADA AKIRA , KANEZAKI KATSUMI , MIYAZAKI TAKEHIDE
IPC分类号： H01L23/40 , H01L23/36 , H01L23/467 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To improve a heat radiation effect of a radiator for cooling a semiconductor device.SOLUTION: A heat conductive plate part 152 of a radiator 150 effectively radiates heat because it is wide in a contact area contacting with air, that is, a heat radiation area. In addition, since a coupling part 164 is formed in a bellows-like shape to make a plate-like part 166 function as a cooling fin, the coupling part 164 is wide in the contact area contacting with air, that is, the heat radiation area, and thus, effectively radiates heat.
摘要翻译：要解决的问题：提高用于冷却半导体器件的散热器的散热效果。散热器150的导热板部分152由于在与空气接触的接触区域中宽而有效地散热，散热区域。此外，由于联接部164形成为波纹管状，以使板状部166作为冷却翅片起作用，所以联接部164在与空气接触的接触面积较宽，即热辐射面积，从而有效地散热。

2. 发明专利

JP2009231757A Radiation member and circuit substrate device 有权
标题翻译：辐射元件和电路基板器件
公开(公告)号：JP2009231757A
公开(公告)日：2009-10-08
申请号：JP2008078454
申请日：2008-03-25
申请人： Fujitsu Ltd , 富士通株式会社
发明人： OKADA AKIRA , IMABAYASHI HIROBUMI , YAJIMA HIDEAKI , KANEZAKI KATSUMI , MIYAZAKI TAKEHIDE , NISHIDA KAZUYA
IPC分类号： H01L23/36 , H01L25/00 , H05K7/20
CPC分类号： H01L23/433 , F28F2013/005 , F28F2255/02 , H01L2924/0002 , H05K1/144 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To cool efficiently each heating element which is easily fitted between each circuit substrate located in opposition to each other and is mounted on each circuit substrate. SOLUTION: A first heat transfer board 110 transfers a heat from one surface 111, with which a heating element or a heat transfer component transferring a heat from a heating element contacts, to another surface 112. A second heat transfer board 120 transfers a heat from one surface 121, with which a heating element or a heat transfer component transferring a heat from a heating element contacts, to another surface 122. The first heat transfer board 110 and second heat transfer board 120 are located so as to have a space 140 between the surface 111 and 121 against each other. An elastic radiation fin 130 is positioned, sandwiched between the surfaces 111 and 121. The elastic radiation fin 130 has an elasticity in an opposite direction of the first heat transfer board 110 and second heat transfer board 120 and radiates each heat of the surface 111 and surface 121. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了有效地冷却容易安装在彼此相对的每个电路基板之间并且安装在每个电路基板上的每个加热元件。解决方案：第一传热板110将来自一个表面111的热量传递到另一表面112，第一传热板120将来自加热元件的热传递的加热元件或传热部件接触的热量传递到另一个表面112.第二传热板120传送来自一个表面121的热量，加热元件或将热量从加热元件传递到其中的传热部件接触到另一个表面122.第一传热板110和第二传热板120定位成具有表面111和121之间的空间140彼此相对。弹性散热片130被定位在夹在表面111和121之间。弹性散热片130具有与第一传热板110和第二传热板120相反的方向的弹性，并辐射表面111和表面121.版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2005236008A Capacitor sheet 有权
标题翻译：电容表
公开(公告)号：JP2005236008A
公开(公告)日：2005-09-02
申请号：JP2004042877
申请日：2004-02-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KANEZAKI KATSUMI , IMABAYASHI HIROBUMI , MIYAZAKI TAKEHIDE , OKADA AKIRA
IPC分类号： H01G2/06 , H01G4/228 , H01G4/252 , H01G4/35 , H01G4/38 , H01L21/60 , H01L23/12 , H01L23/32 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/16
CPC分类号： H01G4/35 , H01L23/49827 , H01L23/50 , H01L24/81 , H01L2224/16 , H01L2224/81801 , H01L2224/82 , H01L2224/85 , H01L2224/86 , H01L2924/01078 , H01L2924/14 , H01L2924/15311 , H01L2924/19103 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H05K1/0219 , H05K1/0231 , H05K1/162 , H05K2201/10378 , H05K2201/10734 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a capacitor sheet that can flexibly give a capacitance even when a plurality of power sources exist. SOLUTION: In the capacitor sheet, the signal/power supply electrodes of two circuit boards are connected to each other through hole electrodes 2 and a plurality of first capacitor blocks 10 provided with ground electrodes 3 around the through hole electrodes 2 with dielectrics 1 in between is provided. In addition, the ground electrodes of the circuit boards are connected to each other through the through hole electrodes 2 and the ground electrodes 3 are provided around the through hole electrodes 2 with dielectrics 1 in between. At the same time, the sections between the electrodes 2 and 3 are constituted of a plurality of second capacitor blocks 11 connected through a patterned wiring, and the capacitor blocks 10 and 11 are arranged so that the ground electrodes 3 of the first capacitor blocks 10 may be connected electrically to the ground electrodes 3 of the second capacitor blocks 11 and integrally coupled with each other. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使当存在多个电源时，也可以提供能够灵活地赋予电容的电容器片。解决方案：在电容器片中，两个电路板的信号/电源电极通过孔电极2和多个第一电容器块10彼此连接，第一电容器块10设置有具有电介质的通孔电极2的接地电极3 1之间提供。此外，电路板的接地电极通过通孔电极2彼此连接，并且接地电极3设置在通孔电极2的周围，电介质1在其间。同时，电极2和3之间的部分由通过图案化布线连接的多个第二电容器块11构成，电容器块10和11被布置成使得第一电容器块10的接地电极3 可以与第二电容器块11的接地电极3电连接并且彼此一体地耦合。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2004319678A Fingerprint sensor apparatus and its manufacturing method 审中-公开
公开(公告)号：JP2004319678A
公开(公告)日：2004-11-11
申请号：JP2003110144
申请日：2003-04-15
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SAKOTA EIJI , OKADA AKIRA
IPC分类号： H01L23/28 , G06T1/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a fingerprint sensor apparatus wherein the wire bonding of a semiconductor chip which extracts a fingerprint and a bonding pad on a substrate is enabled easily, and a method for manufacturing the apparatus.
SOLUTION: The fingerprint sensor apparatus is provided with the substrate 10, the bonding pad 11 formed on the substrate 10, a first semiconductor chip 16 wherein the opposite surface of a circuit forming surface is fixed on one main surface of the substrate 10, a second semiconductor chip 19 wherein the opposite surface of a circuit forming surface is fixed on the first semiconductor chip 16, a first bonding wire 22 which electrically connects a first electrode 17 and the bonding pad 11, a second bonding wire 23 which electrically connects the first electrode 17 and a second electrode 20, and sealing resin 24 in which an aperture 24a is formed from which a fingerprint sensor 21 is exposed. When viewing from above, the substrate 10 is greater by an amount W which is an attaching margin to an apparatus to be mounted than that of the sealing resin 24.
COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JPH11345897A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11345897A
公开(公告)日：1999-12-14
申请号：JP15283398
申请日：1998-06-02
申请人： FUJITSU LTD
发明人： OKADA AKIRA , KUBOTA YOSHIHIRO , ABE MITSUO
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To prevent bleeding of a die attaching material from reaching bonding leads for grounding. SOLUTION: This device is provided with a substrate 12, a semiconductor element which is attached to the substrate 12 through dice attaching material, thermal vias 30 and 30a, bonding leads 24 and 24a for a signal and for grounding, a wire which extends between the semiconductor element and the bonding leads 24 and 24a, a loop plating bonding part 32, which is provided in a loop shape on the substrate 12 between the semiconductor element and the bonding leads 24a and which is bonded with the bonding leads 24 and 24a for the ground and a plating leading wire 34, which bonds at least one of the thermal vias 30a with the plating bonding part 32, and the plating leading wire 34 is bonded with only the thermal via 30a located at the corner of the semiconductor element.

6. 发明专利

JPH0637211A SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0637211A
公开(公告)日：1994-02-10
申请号：JP18849392
申请日：1992-07-16
申请人： FUJITSU LTD
发明人： HIRAIWA KATSURO , ASADA KENJI , KANWA MASARU , OKADA AKIRA , SATO KENICHI , YAMAGUCHI TOSHIKI
IPC分类号： H01L21/56 , H01L23/28
摘要： PURPOSE:To prevent generation of void on a bonding wire, and also to prevent generation of disconnection of a bonding wire by the stress added by resin by a method wherein grooves, which are directing toward outside from a recessed part, are provided on one or more places on the circumference of a recessed part where a chip is mounted keeping sway from the part where a lead wiring will be provided. CONSTITUTION:A semiconductor chip 7 is mounted and bonded in a recessed part using an adhesive bonding material 8, and the bonding and 9 on the semiconductor chip and the wire bonding region 5 of lead wire are connected by a bonding wire 10. Subsequently, liquefied sealing resin 11 is poured in the groove 12 at the corner of the semiconductor chip 7 and the recessed part 3, a dam 6 is filled up, and the resin is solidified by heating. At this time, as the liquefied resin 11 is made to flow in the lower part of the bonding wire 10, the space under the bonding wire 10 is filled with the liquefied resin before a film is formed by the resin flowing from above the chip on the bonding wire. As a result, the air in that part is dispersed to the upper part, and it is not left as a void.

7. 发明专利

JPS63292633A ASSEMBLING METHOD FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63292633A
公开(公告)日：1988-11-29
申请号：JP12941087
申请日：1987-05-25
申请人： FUJITSU LTD
发明人： OKADA AKIRA , HIRAIWA KATSURO
IPC分类号： H01L21/68 , H01L21/52 , H01L27/14
摘要： PURPOSE:To assemble a semiconductor device accurately by placing a semiconductor element with a pattern face disposed downside in a semiconductor element positioning means provided on an assembling jig, coating the rear face of the element with an adhesive, and then covering the jig with the semiconductor package to fixedly bond the element. CONSTITUTION:An accurately formed semiconductor element recess 1a is formed on an assembling jig 1, and a semiconductor element 2 is placed in said recess 1a with a pattern face disposed downside. Then, the rear face of the element 2 is coated by a screen printing method with a conductive adhesive 3. Subsequently, a semiconductor package 4 made of ceramics is placed on the jig 1 along the guide 1b of the jig 1. Eventually, when the package 4 is raised and inverted upside down, the element 2 is accurately assembled at a predetermined position of the package 4 with the adhesive 3.

8. 发明专利

JPS57103395A PRINTED BOARD CONTAINING MECHANISM 失效
公开(公告)号：JPS57103395A
公开(公告)日：1982-06-26
申请号：JP17979880
申请日：1980-12-19
申请人： FUJITSU LTD
发明人： IOZAWA TOORU , OKADA AKIRA , FUKUZAKI TOSHIO , TANI SHIROU
IPC分类号： H05K7/14 , H05K7/18

9. 发明专利

JPS5793597A MECHANISM FOR FLEXIBLY MOUNTING PART 失效
公开(公告)号：JPS5793597A
公开(公告)日：1982-06-10
申请号：JP17035680
申请日：1980-12-03
申请人： FUJITSU LTD
发明人： TANI SHIROU , OKADA AKIRA , IOZAWA TOORU , FUKUZAKI TOSHIO
IPC分类号： H05K7/12 , H05K7/18

10. 发明专利

JPS575297A FLUORESCENT LAMP CONTROL SYSTEM FOR INDICATOR 失效
公开(公告)号：JPS575297A
公开(公告)日：1982-01-12
申请号：JP7871580
申请日：1980-06-11
申请人： FUJITSU LTD
发明人： IOZAWA TOORU , KUDOU YUKIO , TAKEDA TAKASHI , SAKAMOTO KATSUNORI , OKADA AKIRA
IPC分类号： H05B41/36 , H05B41/34

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