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1. 发明专利

JP2518839B2 失效
公开(公告)号：JP2518839B2
公开(公告)日：1996-07-31
申请号：JP6414887
申请日：1987-03-20
申请人： FUJITSU LTD
发明人： YOKOYAMA HIROZO , OMOTE KOJI , TSUKADA MINEHARU , SUZUKI HITOSHI , OGAWA HIROMI , KAMEHARA NOBUO , NIWA KOICHI
IPC分类号： H01B1/22 , H01B1/00 , H05K1/09

2. 发明专利

JPH0571537B2 失效
公开(公告)号：JPH0571537B2
公开(公告)日：1993-10-07
申请号：JP32489089
申请日：1989-12-16
申请人： FUJITSU LTD
发明人： IMANAKA YOSHIHIKO , OGAWA HIROMI , TSUKADA MINEHARU , UDAGAWA ETSURO , KURIHARA KAZUAKI , YOKOYAMA HIROZO , KAMEHARA NOBUO
IPC分类号： C04B35/632 , C04B35/00 , H05K1/03

3. 发明专利

JPH0451059B2 失效
公开(公告)号：JPH0451059B2
公开(公告)日：1992-08-18
申请号：JP10038984
申请日：1984-05-21
申请人： FUJITSU LTD
发明人： YOKOCHI KISHIO , KAMEHARA NOBUO , YOKOYAMA HIROZO , OGAWA HIROMI , KURIHARA KAZUAKI , IMANAKA YOSHIHIKO , NIWA KOICHI
IPC分类号： C04B35/581 , H01L21/48 , H01L23/15 , H05K1/03

4. 发明专利

JPH0337758B2 失效
公开(公告)号：JPH0337758B2
公开(公告)日：1991-06-06
申请号：JP9469184
申请日：1984-05-14
申请人： FUJITSU LTD
发明人： KAMEHARA NOBUO , IMANAKA YOSHIHIKO , KURIHARA KAZUAKI , YOKOCHI KISHIO , OGAWA HIROMI , YOKOYAMA HIROZO , NIWA KOICHI
IPC分类号： H01L21/52 , H01L21/58 , H01L23/15 , H01L23/50 , H05K1/00 , H05K1/03 , H05K3/46

5. 发明专利

JPH0240013B2 失效
公开(公告)号：JPH0240013B2
公开(公告)日：1990-09-10
申请号：JP27453484
申请日：1984-12-28
申请人： FUJITSU LTD
发明人： IMANAKA YOSHIHIKO , OGAWA HIROMI , TSUKADA MINEHARU , UDAGAWA ETSURO , KURIHARA KAZUAKI , YOKOYAMA HIROZO , KAMEHARA NOBUO
IPC分类号： C04B35/622 , C04B35/632 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/46

6. 发明专利

JPH02181495A MANUFACTURE OF SUPERCONDUCTING CIRCUIT BOARD 失效
公开(公告)号：JPH02181495A
公开(公告)日：1990-07-16
申请号：JP157189
申请日：1989-01-06
申请人： FUJITSU LTD
发明人： YOKOYAMA HIROZO , YAMANAKA KAZUNORI , OGAWA HIROMI , SUZUKI HITOSHI
IPC分类号： H05K3/40 , H01B12/06 , H01B13/00 , H01L39/24
摘要： PURPOSE:To obtain a superconducting device based on an alumina substrate by a method wherein after the alumina substrate provided with a through hole for via use is dipped into a buffer layer formation material, the substrate is fired, powder of a superconductive composition is filled in the through hole and wiring patterns are respectively formed on both surfaces of the substrate. CONSTITUTION:A green sheet is punched to perforate (A) and thereafter, the sheet is fired to form an alumina substrate 2 and after being dipped into a fluid buffer layer formation material, the substrate is fired to film-form (B) a buffer layer 3 on the substrate including a through hole 1. Then, superconductive ceramic powder 4 is cast in the hole 1 with the layer provided in it to fill (C) the hole. Then, superconductive ceramics pastes 5 are screen- printed to form (D) electronic circuit patterns, a high-temperature firing is performed and a superconducting ceramics circuit is completed. In this case, there is the need of forming uniformly the layer 3 on the substrate. Therefore, a hydrophilic surface active agent has only to be applied on the substrate for wettability improvement use.

7. 发明专利

JPS62247589A MANUFACTURE OF THICK FILM CIRCUIT 失效
公开(公告)号：JPS62247589A
公开(公告)日：1987-10-28
申请号：JP9036286
申请日：1986-04-18
申请人： FUJITSU LTD
发明人： YOKOYAMA HIROZO , TSUKADA MINEHARU , IMANAKA YOSHIHIKO , OGAWA HIROMI
IPC分类号： H05K1/03 , H05K3/12 , H05K3/46

8. 发明专利

JPS61127637A Paste for overcoating 失效
标题翻译：用于加工
公开(公告)号：JPS61127637A
公开(公告)日：1986-06-14
申请号：JP24120384
申请日：1984-11-15
申请人： Fujitsu Ltd
发明人： KAMEHARA NOBUO , TSUKADA MINEHARU , IMANAKA YOSHIHIKO , OGAWA HIROMI , YOKOYAMA HIROZO
IPC分类号： C03C8/04 , B41J2/005 , B41J2/14 , C03C8/16 , H01L23/29 , H01L23/31 , H05K3/28
CPC分类号： B41J2/14129 , B41J2/005 , B41J2202/03
摘要： PURPOSE:To obtain an overcoating paste having a low calcining temp. and being capable of forming a stable surface protecting layer against a conductor circuit on a foundation surface by using vitrifying components such as ZnO, B2O3, and SiO2 as components, and adding further a binder resin and a solvent. CONSTITUTION:An overcoating paste is prepd. by adding an appropriate amt. of a binder resin such as acrylic resin, etc. and a solvent such as terpineol, etc. to an oxide compsn. for vitrification consisting preferably of 40-80wt% ZnO, 6-54wt% B2O3, and 6-54wt% SiO2. The paste is coated by printing on a resistance film 3 formed of a conductor circuit 2 patterned on a substrate 1 and a resistance paste, and calcined in N2 atmosphere to form an overcoated layer 4. The above-described paste has low calcination temp., and causes no deterioration of the characteristics of a conductor circuit 2 and a resistance film 3 because no diffusion of the paste into said circuit nor resistance film is caused.
摘要翻译：目的：获得具有低煅烧温度的复涂糊剂。并且能够通过使用诸如ZnO，B 2 O 3和SiO 2之类的玻璃化组分作为组分在基底表面上形成稳定的表面保护层，并进一步添加粘合剂树脂和溶剂。规定：外涂膏是制备的。通过添加适当的amt。的粘合剂树脂如丙烯酸树脂等，以及溶剂如萜品醇等。用于玻璃化，优选由40-80重量％的ZnO，6-54重量％的B 2 O 3和6-54重量％的SiO 2组成。通过印刷将糊状物涂布在由图案化在基板1上的导体电路2形成的电阻膜3和电阻浆料上，并在N 2气氛中煅烧以形成外包层4.上述糊料具有低煅烧温度，并且不会导致导体电路2和电阻膜3的特性的劣化，这是因为不会使糊料扩散到所述电路中，也不会产生电阻膜。

9. 发明专利

JPS61114810A Method of molding green sheet 失效
标题翻译：模板绿色方法
公开(公告)号：JPS61114810A
公开(公告)日：1986-06-02
申请号：JP23664684
申请日：1984-11-12
申请人： Fujitsu Ltd
发明人： IMANAKA YOSHIHIKO , OGAWA HIROMI , KURIHARA KAZUAKI , KAMEHARA NOBUO
IPC分类号： C04B35/622 , B28B1/30 , B28B17/00 , C04B35/00

10. 发明专利

JPS61107790A Making of multilayer ceramic circuit substrate 失效
标题翻译：多层陶瓷电路基板的制作
公开(公告)号：JPS61107790A
公开(公告)日：1986-05-26
申请号：JP22797384
申请日：1984-10-31
申请人： Fujitsu Ltd
发明人： KURIHARA KAZUAKI , IMANAKA YOSHIHIKO , OGAWA HIROMI , YOKOYAMA HIROZO , KAMEHARA NOBUO
IPC分类号： H05K3/46 , B32B15/04 , B32B15/08 , B32B18/00 , H01L23/12 , H05K1/03 , H05K3/00

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