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    • 1. 发明专利
    • Optical module, optical transmission apparatus, and manufacturing method of the optical module
    • 光学模块,光学传输装置和光学模块的制造方法
    • JP2008185601A
    • 2008-08-14
    • JP2007016262
    • 2007-01-26
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • UMEZAWA TOMOKI
    • G02B6/42H01L31/0232H01S5/022
    • PROBLEM TO BE SOLVED: To provide an optical module whose productivity can be improved by eliminating precise control of application of adhesive, and to provide an optical transmission apparatus and the manufacturing method of the optical module.
      SOLUTION: This optical module 1A includes a light-emitting element array 3; a support substrate 2A on which the emitting element array 3 is mounted; an optical waveguide 4 having an optical coupling face 4a for optical coupling to the light-emitting face 3a of the emitting element array 3 and having a reflecting face 4b installed at a position facing the optical coupling face 4a; and an adhesive 5 that is supplied by capillary force between the light-emitting face 3a of the emitting array 3 and the light coupling face 4a of the optical wave guide 4 and that sticks the light-emitting face 3a and the light-coupling face 4a together.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供通过消除对粘合剂的应用的精确控制可以提高生产率的光学模块,并且提供光学传输装置和光学模块的制造方法。 解决方案:该光学模块1A包括发光元件阵列3; 支撑基板2A,其上安装有发光元件阵列3; 光波导4,其具有用于光耦合到发光元件阵列3的发光面3a并具有安装在面向光耦合面4a的位置的反射面4b的光耦合面4a; 以及通过毛细管力在发光阵列3的发光面3a与光波导4的光耦合面4a之间供给并粘贴发光面3a和光耦合面4a的粘合剂5 一起。 版权所有(C)2008,JPO&INPIT
    • 2. 发明专利
    • Mounting method of plural elements
    • 多元元素的安装方法
    • JP2007188933A
    • 2007-07-26
    • JP2006003454
    • 2006-01-11
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • UMEZAWA TOMOKIIWAMORI TOSHIMICHI
    • H01L23/36H01L31/02H01S5/024H05K3/34
    • PROBLEM TO BE SOLVED: To provide a mounting method of a plurality of elements, with which fitting cost of a plurality of the elements is reduced, and a plurality of the elements can efficiently and securely be cooled in the mounting method of a plurality of the elements, for electrically connecting a plurality of the elements to a substrate and for fitting a heat sink cooling a plurality of the elements. SOLUTION: In an element fixing process before an element connection process, a light emitting/receiving element 11 and driving LSI12 corresponding to one example of a plurality of the elements are fixed to a rear face 30c with respect to a radiation face 30b of the heat sink 30, toward rear faces 11c and 12c with respect to connection faces 11b and 12b of the light emitting/receiving element 11 and driving LSI12. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供多个元件的安装方法,多个元件的装配成本被降低,并且多个元件可以在安装方法中被有效且可靠地冷却 多个元件,用于将多个元件电连接到基板并且用于安装冷却多个元件的散热器。 解决方案:在元件连接处理之前的元件固定工艺中,对应于多个元件的一个示例的发光/接收元件11和驱动LSI12相对于辐射面30b固定到后表面30c 相对于发光/接收元件11的连接面11b和12b以及驱动LSI12朝向后表面11c和12c。 版权所有(C)2007,JPO&INPIT
    • 3. 发明专利
    • Manufacturing method of optical member
    • 光学会员的制造方法
    • JP2006267346A
    • 2006-10-05
    • JP2005083309
    • 2005-03-23
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • UMEZAWA TOMOKI
    • G02B6/122G02B6/13
    • G02B6/42G02B6/12002G02B6/1221G02B6/4214G02B2006/12104
    • PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing an optical member for optical path conversion, an optical member that is connected to an optical waveguide installed in a substrate and that has a lens formed at the end of an optical path. SOLUTION: A plurality of openings 23 (through holes) are formed in one wafer 21 to make a through hole substrate. A plurality of grooves (V grooves) 24 and slopes 25 are formed in the other wafer 22 to make a V-groove substrate 22. The V grooves 24 and the slopes 25 are formed by etching. The openings 23 and the slopes 25 are formed in a manner corresponding to each other in the position. The through hole substrate 21 and the V-groove substrate 22 are stuck together so that the openings 23 and the slopes 25 face oppositely, forming a combined body. The combined body is diced into small pieces in a manner including the openings 23 and the slopes 25, to manufacture the optical member 26. Suitably, a lens is formed at the end of the optical path of the optical member 26. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供一种用于有效地制造用于光路转换的光学部件的方法,该光学部件连接到安装在基板中的光波导,并且具有形成在光路端部的透镜 。 解决方案:在一个晶片21中形成多个开口23(通孔),以形成通孔基板。 在另一个晶片22中形成多个槽(V槽)24和斜面25,以形成V形槽衬底22.V槽24和斜面25通过蚀刻形成。 开口23和斜面25在该位置上以彼此对应的方式形成。 通孔基板21和V形槽基板22被卡在一起,使得开口23和斜面25相对地形成组合体。 将组合体以包括开口23和斜面25的方式切成小块,以制造光学构件26.适当地,在光学构件26的光路的端部处形成透镜。 (C)2007,JPO&INPIT
    • 5. 发明专利
    • Inkjet recording head, inkjet head cartridge, and inkjet recorder
    • 喷墨记录头,喷墨头和喷墨记录仪
    • JP2005059375A
    • 2005-03-10
    • JP2003292076
    • 2003-08-12
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • WATANABE YOICHIUMEZAWA TOMOKIYAMAZAKI KENJIKURITA HIROYUKIKOTAKE NAOSHIKATAOKA MASAKIFUNATSU TADAKUNI
    • B41J2/05
    • PROBLEM TO BE SOLVED: To reduce a distortion or a warpage of a metallic heat sink due to heating by adequately radiating the heat generated on an inkjet recording head and to prevent increase in vibration and weight of the inkjet recording head from being increased.
      SOLUTION: An inkjet head cartridge 30 is so constituted that the inkjet recording head 38 and an ink tank 34 are integrally formed. A recording head chip 32 for ejecting ink and the metallic heat sink 36 for bearing the recording head chip 32 are provided on the recording head 38. The heat sink 36 is made of an alloy including magnesium and can efficiently radiate the heat generated on the recording head chip 32. It is preferable to adhere a ceramic sheet having a radiating property to the surface of the heat sink 36. As a result, it is possible to reduce a distortion or a warpage of the heat sink 36 due to the heat and to reduce the weight thereof. A vibration of the recording head chip 32 can be reduced so that a high quality image can be recorded.
      COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:为了通过充分地辐射喷墨记录头上产生的热量来减少由于加热导致的金属散热器的变形或翘曲,并且防止喷墨记录头的振动和重量的增加不增加 。 解决方案:喷墨头盒30被构造成使得喷墨记录头38和墨盒34一体地形成。 用于喷射墨的记录头芯片32和用于承载记录头芯片32的金属散热器36设置在记录头38上。散热器36由包含镁的合金制成,并且可以有效地辐射在记录头上产生的热量 优选将具有散热性的陶瓷片粘附到散热器36的表面。结果,可以减少由于热而导致的散热器36的变形或翘曲,并且 减轻其重量。 可以减小记录头芯片32的振动,从而可以记录高质量的图像。 版权所有(C)2005,JPO&NCIPI
    • 7. 发明专利
    • Optical module
    • 光学模块
    • JP2009092690A
    • 2009-04-30
    • JP2007260147
    • 2007-10-03
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • OZAWA HIDEAKIYAMAZAKI KENJIUMEZAWA TOMOKI
    • G02B6/42G02B6/122H01L31/0232H01S5/022H01S5/026H01S5/183
    • G02B6/4214G02B6/4246G02B6/4249H01L2224/48091H01L2224/49175H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide an optical module capable of reducing an interval of a core between channels of an optical waveguide and reducing cross-talk in an optical coupling part. SOLUTION: On a substrate 1, a light emitting element array 2 consisting of VCSEL 20A to 20D and a light receiving element array 30 consisting of PD 30A to 30D form a gap g and are mounted so that the VCSEL 20A to 20D and the PD 30A to 30D element arrays become parallel with each other, and a mirror on the light emission side and a mirror on a light reception side of the optical waveguide 7 are optically coupled on the VCSEL 20A to 20D and the PD 30A to 30D. The mirror on the light emission side and the mirror on a light reception side of the optical waveguide 7 are arranged so as to form a gap G equal to the gap g. Thereby, the cross-talk on the optical coupling part can be reduced. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种光学模块,其能够减小光波导的通道之间的芯的间隔,并减少光耦合部中的串扰。 解决方案:在基板1上,由VCSEL 20A至20D组成的发光元件阵列2和由PD 30A至30D组成的光接收元件阵列30形成间隙g,并且安装成使得VCSEL 20A至20D和 PD 30A至30D元件阵列彼此平行,并且在光发射侧的反射镜和光波导7的光接收侧的反射镜光耦合在VCSEL 20A至20D和PD 30A至30D上。 光波导7的发光侧的反射镜和光接收侧的反射镜被配置为形成与间隙g相等的间隙G. 由此,能够减少光耦合部上的串扰。 版权所有(C)2009,JPO&INPIT
    • 9. 发明专利
    • Signal processor and image forming apparatus
    • 信号处理器和图像形成装置
    • JP2008249810A
    • 2008-10-16
    • JP2007087876
    • 2007-03-29
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • UMEZAWA TOMOKIIWAMORI TOSHIMICHIYAMAZAKI KENJI
    • G03G21/00
    • PROBLEM TO BE SOLVED: To provide a signal processor capable of processing an optical signal and an image forming apparatus having the same mounted thereon. SOLUTION: In the signal processor 200A including a first substrate 210 including a waveguide 203, a second substrate 211 arranged to be overlaid on the first substrate 210, a third substrate 212 having an optical element 222 arranged to be overlaid on the second substrate 211, and a fourth substrate 213 arranged to be overlaid on the third substrate 212, the second substrate 211 is provided with a second waveguide 260 penetrating therethrough and guiding light from a waveguide 203 of the first substrate 210 to the optical element 222 of the third substrate 212. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供能够处理光信号的信号处理器和安装在其上的图像形成装置。 解决方案:在包括包括波导203的第一基板210的信号处理器200A中,布置成覆盖在第一基板210上的第二基板211,具有布置成覆盖在第二基板210上的第二基板 基板211和布置成覆盖在第三基板212上的第四基板213,第二基板211设置有穿过其中的第二波导260,并将来自第一基板210的波导203的光引导到第一基板210的光学元件222。 第三衬底212.版权所有(C)2009,JPO&INPIT
    • 10. 发明专利
    • Optical connector
    • 光学连接器
    • JP2007212564A
    • 2007-08-23
    • JP2006030074
    • 2006-02-07
    • Fuji Xerox Co Ltd富士ゼロックス株式会社
    • UMEZAWA TOMOKI
    • G02B6/32G02B6/42
    • G02B6/4204G02B6/32G02B6/4214G02B6/4292
    • PROBLEM TO BE SOLVED: To provide a further miniaturized optical connector, one that is used for connecting signal light propagating mediums with each other such as an optical fiber and a waveguide. SOLUTION: In the housing 12 of an optical connector 10, an inserting/drawing part 12a composed of an inserting hole forming wall 121 and an optical connecting part 12b composed of a through hole forming wall 122 are formed. In the inserting/drawing part 12a, with a pressing member 13 arranged so as to be freely projected or housed, a second optical signal edge 31 which is in a state inserted into the inserting/drawing part 12a is positioned by pressing to both butting face 121b and a supporting face 121a. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供另一种小型化光连接器,其用于将信号光传播介质彼此连接,例如光纤和波导。 解决方案:在光连接器10的壳体12中,形成有由插孔形成壁121和由通孔形成壁122组成的光学连接部分12b构成的插入/拉伸部分12a。 在插入/拉出部分12a中,通过按压构件13被自由地投影或收容,将处于插入到插入/拉出部分12a中的状态的第二光学信号边缘31按压到两个对接面 121b和支撑面121a。 版权所有(C)2007,JPO&INPIT