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1. 发明专利

JP2009164340A Stereoscopic circuit board and its manufacturing method 审中-公开
标题翻译：立体电路板及其制造方法
公开(公告)号：JP2009164340A
公开(公告)日：2009-07-23
申请号：JP2008000482
申请日：2008-01-07
申请人： Du Pont Toray Co Ltd , Fine Labo:Kk , 東レ・デュポン株式会社 , 株式会社ファインラボ
发明人： NAKAZAWA YOSHISUKE , MACHIDA HIDEAKI
IPC分类号： H05K1/02 , H05K3/00 , H05K3/18 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a stereoscopic circuit board, which can bond a conductor metal to a substrate with a high peel strength, having a high degree of circuit designing flexibility, and can be manufactured easily and efficiently.
SOLUTION: The method comprises: a substrate forming step S1 of forming an electrically-insulating thermoplastic heat-resistant film into a three-dimensional substrate 12; a circuit mask mounting step S2 of mounting a mask 20 which is formed into a three-dimensional shape to cover the surface of a portion corresponding to an electrically-insulating portion I of a conductive circuit C provided on the surface of the substrate 12; a conductive paste applying step S3 of applying conductive paste 14a to the conductive circuit (C) portion which is an unmasked portion of the substrate 12, removing the mask 20, curing the conductive paste 14a, and thus obtaining a conductive coat layer 14; and an electroplating step S4 of electroplating conductor metal on the surface of the conductive coat layer 14 and obtaining a conductor plating layer 16.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种立体电路板的制造方法，其可以将导体金属与具有高剥离强度的基板结合，具有高度的电路设计灵活性，并且可以容易且有效地制造。解决方案：该方法包括：将形成电绝缘热塑性耐热膜的基板形成步骤S1形成为三维基板12; 安装掩模20的电路掩模安装步骤S2，其形成为三维形状以覆盖与设置在基板12的表面上的导电电路C的电绝缘部分I相对应的部分的表面; 将导电糊料14a施加到作为基板12的未掩模部分的导电电路（C）部分的步骤S3，去除掩模20，固化导电膏14a，从而获得导电涂层14; 以及在导电涂层14的表面上的电镀导体金属的电镀步骤S4，并获得导体镀层16.版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2014197611A 高周波回路基板用カバーレイ有权
标题翻译：高频电路板覆盖层
公开(公告)号：JP2014197611A
公开(公告)日：2014-10-16
申请号：JP2013072570
申请日：2013-03-29
申请人：東レ・デュポン株式会社 , Du Pont-Toray Co Ltd , ダイキン工業株式会社 , Daikin Ind Ltd
发明人： HIDAKA SHOTARO , TANAKA TAKESHI , MACHIDA HIDEAKI , INABA TSUYOSHI , MURAKAMI TATSUYA
IPC分类号： H05K3/28 , B32B27/30 , B32B27/34 , C08F214/26 , C08G73/10
摘要：【課題】機械的特性及び耐熱性に優れ、高周波回路基板製造時の作業性を高めることができる、ポリイミドフィルム及びフッ素樹脂を使用する高周波回路基板用カバーレイを提供すること。【解決手段】ポリイミドフィルムとフッ素樹脂を貼り合わせてなるカバーレイであって、ポリイミドフィルム層とフッ素樹脂層間の接着強度が3.0N/cmを超えること特徴とする高周波回路基板用カバーレイ。【選択図】図1
摘要翻译：要解决的问题：提供一种使用聚酰亚胺薄膜和氟树脂的高频电路板的覆盖层，具有优异的机械特性和耐热性，能够在制造高频电路板时提高可加工性。解决方案：通过层叠聚酰亚胺膜和氟树脂形成高频电路板。聚酰亚胺膜和氟树脂之间的粘合强度超过3.0N / cm。

3. 发明专利

JP2007005003A Led illumination device 有权
标题翻译： LED照明装置
公开(公告)号：JP2007005003A
公开(公告)日：2007-01-11
申请号：JP2005180433
申请日：2005-06-21
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MACHIDA HIDEAKI
IPC分类号： F21V29/00 , F21V7/22 , F21V19/00 , F21Y101/02 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/64
CPC分类号： H01L2224/48091 , H01L2224/49107 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a light-weighted LED illumination device with high precision, high illuminance efficiency, excellent in heat radiating property, having high freedom of light distribution design, capable of simply forming a circuit. SOLUTION: A base plate main body 14 is obtained by forming a thermoplastic heat resistant film into prescribed three-dimensional shape reflecting aimed irradiation range as a whole, and a reflection face 16 reflecting light is formed on the surface of the thermoplastic film, therefore it is possible to change the shape of the base plate main body 14 by utilizing signal or stress from outside, and easily change the light distribution of the light emitted from an IED 12. Furthermore, since an open hole 26 having a size nearly same as the size of light emission area of the surface mounting type LED 12 is formed on the base plate main body 14, and surface side of the LED 12 is fixed to the backside of the base plate main body 14 so that the open hole 26 and a light emission area L of the surface mounting type LED 12 coincide with each other, the circuit can be formed easily, and the heat generated at the LED 12 can be released immediately to open air without any resistance. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有高精度，高照度效率，优异的散热性能，具有高自由度的配光设计的能够简单地形成电路的轻量级LED照明装置。解决方案：通过将热塑性耐热膜形成为反射目标照射范围的规定的三维形状，并且在热塑性膜的表面上形成反射光的反射面16，获得基板主体14 因此，可以通过利用来自外部的信号或应力来改变基板主体14的形状，并且容易地改变从IED 12发射的光的光分布。此外，由于具有尺寸接近与基板主体14上形成表面安装型LED12的发光面积的大小相同，LED12的表面侧固定在基板主体14的背面，使得开孔26 并且表面安装型LED12的发光区域L彼此一致，可以容易地形成电路，并且在LED 12处产生的热量可以立即释放而没有任何阻力。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2014032980A Method of attaching coverlay for high-frequency circuit board, and the coverlay 有权
标题翻译：连接高频电路板覆盖层和覆盖层的方法
公开(公告)号：JP2014032980A
公开(公告)日：2014-02-20
申请号：JP2012170752
申请日：2012-08-01
申请人： Du Pont-Toray Co Ltd , 東レ・デュポン株式会社
发明人： HIDAKA SHOTARO , TANAKA TAKESHI , MACHIDA HIDEAKI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide: a method of attaching a coverlay by which a twist of wires is prevented, and an obtained high-frequency circuit board has a sufficient adhesive strength, and no new manufacturing facility separated from an existing coverlay processing facility is required, in the case that a fluorine resin is used for the coverlay whose base material is a polyimide film; a high-frequency circuit board using a fluorine resin for a coverlay whose base material is a polyimide film and having a sufficient adhesive strength; and a coverlay for the high-frequency circuit board.SOLUTION: In a method of attaching a coverlay, a fluorine resin side of a coverlay consisting of a polyimide film layer and a fluorine resin layer is laminated so as to be contacted with a circuit of a copper clad lamination body, and the coverlay and the copper clad lamination body are temporally fixed. An adhesive strength between the polyimide film layer and the fluorine resin layer of the coverlay before the lamination is 3.0 N/cm or less. Annealing processing is performed to increase an adhesion force of a high-frequency circuit board after the annealing processing into 30 times or more of that before the annealing processing.
摘要翻译：要解决的问题：提供一种附着防止电线扭曲的覆盖层的方法，并且所获得的高频电路板具有足够的粘合强度，并且没有与现有覆盖物处理设备分离的新的制造设备是在使用氟树脂作为基材为聚酰亚胺膜的覆盖层的情况下，使用氟树脂作为基材为聚酰亚胺膜并具有足够的粘合强度的覆盖层的高频电路板; 以及高频电路板的覆盖层。解决方案：在安装覆盖层的方法中，层叠由聚酰亚胺膜层和氟树脂层构成的覆盖层的氟树脂侧，以使其与覆铜层压体，覆盖层和覆铜层压体在时间上是固定的。层叠前的覆盖层的聚酰亚胺膜层和氟树脂层之间的粘合强度为3.0N / cm以下。进行退火处理，将退火处理后的高频电路基板的粘合力提高到退火处理前的30倍以上。

5. 发明专利

JPH11273431A Reflector material for lighting fixture and reflector for lighting fixture 失效
标题翻译：照明灯具的反光材料和照明装置的反射器
公开(公告)号：JPH11273431A
公开(公告)日：1999-10-08
申请号：JP9676598
申请日：1998-03-25
申请人： Du Pont Toray Co Ltd , Ose Kk , オー・エス・イー株式会社 , 東レ・デュポン株式会社
发明人： TOGASHI NAOYUKI , MACHIDA HIDEAKI
IPC分类号： F21V7/22
CPC分类号： F21V7/22 , F21S41/37
摘要： PROBLEM TO BE SOLVED: To provide a reflector substrate for a lighting fixture, which is lightweight and excellent in surface smoothness, safety, moldability, heat resistance and handling performance, and to provide a low-cost and high-quality reflector for the lighting fixture, which does not require a pretreatment at the time of forming a reflecting layer, and is suitable for mass production and lightweight, and has high specular performance, and also is excellent in heat resistance, radiative performance, safety and handling performance.
SOLUTION: This reflector material 1 for a lighting fixture has such a characteristic that it is composed of a mold of an aromatic polyimide film or an aromatic polyamide film. And this reflector for the lighting fixture 8 is composed by forming a reflecting layer 10 by the vapor deposition of reflecting material, on the reflector base member 1 comprising a mold of an aromatic polyimide film or an aromatic polyamide film.
COPYRIGHT: (C)1999,JPO
摘要翻译：要解决的问题：提供一种重量轻且表面平滑性，安全性，成型性，耐热性和处理性能优异的照明器具的反射器基板，并且为照明灯具提供低成本且高品质的反射器，其在形成反射层时不需要预处理，并且适合于批量生产和轻量化，并且具有高镜面性能，并且还具有优异的耐热性，辐射性能，安全性和操作性能。解决方案：这种用于照明器材的反射器材料1具有由芳族聚酰亚胺膜或芳族聚酰胺膜的模具构成的特征。用于照明器具8的该反射器通过在反射器基底构件1上形成反射层10而构成，该反射层10通过反射材料的蒸镀而形成，该反射层基材1包括芳香族聚酰亚胺膜或芳香族聚酰胺膜。

6. 发明专利

JP2008056755A Polyimide powder and method for producing the same 审中-公开
标题翻译：聚酰亚胺粉及其制造方法
公开(公告)号：JP2008056755A
公开(公告)日：2008-03-13
申请号：JP2006233088
申请日：2006-08-30
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , MACHIDA HIDEAKI
IPC分类号： C08J3/12
摘要： PROBLEM TO BE SOLVED: To provide polyimide powder hardly coagulating on its use and a method for producing the polyimide powder efficiently without using a solvent.
SOLUTION: This polyimide power is provided by having a planar particle form and 5 to 200 μm mean particle diameter, and is produced by using polyimide film as a raw material and crushing the same. The method for producing the polyimide powder is provided by crushing the polyimide film so as to make 5 to 200 μm mean particle diameter. Further, the method for producing the polyimide powder is provided by using waste film formed in an actual place of its production, as the polyimide film raw material.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：待解决的问题：提供聚酰亚胺粉末在其使用上几乎不凝结的方法和不使用溶剂有效地生产聚酰亚胺粉末的方法。解决方案：该聚酰亚胺电力通过具有平面粒子形式并且具有5至200μm平均粒径而提供，并且通过使用聚酰亚胺膜作为原料并将其粉碎来制造。聚酰亚胺粉末的制造方法是将聚酰亚胺膜粉碎成平均粒径为5〜200μm的方法。此外，聚酰亚胺粉末的制造方法通过使用在其实际生产的地方形成的废膜作为聚酰亚胺膜原料而提供。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2005340184A Led lighting apparatus 审中-公开
标题翻译： LED照明设备
公开(公告)号：JP2005340184A
公开(公告)日：2005-12-08
申请号：JP2005126652
申请日：2005-04-25
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MACHIDA HIDEAKI
IPC分类号： F21V19/00 , F21S8/04 , F21V7/22 , F21Y101/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide an LED lighting apparatus which is light-weighted and has high accuracy and high efficiency of illumination intensity, and can realize light distribution change easily by a stress from the outside, and has enough freedom in design of light distribution. SOLUTION: The LED lighting apparatus 10 can be obtained in which the substrate main part 14 is formed by forming a heat resisting film having thermoplasticity in a prescribed three-dimensional shape reflecting a targeted irradiation range as a whole, and a reflecting face 16 for reflecting the light is installed on the surface where the LEDs 12 are mounted as a light source, and a conductive circuit 18 is formed on the rear face, thereby which is full of flexibility and is easy to change light distribution by displacing the LED mounting portion by the stress from the outside, and has a high light illumination efficiency with light weight and high accuracy. Since a plurality of LEDs 12 are arranged on the surface of the LED lighting apparatus 10, reduction of illumination intensity at the time of light distribution change can be prevented. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种重量轻且具有高精度和高效率的照明强度的LED照明装置，并且可以通过来自外部的应力容易地实现光分配变化，并且具有足够的设计自由度的光分布。解决方案：通过形成具有反映目标照射范围的规定三维形状的具有热塑性的耐热膜整体形成基板主体部14的LED照明装置10，以及反射面用于反射光的16被安装在作为光源的LED12的表面上，并且在后表面上形成导电电路18，由此具有柔性，并且容易通过移动LED来改变光分布通过外界的应力安装部分，具有重量轻且精度高的高照明效率。由于在LED照明装置10的表面上配置有多个LED12，因此能够防止配光改变时的照明强度的降低。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2010232252A Coverlay film having white reflection layer 审中-公开
标题翻译：具有白色反射层的覆盖膜
公开(公告)号：JP2010232252A
公开(公告)日：2010-10-14
申请号：JP2009075720
申请日：2009-03-26
申请人： Du Pont Toray Co Ltd , Unon Giken:Kk , 東レ・デュポン株式会社 , 株式会社ウノン技研
发明人： OKUZAWA RYOZO , IIZUKA TAKAYUKI , YONENAGA OSAMU , MACHIDA HIDEAKI
IPC分类号： H05K3/28 , F21S2/00 , F21Y101/02 , G02F1/13357
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a light source device which is used for a liquid crystal display device and has little loss of light emitted from LED, and to provide a coverlay film which is desirably used for the light source device.
SOLUTION: The coverlay film having a white reflection layer 14 with a reflection factor of ≥50% is stuck by thermal compression onto a flexible circuit board having a conductive circuit 9, and a light-emitting element such as LED 7 is mounted on the conductive circuit by soldering in the light source device. Light from the light-emitting element is reflected by a surface reflection layer of the coverlay film, and is efficiently input to a light guide plate without light absorption in the coverlay film and the flexible circuit board.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种用于液晶显示装置的光源装置，并且LED发射的光的损耗小，并且提供期望用于光源装置的覆盖膜。解决方案：将具有≥50％反射率的白色反射层14的覆盖膜通过热压力粘贴到具有导电电路9的柔性电路板上，并且安装诸如LED 7的发光元件通过在光源装置中焊接在导电电路上。来自发光元件的光被覆盖膜的表面反射层反射，并且在覆盖膜和柔性电路板中没有光吸收的情况下被有效地输入到导光板。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2008293692A Led illumination device, and lighting fixture for vehicle using the device 有权
标题翻译： LED照明装置以及使用装置的车辆的照明装置
公开(公告)号：JP2008293692A
公开(公告)日：2008-12-04
申请号：JP2007135545
申请日：2007-05-22
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MACHIDA HIDEAKI
IPC分类号： F21S8/10 , F21V29/00 , F21Y101/02
CPC分类号： Y02P20/52
摘要： PROBLEM TO BE SOLVED: To provide an LED illumination device which is superior in radiation characteristics, light in weight, high in precision, and high in a degree of the freedom of designing, and can be manufactured efficiently.
SOLUTION: This LED illumination device 10 is equipped with a substrate body 12 in which a thermoplastic heat resistant film is formed to have a prescribed three-dimensional form, one or a plurality of numbers of surface-mounting type LEDs 14 mounted to a prescribed position of the substrate body 12, and a conductive circuit 16 which is installed at least on one of the surface of the front face or the rear face of the substrate body 12, and connects the LEDs 14 to an external circuit and lights them on, and a radiating layer 18 composed of metal is formed on the opposite face of the conductive circuit 16 of the substrate body 12. By such a constitution, heat generated by the LEDs 14 can be radiated effectively from both front and rear faces of the LED illumination device 10 via the conductive circuit 16 and the radiating layer 18, and the degradation of LED elements caused by the heat can be prevented.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种辐射特性，重量轻，精度高，设计自由度高的LED照明装置，能够高效率地制造。解决方案：该LED照明装置10配备有基板主体12，其中形成热塑性耐热膜以具有规定的三维形状，一个或多个表面安装型LED 14安装到基板主体12的规定位置和安装在基板主体12的正面或背面的至少一个表面上的导电电路16，并且将LED 14连接到外部电路并点亮它们并且在基板主体12的导电电路16的相对面上形成由金属构成的散热层18.通过这样的结构，可以从LED 14的前后两面的有效面发射由LED 14产生的热量可以防止LED照明装置10经由导电电路16和辐射层18以及LED元件由热引起的劣化。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2006176907A Polyimide fiber 审中-公开
标题翻译：聚酰亚胺纤维
公开(公告)号：JP2006176907A
公开(公告)日：2006-07-06
申请号：JP2004370233
申请日：2004-12-21
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： MAEDA SHU , MACHIDA HIDEAKI
IPC分类号： D01F6/74
摘要： PROBLEM TO BE SOLVED: To produce a fiber having remarkably improved heat-resistance and chemical resistance by fiberizing a polyimide having excellent heat-resistance and chemical resistance compared with conventional polyimide and suitable as a material for a heat-resistant felt, a dry filter material and a bag filter.
SOLUTION: A polyimide film is produced from an aromatic carboxylic acid dianhydride such as pyromellitic dianhydride and 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and an aromatic diamine such as 4,4'-oxydianiline, 3,4'-oxydianiline and p-phenylenediamine through a polyamic acid. The film is wound in the form of a coil and fiberized by a coil cutting method to obtain a polyimide fiber having excellent heat-resistance and chemical resistance and a nearly quadrilateral cross-section having the length of both of the long side and the short side of 10-130 μm.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了通过使与常规聚酰亚胺相比具有优异的耐热性和耐化学性的聚酰亚胺纤维化来制造具有显着提高的耐热性和耐化学性的纤维，并且适合作为耐热毡的材料，干燥过滤材料和袋式过滤器。解决方案：由芳族羧酸二酐如1,2,4,5-苯四酸二酐和3,3'，4,4'-联苯四羧酸二酐和芳族二胺如4,4'-氧二苯胺3,4 ' - 氧联苯胺和对苯二胺通过聚酰胺酸。以线圈形式卷绕薄膜并通过线圈切割方法纤维化，得到耐热性和耐化学性优异的聚酰亚胺纤维和具有长边和短边长度的近似四边形横截面为10-130微米。版权所有（C）2006，JPO＆NCIPI

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