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1. 发明专利

JP2008239930A Polyamic acid, polyimide film therefrom, and manufacturing method thereof as well as flexible circuit board 审中-公开
标题翻译：聚氨酯，聚酰亚胺膜及其制造方法，如柔性电路板
公开(公告)号：JP2008239930A
公开(公告)日：2008-10-09
申请号：JP2007086817
申请日：2007-03-29
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI
IPC分类号： C08G73/10 , B32B15/088 , C08J5/18 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyamic acid which has a specific structure as a precursor to give a new polyimide having the excellent dimensional stability, and to obtain a polyimide film having a high peeling strength from the metal foil at the time of bonding to a metal foil through an adhesive.
SOLUTION: The polyamic acid is synthesized from an aromatic diamine containing in a ratio 0.1-100% by mole of a carboxy-4,4'-diaminodiphenyl ether and an aromatic tetracarboxylic acid dianhydride or a derivative thereof; the polyimide film is obtained by imidizing thermally and/or chemically this polyamic acid. This polyimide film has the linear expansion coefficient controlled and the high peeling strength at the time of being press-bonded to a metal foil through an adhesive.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有特定结构的聚酰胺酸作为前体，得到具有优异尺寸稳定性的新型聚酰亚胺，并且获得当时从金属箔具有高剥离强度的聚酰亚胺膜通过粘合剂粘合到金属箔上。解决方案：聚酰胺酸由含有比例为0.1-100摩尔％的羧基-4,4'-二氨基二苯醚和芳族四羧酸二酐或其衍生物的芳族二胺合成; 通过将该聚酰胺酸热和/或化学亚胺化获得聚酰亚胺膜。该聚酰亚胺膜具有线性膨胀系数控制，并且通过粘合剂压接在金属箔上时的高剥离强度。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008238788A Laminated polyimide film, its manufacturing process, and flexible circuit board 审中-公开
标题翻译：层压聚酰亚胺膜，其制造工艺和柔性电路板
公开(公告)号：JP2008238788A
公开(公告)日：2008-10-09
申请号：JP2007086818
申请日：2007-03-29
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI
IPC分类号： B32B27/34 , C08G73/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain polyimide film which can acquire extremely large peeling strength by increasing no water suction rate in case of gluing to metallic foil through an adhesive.
SOLUTION: In laminated polyimide film composed by laminating two or more layers of the polyimide film, the polyimide of at least one uppermost surface layer of the laminating polyimide film is a characteristic composed of polyimide obtained by thermally and/or chemically imide deriving a polyamic acid synthesized from aromatic diamine containing carboxy-4,4'-diaminodiphenylether of a ratio of 1 to 100 mol.%, and aromatic tetracarboxylate dianhydride or its derivative. This laminating polyimide film has water absorption rate of 3.0 wt.% or less and small dimensional change, and, further, peeling strength in case of pressure bonding through the metallic foil and the adhesive is high such as 10N/cm or more.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：获得通过在通过粘合剂粘合到金属箔的情况下通过增加没有吸水率而获得极大剥离强度的聚酰亚胺膜。解决方案：在叠层聚酰亚胺膜层叠两层或多层聚酰亚胺膜的叠层聚酰亚胺膜中，叠层聚酰亚胺膜的至少一个最上表面层的聚酰亚胺是通过热和/或化学酰亚胺衍生得到的聚酰亚胺由含有比例为1〜100摩尔％的羧基-4,4'-二氨基二苯醚的芳香族二胺和芳族四羧酸二酐或其衍生物合成的聚酰胺酸。该层叠性聚酰亚胺膜的吸水率为3.0重量％以下，尺寸变化小，另外，通过金属箔和粘接剂的压接时，如10N / cm以上的剥离强度较高。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008201941A Low thermally shrinkable polyimide film and method for producing the same 审中-公开
标题翻译：低热收缩聚酰亚胺薄膜及其制造方法
公开(公告)号：JP2008201941A
公开(公告)日：2008-09-04
申请号：JP2007040951
申请日：2007-02-21
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , ISHIKAWA HIRONORI
IPC分类号： C08J5/18 , C08G73/10 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film improved in shrinkability to heat, and to provide a method for producing the same.
SOLUTION: This polyimide film comprising (1) a polyimide obtained from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and (2) inorganic particles having particle diameters in a range of 0.01 to 1.5 μm and having an average particle diameter of 0.05 to 0.7 μm in an amount of 0.1 to 0.9 wt.% based on the weight of the polyamic acid is characterized in that the polyimide film has a thermal shrinkage percentage of ≤0.10%, when the polyimide film is thermally treated at 200°C for 1 hour under a constant longitudinal tension of the film. The present invention further includes a method for producing the polyimide film.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种提高热收缩性的聚酰亚胺膜，并提供其制造方法。解决方案：该聚酰亚胺膜包含（1）由3,4'-二氨基二苯基醚，4,4'-二氨基二苯基醚和均苯四甲酸二酐获得的聚酰亚胺和（2）粒径在0.01至1.5范围内的无机颗粒 μm，平均粒径为0.05〜0.7μm，相对于聚酰胺酸的重量为0.1〜0.9重量％，其特征在于，当聚酰亚胺膜的热收缩率为≤0.10％时，聚酰亚胺膜在200℃下在膜的恒定纵向张力下热处理1小时。本发明还包括一种聚酰亚胺薄膜的制造方法。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007039528A Polyimide film, its manufacturing method and flexible circuit board 有权
标题翻译：聚酰亚胺薄膜，其制造方法和柔性电路板
公开(公告)号：JP2007039528A
公开(公告)日：2007-02-15
申请号：JP2005224024
申请日：2005-08-02
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , YOKOYAMA HIROICHI
IPC分类号： C08G73/10 , B32B15/088 , C08J5/18 , C08L79/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film that is excellent in handleability and flexibility and exhibits a high peeling strength from a metal foil when glued to the metal foil via an adhesive, a method for easily manufacturing the film and a circuit board using the film.
SOLUTION: The polyimide film is obtained by thermal and/or chemical imidization of a polyamic acid synthesized from an aromatic diamine containing carboxy-4,4'-diaminodiphenylmethane at a ratio of 0.1-100 mol% and an aromatic tetracarboxylic dianhydride or a derivative thereof. The polyimide film has a controlled Young's modulus and has a high peeling strength when contact-bonded to the metal foil via the adhesive.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种通过粘合剂将金属箔粘合到金属箔上时，可操作性和柔软性优异并且显示出高的剥离强度的聚酰亚胺膜，用于容易地制造膜和电路的方法使用电影的板。解决方案：聚酰亚胺膜通过由含有羧酸-4,4'-二氨基二苯基甲烷的比例为0.1-100摩尔％的芳族二胺和芳族四羧酸二酐合成的聚酰胺酸进行热和/或化学酰亚胺化获得，或其衍生物。聚酰亚胺薄膜具有受控的杨氏模量，并通过粘合剂与金属箔接触时具有高的剥离强度。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006137868A Polyimide film and flexible circuit board 审中-公开
标题翻译：聚酰亚胺薄膜和柔性电路板
公开(公告)号：JP2006137868A
公开(公告)日：2006-06-01
申请号：JP2004329203
申请日：2004-11-12
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , UHARA KENJI
IPC分类号： C08J5/18 , B32B15/08 , B32B27/34 , C08G73/10 , C08L79/08 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film having not only excellent handleability and flexibility but also high dimensional stability, and providing a high peel strength from a metal foil when stuck to the metal foil through an adhesive; and to provide a method for easily producing the film, and a flexible circuit board using the film.
SOLUTION: The polyimide film is obtained by thermally or chemically imidizing a polyamic acid containing acetylacetonatoiron (III). The polyimide film has a controlled Young's modulus and thermal expansion coefficient, and provides the high peel strength when being stuck to the metal foil through the adhesive by pressurizing.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种聚酰亚胺膜，其不仅具有优异的可操作性和柔韧性，而且具有高的尺寸稳定性，并且当通过粘合剂粘附在金属箔上时，从金属箔提供高的剥离强度; 并提供容易制造薄膜的方法和使用该薄膜的柔性电路板。解决方案：聚酰亚胺膜通过热或化学酰亚胺化含有乙酰丙酮铁（III）的聚酰胺酸得到。聚酰亚胺膜具有受控的杨氏模量和热膨胀系数，并且当通过加压粘合到金属箔上时提供高的剥离强度。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005206616A Polyimide film, semiconductive film and its use 审中-公开
标题翻译：聚酰亚胺薄膜，半导体薄膜及其用途
公开(公告)号：JP2005206616A
公开(公告)日：2005-08-04
申请号：JP2003432978
申请日：2003-12-26
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： UHARA KENJI , ISHIBASHI TADASHI
IPC分类号： G03G5/10 , C08G73/10 , C08J5/18 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To obtain a polyimide having a controlled volume electroconductivity without detriment to mechanical properties, and to provide a manufacturing method therefor.
SOLUTION: The polyimide film contains a powder having a powder electric resistivity of 0.1-10
5 Ω cm, a volume resistivity (ρ) of 1.0×10
6 -1.0×10
12 Ω cm and a surface resistivity (σ) of 10
7 -10
13 Ω cm, where log σ>log ρ. The manufacturing method for the polyimide film comprises dispersing the powder having the powder electric resistivity of 0.1-10
5 Ω cm in a polyamic acid solution, forming a film from the polyamic acid solution, and subsequently subjecting the film to an imidation ring closure treatment.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得具有受控体积电导率而不损害机械性能的聚酰亚胺，并提供其制造方法。解决方案：聚酰亚胺膜含有粉末电阻率为0.1-10Ω·cm -3Ω·cm的体积电阻率（ρ）为1.0×10 -6 / 1.0×10 12 Ωcm，表面电阻率（σ）为10 10 13 Ωcm，其中logσ> logρ。聚酰亚胺薄膜的制造方法包括将粉末电阻率为0.1-10×SP5Ω·cm的粉末分散在聚酰胺酸溶液中，从聚酰胺酸溶液中形成薄膜，然后使薄膜进行亚胺化闭环治疗。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004115787A Polyimide film and method for producing the same 审中-公开
公开(公告)号：JP2004115787A
公开(公告)日：2004-04-15
申请号：JP2003310917
申请日：2003-09-03
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： UHARA KENJI , ISHIBASHI TADASHI
IPC分类号： C08J5/18 , C08K3/00 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film capable of being controlled of volume electrical conductivity, without being deteriorated in mechanical characteristics, and to provide a method for producing the same.
SOLUTION: This polyimide film contains a powder having an electrical resistivity in a powder state of 0.1 to 10
5 Ωcm and has a volume resistivity in a range of 1.0×10
5 to 1.0×10
12 Ω. The method for producing the polyimide film comprising dispersing the powder having the electrical resistivity in the powder state of 0.1 to 10
5 Ωcm in a polyamic acid solution, then forming the polyamic acid solution into a film, and further subjecting the film to imidizing cyclization treatment.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2004107657A Polyimide film and method for producing the same 审中-公开
公开(公告)号：JP2004107657A
公开(公告)日：2004-04-08
申请号：JP2003302373
申请日：2003-08-27
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , UHARA KENJI
IPC分类号： C08J5/18 , C08G73/10 , C08K7/06 , C08L79/08
摘要： PROBLEM TO BE SOLVED: To provide a polyimide controlled of its electroconductivity, and a method for producing the same.
SOLUTION: The polyimide film contains carbon nanotubes, and has surface resistivity in the range of 1.0 × 10
5 to 1.0 × 10
12 Ω, and volume resistivity in the range of 1.0 × 10
5 to 1.0 × 10
12 Ωcm. The method for producing the polyimide film comprises the steps of dispersing carbon nanotubes in a solution of a polyamic acid, casting the polyamic acid solution into a film and subjecting the film to ring-closing imidization treatment.
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2008248067A Polyimide film and flexible circuit board 审中-公开
标题翻译：聚酰亚胺薄膜和柔性电路板
公开(公告)号：JP2008248067A
公开(公告)日：2008-10-16
申请号：JP2007090656
申请日：2007-03-30
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI
IPC分类号： C08J5/18 , B32B15/08 , B32B15/088 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film excellent in adhesivity, handleability, flexibility, dimensional stability and heat resistance.
SOLUTION: The polyimide film is characterized by being obtained from a precursor consisting of a polyamic acid synthesized from an aromatic diamine component comprising 0.1-10 mol% of carboxy-4,4'-diaminodiphenylmethane, 10-30 mol% of p-phenylenediamine and 60-89.9 mol% of 4,4'-diaminodiphenyl ether and an aromatic tetracarboxylic acid dianhydride component comprising 10-50 mol% of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and 50-90 mol% of pyromellitic dianhydride or a derivative of the aromatic tetracarboxylic acid dianhydride component. This polyimide film is such that its peel strength, Young's modulus, coefficient of linear expansion, water absorption and glass transition temperature are controlled within specific ranges, respectively.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供粘合性，可操作性，柔韧性，尺寸稳定性和耐热性优异的聚酰亚胺膜。解决方案：聚酰亚胺膜的特征在于由前体组成的前体获得，该前体由包含0.1-10mol％的羧基-4,4'-二氨基二苯基甲烷的芳族二胺组分合成的聚酰胺酸，10-30mol％的p 苯二胺和60-89.9mol％的4,4'-二氨基二苯醚和芳族四羧酸二酐组分，其包含10-50mol％的3,3'，4,4'-联苯四羧酸二酐和50-90mol％的均苯四酸二酐或芳族四羧酸二酐组分的衍生物。该聚酰亚胺膜的剥离强度，杨氏模量，线膨胀系数，吸水率和玻璃化转变温度分别控制在特定范围内。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2005053222A Laminated polyimide film, its manufacturing process, and flexible circuit board 审中-公开
标题翻译：层压聚酰亚胺膜，其制造工艺和柔性电路板
公开(公告)号：JP2005053222A
公开(公告)日：2005-03-03
申请号：JP2004203291
申请日：2004-07-09
申请人： Du Pont Toray Co Ltd , 東レ・デュポン株式会社
发明人： ISHIBASHI TADASHI , UHARA KENJI
IPC分类号： B32B27/34 , B32B15/08 , B32B15/088 , C08G73/10 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a polyimide film lamination having a strong peel strength when pressure welded with a metal foil through an adhesive, a process for manufacturing it easily, and a circuit board using the polyimide film lamination.
SOLUTION: The polyimide film lamination is obtained by coating; a polyamic acid synthesized from an aromatic diamine containing a carboxy-4, 4-diamino biphenyl in a proportion of 1 to 100 mole % and an aromatic tetracarboxylic acid dianhydride or its derivative, on one side or both sides of the outermost layer of the polyamic acid or polyimide film; and imidizing it thermally or chemically. The polyimide film lamination has a water absorption of 3.0 wt.% or lower, is low in dimensional change, and further, has the peel strength as high as 10 N/cm or higher when pressure welded with the metal foil through the adhesive.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过粘合剂与金属箔进行压焊时具有强剥离强度的聚酰亚胺膜层压体，其易于制造的方法和使用该聚酰亚胺膜层压体的电路板。解决方案：通过涂布获得聚酰亚胺膜层压; 在聚酰胺的最外层的一面或两面上由含有1〜100摩尔％的羧基-4,4-二氨基联苯和芳香族四羧酸二酐或其衍生物的芳族二胺合成的聚酰胺酸酸或聚酰亚胺膜; 并热化或化学地酰亚胺化。聚酰亚胺薄膜层叠体的吸水率为3.0重量％以下，尺寸变化小，并且当通过粘合剂与金属箔进行压焊时，其剥离强度高达10N / cm以上。版权所有（C）2005，JPO＆NCIPI

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