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1. 发明专利

JP2008261057A Method for producing spherical body 审中-公开
标题翻译：生产球身体的方法
公开(公告)号：JP2008261057A
公开(公告)日：2008-10-30
申请号：JP2008176615
申请日：2008-07-07
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： TSUKAGUCHI NOBUYOSHI
IPC分类号： B22F9/08 , B22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a means capable of easily producing a spherical body such as a solder ball with reduced stages at a low cost.
SOLUTION: The raw material of a spherical body is discharged from a discharge port in the state of a melt, at the point of the time in which the discharge amount reaches the desired one, the melt is separated at the discharge port by the flow of a fluid, and the separated raw material of a spherical body is made sphere by surface tension in the state of the melt and is thereafter solidified. Since the raw material of the spherical body discharged from the discharge port can be easily separated in the state of the melt by the flow of the fluid and can be separated into a desired amount in the state of the melt, a stage of working the raw material such as solder into a sheet material or a wire rod performed in the conventional method is made needless, thus the reduction of the production process can be attained.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够以低成本容易地制造具有降低的阶段的焊球等球体的装置。解决方案：在排出量达到期望的时刻，在熔融状态下，球体的原料从排出口排出，熔体在排出口处被分开，流体的流动和分离的球体的原料在熔融状态下通过表面张力制成球，然后固化。由于从排出口排出的球状体的原料可以通过流体的流动在熔体的状态下容易地分离，并且可以在熔体的状态下分离成期望的量，不需要使用以往的方法进行的焊料等成为片材或线材的材料，能够实现制造工序的缩短。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008205492A Method of manufacturing circuit board material 有权
标题翻译：制造电路板材料的方法
公开(公告)号：JP2008205492A
公开(公告)日：2008-09-04
申请号：JP2008076183
申请日：2008-03-24
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： TSUKAGUCHI NOBUYOSHI , HARA MASAHIRO
IPC分类号： H01L23/12 , H05K3/04
摘要： PROBLEM TO BE SOLVED: To provide a circuit board material capable of size reduction by forming smaller width and diameter of concave portion, such as a slit considering the metal layer thickness.
SOLUTION: After obtaining a metal-insulator compound material by forming metal layers 3 and 4 on both the primary planes of an insulator 2, etching resist 6 is formed on all the faces or a part of a metal layer 3 for forming a circuit. Then, at least a part of the metal layer 3 is subjected to etching processing, in succession, and then to milling processing. By removing the etching resist 6, thereafter, a circuit board material is manufactured, having a concave portion 10 such as slits and holes that satisfy the relation: c/d≤2.5 of a width or diameter c with respect to a metal layer thickness d.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：考虑到金属层厚度，通过形成较小的凹部的宽度和直径（例如狭缝）来提供能够减小尺寸的电路板材料。解决方案：通过在绝缘体2的两个主平面上形成金属层3和4获得金属 - 绝缘体复合材料之后，在用于形成绝缘体2的金属层3的所有表面或一部分上形成抗蚀剂6 电路。然后，依次对金属层3的至少一部分进行蚀刻处理，然后进行研磨加工。然后，通过除去抗蚀剂6，制造电路板材料，其具有相对于金属层厚度d具有满足关系式c /d≤2.5的宽度或直径c的狭缝和孔的凹部10 。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008110915A Tin-doped indium oxide powder 有权
标题翻译： TIN-DOPED氧化铟锡粉
公开(公告)号：JP2008110915A
公开(公告)日：2008-05-15
申请号：JP2008006417
申请日：2008-01-16
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： SUZUKI KAZUNARI , TSUKAGUCHI NOBUYOSHI , NAGATA CHOJU
IPC分类号： C01G15/00 , H01B1/08
摘要： PROBLEM TO BE SOLVED: To provide a transparent conductive powder exhibiting higher conductivity in a high transparency region, and to provide a suitable manufacturing method thereof not needing calcination treatment in a strong reducing atmosphere as in the past.
SOLUTION: The tin-doped indium oxide powder comprises powder having an Sn content of 0.1 to 30 wt.% in terms of SnO
2 , a specific surface area of 15 m
2 /g or more, and grain sizes ranging from 10 to 30 nm, and exhibits a specified color tone, crystallinity, volume resistivity, and zeta-potential. Moreover, in the manufacturing method, a bivalent soluble tin compound, in particular, is used for a starting tin material for doping, an ammonium carbonate is added to a mixed acidic liquid of the tin compound and an indium compound and mixed, thereby obtaining a coprecipitation hydroxide, which is calcinated in a nitrogen atmosphere while humidity is adjusted, and the calcinated material is pulverized to obtain powder.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在高透明度区域中具有较高导电性的透明导电粉末，并且提供一种合适的制造方法，其不需要像过去那样在强还原气氛中进行煅烧处理。解决方案：锡掺杂的氧化铟粉末包含Sn含量为SnO 2 SBS 2的Sn含量为0.1〜30重量％的粉末，比表面积为15μm2＆lt; SP＆ / SP> / g以上，粒度范围为10〜30nm，具有规定的色调，结晶度，体积电阻率和ζ电位。此外，在制造方法中，特别是二价可溶性锡化合物用于起始锡材料的掺杂，将碳酸铵加入到锡化合物和铟化合物的混合酸性液体中并混合，从而得到共沉淀氢氧化物，其在氮气气氛中煅烧，同时调节湿度，并将煅烧的材料粉碎以获得粉末。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2014187078A Metal-ceramic bonded circuit board and processes of manufacturing and inspecting the same 有权
标题翻译：金属陶瓷结合电路板及其制造及检验工艺
公开(公告)号：JP2014187078A
公开(公告)日：2014-10-02
申请号：JP2013059175
申请日：2013-03-21
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： TSUKAGUCHI NOBUYOSHI
IPC分类号： H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide processes of manufacturing and inspecting a metal-ceramic bonded circuit board by which it is reliably determined that dimensions of an entire region and all positions of a circuit pattern are within standard ranges with easy and a small number of steps.SOLUTION: The processes of manufacturing and inspecting a metal-ceramic bonded circuit board manufacture and inspect a pattern whose etching mask has a shape in which pattern dimensions are enlarged by a predetermined amount with reference to a predetermined pattern dimensions and include a pattern part for dimension measurements in which pattern dimensions are made to be further fatted or thinned within the predetermined pattern dimentional tolerance ranges with reference to the etching mask of a shape enlarged by the predetermined amount.
摘要翻译：要解决的问题：提供制造和检查金属陶瓷粘结电路板的工艺，通过该方法可靠地确定电路图案的整个区域和所有位置的尺寸在标准范围内，容易且数量少的步骤解决方案：制造和检查金属陶瓷粘合电路板的工艺制造和检查其蚀刻掩模具有的图案尺寸相对于预定图案尺寸被放大预定量的形状的图案，并且包括用于尺寸测量，其中使图形尺寸在预定图案尺寸公差范围内进一步加脂或变薄，参考放大了预定量的形状的蚀刻掩模。

5. 发明专利

JP2011211217A Manufacturing method for metal-ceramic junction circuit board 有权
标题翻译：金属陶瓷连接电路板的制造方法
公开(公告)号：JP2011211217A
公开(公告)日：2011-10-20
申请号：JP2011116526
申请日：2011-05-25
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： TSUKAGUCHI NOBUYOSHI , KIMURA MASAMI , FURO MASAHIRO , YAMANAKA YOSHINORI
IPC分类号： H05K3/06 , B23K1/00 , B23K1/018 , B23K1/19 , B23K101/42 , C04B37/02 , H05K1/03 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic junction circuit board, easily controlling a cross-sectional shape with a smaller number of steps or at a low cost, and manufacturing the circuit board that has high reliability in thermal impact resistance and insulation characteristic.SOLUTION: After a Cu plate 14 is joined to both surfaces of a ceramic substrate 10 through a solder 12, a UV-curing alkaline peeling type resist 16 is applied on a predetermined portion of the surface of Cu plate 14 for etching an unrequired portion of the Cu plate 14 to form a metal circuit part. While the resist 16 is maintained, an unnecessary solder 12 and a reactive product between the solder 12 and the ceramic substrate 10 are removed (otherwise, an unnecessary solder 12 and a reactive product between the solder 12 and the ceramic substrate 10 are removed for etching on the side surface part of the metal circuit part). Then, the resist 16 is released and Ni-P electroless plating 18 is performed.
摘要翻译：要解决的问题：为了提供一种金属陶瓷结电路板的制造方法，能够以较少的步骤或低成本容易地控制截面形状，并且制造在热冲击中具有高可靠性的电路板电阻和绝缘特性。解决方案：在通过焊料12将Cu板14接合到陶瓷衬底10的两个表面之后，将UV固化碱性剥离型抗蚀剂16施加在Cu板14的表面的预定部分上蚀刻Cu板14的不需要部分以形成金属电路部分。当保持抗蚀剂16时，去除不需要的焊料12和焊料12与陶瓷基板10之间的反应产物（否则，去除不需要的焊料12，并且去除焊料12和陶瓷基板10之间的反应产物以进行蚀刻在金属电路部分的侧表面部分上）。然后，剥离抗蚀剂16，进行Ni-P无电镀18。

6. 发明专利

JP2008179902A Method for producing spherical body and production device therefor 审中-公开
标题翻译：用于生产球体的方法及其生产装置
公开(公告)号：JP2008179902A
公开(公告)日：2008-08-07
申请号：JP2008109774
申请日：2008-04-21
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： KAWAZU KOICHI , TSUKAGUCHI NOBUYOSHI , KIOU TAKASHI , KIKUCHI KEIGO
IPC分类号： B22F9/08 , B23K35/40
摘要： PROBLEM TO BE SOLVED: To provide a means capable of easily and inexpensively producing a spherical body such as a solder ball with reduced stages.
SOLUTION: In the method where the raw material (a) of a spherical body is separated to a fixed amount in the state of a melt, and is made into a spherical form in the state of the melt by surface tension, and is cooled, so as to be solidified, the melt is dropped from a discharge port 22 at the tip of a nozzle 21 immersed below the liquid face, and an inert gas is previously bubbled, thus the raw material (a) of the spherical body is made into a spherical form in a liquid 36 in which the concentration of oxygen has been reduced, so as to be cooled.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够容易且廉价地制造具有降低的阶段的诸如焊球的球体的装置。解决方案：在熔融状态下将球体的原料（a）分离为固定量的方法中，通过表面张力在熔融状态下制成球形，冷却，使其熔融，从浸在液面下方的喷嘴21的前端的排出口22落下，预先鼓入惰性气体，从而将球体的原料（a）在液体36中被制成球形，其中氧气的浓度已经降低，从而被冷却。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2014053619A Method for manufacturing metal-ceramic bonded circuit board 有权
标题翻译：金属陶瓷结合电路板的制造方法
公开(公告)号：JP2014053619A
公开(公告)日：2014-03-20
申请号：JP2013202975
申请日：2013-09-30
申请人： Dowa Holdings Co Ltd , Dowaホールディングス株式会社
发明人： TSUKAGUCHI NOBUYOSHI , KIMURA MASAMI , FURO MASAHIRO , YAMANAKA YOSHINORI
IPC分类号： H05K3/06 , B23K1/00 , B23K1/018 , B23K1/19 , B23K101/42 , C04B37/02 , C23F1/18 , C23F1/20 , C23F1/30 , H01L23/12 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal-ceramic bonded circuit board, by which a cross-sectional shape of a metal-ceramic bonded circuit board can be easily controlled in a small number of man-hour or at a low cost, and a metal-ceramic bonded circuit board having higher reliability in thermal shock resistance or insulating property can be manufactured.SOLUTION: After a Cu plate 14 is bonded with a brazing material 12 to both surfaces of a ceramic substrate 10, a UV-curable alkali stripping type resist 16 is applied to a predetermined part on a surface of the Cu plate 14, and an unnecessary part of the Cu plate 14 is etched to form a metal circuit part. While maintaining the resist 16, an unnecessary brazing material 12 and a reaction product between the brazing material 12 and the ceramic substrate 10 are removed (otherwise, the unnecessary brazing material 12 and the reaction product between the brazing material 12 and the ceramic substrate 10 are removed and a side face of the metal circuit part is etched), and then, the resist 16 is stripped and Ni-P electroless plating 18 is applied.
摘要翻译：要解决的问题：为了提供金属 - 陶瓷粘结电路板的制造方法，通过该方法可以以少量的工时或低的速度容易地控制金属 - 陶瓷粘合电路板的截面形状可以制造具有更高的耐热冲击性或绝缘性的可靠性的金属 - 陶瓷粘合电路板。解决方案：在将铜板14与钎焊材料12接合到陶瓷基板10的两个表面上之后，将可固化碱剥离型抗蚀剂16施加到Cu板14的表面上的预定部分，并且蚀刻不需要的Cu板14的部分以形成金属电路部分。在保持抗蚀剂16的同时，除去钎焊材料12和陶瓷基板10之间的不必要的钎焊材料12和反应产物（否则，不需要的钎焊材料12和钎料12与陶瓷基板10之间的反应产物为去除金属电路部分的侧面），然后剥离抗蚀剂16，并施加Ni-P无电镀层18。

8. 发明专利

JP2007277091A Tantalum oxide and method of manufacturing the same 有权
标题翻译：氧化钽及其制造方法
公开(公告)号：JP2007277091A
公开(公告)日：2007-10-25
申请号：JP2007196372
申请日：2007-07-27
申请人： Dowa Hightech Co Ltd , Dowa Holdings Co Ltd , Dowaハイテック株式会社 , Dowaホールディングス株式会社
发明人： FUKUMOTO SATOSHI , TSUKAGUCHI NOBUYOSHI , EJIMA KOICHIRO , SEKINE ROKURO
IPC分类号： C01G35/00
摘要： PROBLEM TO BE SOLVED: To obtain a high purity tantalum oxide from which fluorine or phosphorus contained as impurities is removed as much as possible in a purification step.
SOLUTION: The tantalum oxide is obtained by leaching from tantalum scrap such as a tantalum capacitor used as a raw material with hydrofluoric acid to obtain a tantalum solution, adding an extracting agent of a phosphoric acid ester into the solution to extract tantalum in a solvent as a tantalum complex and successively back extracting the tantalum complex with an ammoniacal aqueous solution, treating the resultant tantalum solution with an adsorbent to remove organic matter, further adding an ammoniacal aqueous solution to obtain tantalum hydroxide which is dried, pulverized and fired to obtain tantalum oxide.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了获得在纯化步骤中尽可能多地除去作为杂质的氟或磷的高纯度氧化钽。解决方案：氧化钽是通过用氢氟酸作为原料的钽电容器的钽废料浸取得到钽溶液，向该溶液中加入磷酸酯的提取剂，从而提取钽作为钽络合物的溶剂，并连续地用氨水溶液反萃取钽络合物，用吸附剂处理所得钽溶液以除去有机物质，进一步加入氨水溶液以获得氢氧化钽，将其干燥，粉碎和烧制至获得氧化钽。版权所有（C）2008，JPO＆INPIT

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