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1. 发明专利

JP2011153252A Heat-conductive silicone rubber composition 有权
标题翻译：导热硅橡胶组合物
公开(公告)号：JP2011153252A
公开(公告)日：2011-08-11
申请号：JP2010016719
申请日：2010-01-28
申请人： Dow Corning Toray Co Ltd , 東レ・ダウコーニング株式会社
发明人： KODAMA HARUMI , ONISHI MASAYUKI , SAKAGUCHI RYO , NAKAYOSHI KAZUMI
IPC分类号： C08L83/07 , C08K3/00 , C08K5/5415 , C08K5/5425 , C08K9/06 , C08L83/05
CPC分类号： H01L23/296 , C08G77/20 , C08L83/04 , H01L2924/0002 , H01L2924/09701 , C08L83/00 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a heat-conductive silicone rubber composition with reduced amount of a low-boiling point component vaporized in the midway of curing and a bleeding-out oil component therein.
SOLUTION: This heat-conductive silicone rubber composition comprises (A) an organopolysiloxane having at least two silicon atom-coupled alkenyl groups in one molecule, having no hydroxy group and no alkoxy group coupled to a silicon atom, and containing 1,000 ppm or less of content of cyclic siloxane comprising four monomeric units to twenty monomeric units, (B) an organopolysiloxane having at least two silicon atom-coupled hydrogens in one molecule, and having no alkenyl group, no hydroxy group and no alkoxy group coupled to a silicon atom, (C) an adhesiveness-imparting agent, (D) a heat-conductive filler, and (E) a hydrosilylation reaction catalyst, and total amount of the component (B) and the component (C) is 0,5-10 mass% of total amount of the component (A), the component (B) and the component (C), in the heat-conductive silicone rubber composition.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供在固化中途蒸发的低沸点成分量减少的导热硅橡胶组合物和其中的渗出油组分。解决方案：该导热硅橡胶组合物包含（A）在一分子中具有至少两个硅原子连接的烯基，不具有羟基且没有与硅原子偶合的烷氧基的有机聚硅氧烷，并且含有1,000ppm 或更少的包含四个单体单元至20个单体单元的环状硅氧烷的含量，（B）在一个分子中具有至少两个硅原子耦合的氢并且不具有烯基，不具有羟基并且没有烷氧基与硅原子，（C）粘合性赋予剂，（D）导热性填料，（E）氢化硅烷化反应催化剂，成分（B）和成分（C）的总量为0,5- 导热性硅橡胶组合物中组分（A），组分（B）和组分（C）的总量的10质量％。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011153253A Electronic device and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：JP2011153253A
公开(公告)日：2011-08-11
申请号：JP2010016844
申请日：2010-01-28
申请人： Denso Corp , Dow Corning Toray Co Ltd , 東レ・ダウコーニング株式会社 , 株式会社デンソー
发明人： HIRASAWA NORIYA , OTANI YUJI , ASAI SHOKI , IMAI HIROKAZU , KUNIEDA HIROYOSHI , KODAMA HARUMI , ONISHI MASAYUKI , SAKAGUCHI RYO , NAKAYOSHI KAZUMI
IPC分类号： C09J183/07 , C09J11/04 , C09J11/06 , C09J183/05 , H01L21/52
CPC分类号： H01L23/4334 , C08G77/04 , C08G77/20 , C08L83/04 , H01L23/296 , H01L23/3121 , H01L23/36 , H01L23/49531 , H01L24/13 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce a emission rate of siloxane gas as much as possible when a silicone adhesive is heated and cured. SOLUTION: The silicone adhesive 30 includes: (A) 100 pts.mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups, wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass%; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 pts.mass of an adhesion promoter; (D) 100 to 2,000 pts.mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. The blending amount of (B) is such that the amount of the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass% of the sum of (A), (B) and (C). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：当硅氧烷粘合剂被加热和固化时，尽可能地降低硅氧烷气体的排放速率。解决方案：硅氧烷粘合剂30包括：（A）100分钟的一分子中含有至少两个烯基并且不含与硅键合的羟基和烷氧基的有机聚硅氧烷，其中环状硅氧烷的含量为4 至20个硅氧烷单元为0.1质量％以下。（B）在一个分子中含有至少两个与硅键合的氢原子并且不含烯基的有机聚硅氧烷和与硅键合的羟基和烷氧基; （C）至少0.05份粘附促进剂; （D）100至2,000磅的导热填料; 和（E）氢化硅烷化反应催化剂。（B）的配合量使得与（A）的链烯基相比，硅键合的氢原子的量为0.5〜10摩尔的范围，（B）和（C ）为（A），（B）和（C）之和的0.5〜10质量％。版权所有（C）2011，JPO＆INPIT

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