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    • 1. 发明专利
    • Resin composition and method for modifying surface of component
    • 用于修饰组分表面的树脂组合物和方法
    • JP2010132843A
    • 2010-06-17
    • JP2008312721
    • 2008-12-08
    • Denki Kagaku Kogyo Kk電気化学工業株式会社
    • EDA YUKIOIBAYASHI TOSHISHIGEOKADA TAKUYAHIYAMA SHIGEO
    • C08L83/04C08K3/00C09D5/00C09D7/12C09D183/04
    • PROBLEM TO BE SOLVED: To provide a component having reduced contact thermal resistance with other components to improve heat dissipation characteristics of the component in contact with the other components. SOLUTION: The resin composition includes 40-75 vol.% of a polyorganosiloxane having an average molecular weight of ≥10,000 and ≤50,000 and 25-60 vol.% of an inorganic filler having a maximum particle diameter of ≤80 μm and has a viscosity of 500-10,000 mPa s. Preferably, the inorganic filler for the resin composition is one or more substances selected from the group consisting of alumina, silicon carbide, aluminum nitride, boron nitride, silicon nitride, silver, copper, aluminum, carbon, diamond, zinc oxide, magnesia, aluminum hydroxide and magnesium hydroxide. Preferably, the inorganic filler for the resin composition has an average particle diameter of ≥1.5 μm and COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供具有降低的接触热阻与其他部件的部件,以改善与其它部件接触的部件的散热特性。 解决方案:树脂组合物包含40-75体积%的平均分子量≥10,000和≤50,000的聚有机硅氧烷和25-60体积%的最大粒径≤80微米的无机填料和 具有500-10,000mPa·s的粘度。 优选地,用于树脂组合物的无机填料是选自氧化铝,碳化硅,氮化铝,氮化硼,氮化硅,银,铜,铝,碳,金刚石,氧化锌,氧化镁,铝的一种或多种物质 氢氧化物和氢氧化镁。 优选地,用于树脂组合物的无机填料的平均粒径≥1.5μm,<4.5μm,最大粒径≤20μm。 版权所有(C)2010,JPO&INPIT
    • 2. 发明专利
    • High-heat conductive resin composition
    • 高导热树脂组合物
    • JP2013056996A
    • 2013-03-28
    • JP2011195888
    • 2011-09-08
    • Denki Kagaku Kogyo Kk電気化学工業株式会社
    • YAMAGATA TOSHITAKAHIYAMA SHIGEOTAMURA TOSHIYUKI
    • C08L101/00C08K3/22C08K7/18C08K9/06H01L23/373
    • PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat conductivity, particularly to provide a resin composition suitable as a heat dissipation member for electronic parts.SOLUTION: The high-heat conductive resin composition contains 80 to 90 vol% of a spherical aluminum oxide powder and an aluminum oxide powder, wherein the spherical aluminum oxide powder has an average sphericity of ≥0.85, ≤30 hydroxide groups/nmand an average particle diameter of 10 to 50 μm; the aluminum oxide powder has an average particle diameter of 0.3 to 1 μm; and the blend proportion of the spherical aluminum oxide powder and the aluminum oxide powder is 5:5 to 9.5:0.5 in volume ratio. The spherical aluminum oxide powder and the aluminum oxide powder are preferably surface treated with a silane coupling agent.
    • 要解决的问题:提供导热性优异的树脂组合物,特别是提供适合作为电子部件的散热构件的树脂组合物。 解决方案:高导热性树脂组合物含有80〜90体积%的球形氧化铝粉末和氧化铝粉末,其中球形氧化铝粉末的平均球形度≥0.85,≤30氢氧化物组/ nm 2 ,平均粒径为10〜50μm; 氧化铝粉末的平均粒径为0.3〜1μm; 并且球形氧化铝粉末和氧化铝粉末的共混比例为体积比为5:5至9.5:0.5。 球形氧化铝粉末和氧化铝粉末优选用硅烷偶联剂进行表面处理。 版权所有(C)2013,JPO&INPIT
    • 3. 发明专利
    • Electromagnetic wave absorber
    • 电磁波吸收器
    • JP2005317825A
    • 2005-11-10
    • JP2004135216
    • 2004-04-30
    • Denki Kagaku Kogyo Kk電気化学工業株式会社
    • KAWASAKI TAKUOKADA TAKUYAHIYAMA SHIGEO
    • H05K9/00H01Q17/00
    • PROBLEM TO BE SOLVED: To provide an electromagnetic wave absorber having an excellent electromagnetic wave absorbing characteristic.
      SOLUTION: The electromagnetic wave absorber comprises a boron carbide powder having an electrical conductivity of not less than 5×10
      -6 (S/cm), and a carbon powder having a DBP (dibutyl phthalate) absorbed amount of 50 to 300 (cm
      3 /100g) and an electrical conductivity of not less than 5 (S/cm). Preferably, a total amount of boron carbide powder and the carbon powder of 10 to 70 vol.% is included, and the remains comprise a matrix material, with the 5 to 60 vol.% boron carbide powder and the 1 to 20 Vol.% carbon powder included. The electromagnetic wave absorber is appropriate for the electromagnetic wave absorber of an electronic toll collection system (ETC), a car-mounted radar device, and a home information appliances.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 解决的问题:提供具有优异的电磁波吸收特性的电磁波吸收体。 解决方案:电磁波吸收器包括导电率不小于5×10 -6 SP /(S / cm)的碳化硼粉末和具有DBP(邻苯二甲酸二丁酯)的碳粉末 )吸收量为50〜300(cm 3 / SP / 100g),导电率为5(S / cm)以上。 优选地,包括10至70体积%的碳化硼粉末和碳粉末的总量,并且剩余物包含基质材料,其中5至60体积%的碳化硼粉末和1至20体积% 包括碳粉。 电磁波吸收器适用于电子收费系统(ETC),车载雷达设备和家庭信息设备的电磁波吸收器。 版权所有(C)2006,JPO&NCIPI
    • 4. 发明专利
    • Heat dissipating member and method of manufacturing the same
    • 散热构件及其制造方法
    • JP2011151280A
    • 2011-08-04
    • JP2010012770
    • 2010-01-25
    • Denki Kagaku Kogyo Kk電気化学工業株式会社
    • NARA TOMOYUKIEDA YUKIOOKADA TAKUYAIBAYASHI TOSHISHIGEHIYAMA SHIGEO
    • H01L21/3065
    • PROBLEM TO BE SOLVED: To provide a heat dissipating member that has superior heat dissipation characteristics by printing and applying a resin composition with superior thermal conductivity to a member and curing the resin composition, and a method of manufacturing the same. SOLUTION: The heat dissipating member is formed by printing and applying resin composition which contains 40 to 75 vol.% of polyorganosiloxane and 25 to 60 vol.% of an inorganic filler of ≤80 μm in maximum particle size, and has a viscosity of 500 to 50,000 mPa s to the member, and curing the resin composition on the member. It is preferred that the polyorganosiloxane has an average molecular weight of 10,000 to 50,000. The inorganic filler preferably includes one or more kinds selected from the group of alumina, silicon carbide, aluminum nitride, boron nitride, silicon nitride, silver, copper, aluminum, carbon, diamond, zinc oxide, magnesia, aluminum hydroxide, and magnesium hydroxide. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供具有优异的散热特性的散热构件及其制造方法,通过将具有优良导热性的树脂组合物印刷并施加到构件上并固化该树脂组合物而具有优异的散热特性。 解决方案:散热构件通过印刷和涂布树脂组合物形成,该组合物含有40至75体积%的聚有机硅氧烷和25至60体积%的最大粒径≤80微米的无机填料,并且具有 粘度为500〜50,000mPa·s,并使树脂组合物固化。 聚有机硅氧烷的平均分子量优选为10,000〜50,000。 无机填料优选包括选自氧化铝,碳化硅,氮化铝,氮化硼,氮化硅,银,铜,铝,碳,金刚石,氧化锌,氧化镁,氢氧化铝和氢氧化镁中的一种或多种。 版权所有(C)2011,JPO&INPIT