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1. 发明专利

JP2014213238A フィルタ装置、フィルタ材およびフィルタ材用シート有权
标题翻译：过滤装置，过滤材料和过滤材料
公开(公告)号：JP2014213238A
公开(公告)日：2014-11-17
申请号：JP2013090720
申请日：2013-04-23
申请人：大日本印刷株式会社 , Dainippon Printing Co Ltd
发明人： ISHIKAWA HIROYUKI , SUGANUMA MEGUMI , NAGATA MASAHIRO , UMEDA KAZUO
IPC分类号： B01D29/11 , B01D24/00 , B01D39/20
CPC分类号： B01D39/20
摘要：【課題】ある形状以上の大きさの異物を確実に除去することができ、かつフィルタ部材内部を流れる流体の流れの均一化を図る。【解決手段】フィルタ装置10は多数の開孔11aを有するとともに一側に開口13が形成された円筒状側壁11Aと、円筒状側壁11Aの他側に設けられた閉止底部14とを有するフィルタ材11と、フィルタ材11の開口13側に設けられたフランジ15とを備えている。フィルタ材11の貫通孔11aは互いに同一形状をもち、単位面積当りの貫通孔11aの開孔数は開口13側から閉止底部14側へ向って増加している。【選択図】図1
摘要翻译：要解决的问题：可靠地去除尺寸大于一定形状的异物并使过滤构件内流动的流体流动均匀。过滤装置10包括：过滤材料11，其包括圆柱形侧壁 11A具有许多开口11a，并且在其一侧上形成有开口13和设置在圆筒形侧壁11A的另一侧上的封闭底部14; 以及设置在过滤材料11的开口13的一侧的凸缘15.过滤材料11的透孔11a相互具有相同的形状，每单位面积的通孔11a的数量随着朝向侧面而增加的封闭底部14从开口13的一侧开始。

2. 发明专利

JP2006100703A Rigid-flexible substrate and manufacturing method therefor 有权
标题翻译：刚性基板及其制造方法
公开(公告)号：JP2006100703A
公开(公告)日：2006-04-13
申请号：JP2004287146
申请日：2004-09-30
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： KOBAYASHI ATSUSHI , UMEDA KAZUO , SAWARA TAKAHIRO , NAKAZAWA SUSUMU
IPC分类号： H05K3/46 , H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a rigid-flexible substrate in which a joint between the rigid and flexible substrates is strongly adhered, which comprises a simple process, and which provides a high material yield and a high product yield.
SOLUTION: A rigid substrate having a vertical wiring formed in a joint region and a flexible substrate having a connection terminal formed at an end are separately manufactured. The joint regions of the rigid substrate are spot faced deeper than the thickness of the flexible substrate to form steps. The connection terminals of the flexible substrate are connected to the vertical wirings of the steps. Another rigid substrate is laminated to cover the flexible substrate on the steps and the upper surface of the rigid substrate having the steps as the same plane.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种刚性柔性基板的制造方法，其中刚性和柔性基板之间的接合被牢固地粘附，其包括简单的工艺，并且提供高材料产率和高产品产量。解决方案：分别制造在接合区域中形成有垂直布线的刚性基板和在端部形成有连接端子的柔性基板。刚性基板的接合区域比点状的柔性基板的厚度更深地形成台阶。柔性基板的连接端子与台阶的垂直布线连接。层叠另一刚性基板以覆盖台阶上的柔性基板，并且刚性基板的上表面具有作为同一平面的台阶。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004345118A Screen printing apparatus and squeegee for screen printing 有权
公开(公告)号：JP2004345118A
公开(公告)日：2004-12-09
申请号：JP2003141920
申请日：2003-05-20
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： UCHIUMI TSUTOMU , UMEDA KAZUO , TSUNODA TAKESHI , TANAKA HITOSHI , KAMEGAWA NAOTO , TERAUCHI TAKAYUKI
IPC分类号： B41F15/44 , B41F15/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To bulkily stick a pasty article corresponding to an ink on an article to be printed in a screen printing apparatus for printing the article to be printed by a screen mask and a squeegee for screen printing therefor.
SOLUTION: The screen printing apparatus is equipped with the squeegee which has the first edge and the second edge positioned at a back part in the direction to which the first edge advances on a printing face and retreated in the vertical direction to the printing face more than the first edge, a printing base for providing the printing face on which the squeegee advances, and a screen mask installing part which is separated from the printing base and is capable of extending a screen mask facing to the printing base. A paste is filled in extrusion holes of the screen mask by the first edge, and when the first edge is moved and the screen mask is separated a little from the article to be printed, the second edge is moved to additionally feed the paste into the extrusion holes.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004338341A Screen printing method and equipment 审中-公开
公开(公告)号：JP2004338341A
公开(公告)日：2004-12-02
申请号：JP2003140572
申请日：2003-05-19
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： ETO MINEAKI , UMEDA KAZUO , TSUNODA TAKESHI , TANAKA HITOSHI , NAGASHIMA MASAYUKI , KAMEGAWA NAOTO , TERAUCHI TAKAYUKI
IPC分类号： B41F15/16 , B41F15/08 , B41F15/12 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To bulkily adhere a paste-like substance corresponding to ink to a matter to be printed in a screen printing and equipment for executing printing to the matter to be printed with a screen mask.
SOLUTION: The matter to be printed is held on a printing stand so as to be faced to the screen mask under the state being separated from the held matter to be printed in order to lower the temperature of the matter to be printed while dew condensation and freezing are prevented from developing on the held matter to be printed in order to linearly abut the screen mask on the matter to be printed, the temperature of which has been lowered, under the condition that a squeegee is pressed through paste against the screen mask so that the paste is transferred to the matter to be printed by moving the squeegee towards the direction across with the abutting direction so as to move the abutting position of the matter to be printed with the screen mask.
COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2012089216A Substrate for suspension, manufacturing method of substrate for suspension, suspension, suspension with element, and hard disk drive 有权
标题翻译：用于悬架的基板，用于悬架，悬架，悬挂单元和硬盘驱动器的基板的制造方法
公开(公告)号：JP2012089216A
公开(公告)日：2012-05-10
申请号：JP2010237304
申请日：2010-10-22
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UMEDA KAZUO , OTA TAKAYUKI
IPC分类号： G11B21/21 , G11B5/60
摘要： PROBLEM TO BE SOLVED: To provide a substrate for suspension preventing a seed layer existing under a wiring layer from being excessively etched.SOLUTION: The present invention solve the above problem by providing a substrate for suspension having a metal support substrate, an insulation layer formed on the metal support substrate and a wiring layer formed on the insulation layer, where the substrate for suspension is characterized by having, between the insulation layer and the wiring layer, a diffusion part obtained by mutual diffusion of the metal components of a first metal part formed on the insulation layer and a second metal part formed on the first metal part, the second metal part having a metal component different from the first metal part.
摘要翻译：要解决的问题：提供一种用于防止存在于布线层下面的种子层的悬浮基板被过度蚀刻。解决方案：本发明通过提供一种具有金属支撑基板，形成在金属支撑基板上的绝缘层和形成在绝缘层上的布线层的悬架基板，解决了上述问题，其中悬浮基板被表征通过在所述绝缘层和所述布线层之间具有由形成在所述绝缘层上的第一金属部件的金属部件和形成在所述第一金属部件上的第二金属部件相互扩散而获得的扩散部，所述第二金属部件具有与第一金属部件不同的金属部件。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2010097659A Suspension substrate, suspension, suspension with head and hard disk drive 有权
标题翻译：悬挂基板，悬架，悬挂带头和硬盘驱动器
公开(公告)号：JP2010097659A
公开(公告)日：2010-04-30
申请号：JP2008268078
申请日：2008-10-17
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UMEDA KAZUO , KONO SHIGEKI , MIYAZAWA HIROAKI
IPC分类号： G11B5/60 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To provide a suspension substrate which has wiring disposed in a magnetic head slider mounting area and its vicinity, and has high electric stability for a magnetic head slider, grounding performance and adhesive strength. SOLUTION: The suspension substrate includes a metal substrate 1, an insulating layer 2 formed on the metal substrate, a signal wiring 13 formed on the insulating layer, and further includes a gimbal section 11 having a magnetic head slider mounting area for mounting a magnetic head slider. The suspension substrate includes at least one of a wiring formed in the magnetic head slider mounting area and a wiring formed outside the mounting area and in a position where the magnetic head slider is brought into contact with the gimbal section by distortion of the gimbal section, and a ground terminal 4 for supporting the magnetic head slider and electrically connecting the grounding electrode part of the magnetic head slider and the metal substrate. The vertex of the ground terminal is higher than that of the wiring. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有布置在磁头滑动器安装区域及其附近的布线的悬置基板，并且对于磁头滑块具有高的电稳定性，接地性能和粘合强度。解决方案：悬架基板包括金属基板1，形成在金属基板上的绝缘层2，形成在绝缘层上的信号布线13，还包括具有用于安装的磁头滑块安装区域的万向节部分11 磁头滑块。悬架基板包括形成在磁头滑动器安装区域中的布线和形成在安装区域外部的布线中的至少一个，并且在磁头滑块通过万向节部分的扭曲而与万向节部分接触的位置中，以及用于支撑磁头滑块并电连接磁头滑块的接地电极部分和金属基板的接地端子4。接地端子的顶点高于接线端子的顶点。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2006245122A Wiring member and method of manufacturing wiring member 有权
标题翻译：接线构件和制造接线构件的方法
公开(公告)号：JP2006245122A
公开(公告)日：2006-09-14
申请号：JP2005056200
申请日：2005-03-01
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UMEDA KAZUO , SHIBAZAKI SATOSHI , SAKAMOTO AKIRA
IPC分类号： H05K1/02 , G11B5/60 , G11B21/21 , H05K1/05 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a flexure which has a wiring structure which corresponds to further high speed of a signal of a wireless suspension and is a member of the wireless suspension, and to provide a manufacturing method thereof.
SOLUTION: In the wiring member in which a wiring is formed on a supporting base material, the wiring consists of wiring sections 121, 122 consisting of an electrolytic copper foil 120, and wiring sections 131, 132, 133 consisting of a rolled copper foil 130. The wiring member is provided with a microstrip circuit section in which one type of the wiring section consisting of the electrolytic copper foil and the wiring section consisting of the rolled copper foil is used as a signal path and the other type is used as a ground section. Since the one type is used as the signal path and the other is used as the ground section, a microstrip structure in electric characteristic is formed and a signal characteristic in high-frequency operation is improved, and providing an ultrasonic bonding connection portion in the wiring consisting of the rolled copper foil enables improvement of the ultrasonic bonding properties.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有对应于无线悬架的信号的进一步高速度的布线结构并且是无线悬架的成员的挠曲件，并且提供其制造方法。解决方案：在支撑基材上形成布线的布线部件中，布线由电解铜箔120构成的布线部分121,122和由卷绕的布线部分131,132,133组成。布线构件设置有微带电路部分，其中使用由电解铜箔组成的一种类型的布线部分和由卷绕的铜箔组成的布线部分作为信号路径，并且使用另一种类型作为地面部分。由于将一种类型用作信号路径而另一种用作接地部分，所以形成电特性的微带结构，并提高高频操作中的信号特性，并且在布线中提供超声波接合连接部分由轧制的铜箔构成，能够提高超声波接合性能。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2006100704A Rigid-flexible substrate and manufacturing method therefor 有权
标题翻译：刚性基板及其制造方法
公开(公告)号：JP2006100704A
公开(公告)日：2006-04-13
申请号：JP2004287147
申请日：2004-09-30
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： KOBAYASHI ATSUSHI , UMEDA KAZUO , SAWARA TAKAHIRO , NAKAZAWA SUSUMU
IPC分类号： H05K3/46 , H05K1/14 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a rigid-flexible substrate in which flexibility and elasticity of a flexible part is not impaired even if wiring density is increased, which comprises a simple process, and which provides a high material yield and a high product yield.
SOLUTION: A rigid substrate having a vertical wiring formed in a joint region and a flexible substrate having a connection terminal formed at an end are separately manufactured. Positions of the rigid substrate corresponding to the edges of both surfaces of the flexible substrate are spot faced equally to or deeper than the thickness of the flexible substrate to form steps. The connection terminal of each one end of two flexible substrates is connected to the vertical wiring of the step.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种制造柔性基板的方法，其中柔性部件的柔性和弹性即使布线密度增加也不会受损，其包括简单的工艺，并且提供高材料产率高，产品产量高。解决方案：分别制造在接合区域中形成有垂直布线的刚性基板和在端部形成有连接端子的柔性基板。对应于柔性基板的两个表面的边缘的刚性基板的位置等同地等于或深于柔性基板的厚度以形成台阶。两个柔性基板的每一端的连接端子连接到台阶的垂直布线。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2004095912A Printed wiring board, method of manufacturing the same, and conductor plate with bump 审中-公开
公开(公告)号：JP2004095912A
公开(公告)日：2004-03-25
申请号：JP2002256124
申请日：2002-08-30
申请人： Dainippon Printing Co Ltd , Dt Circuit Technology Co Ltd , ディー・ティー・サーキットテクノロジー株式会社 , 大日本印刷株式会社
发明人： UMEDA KAZUO , KOBAYASHI ATSUSHI , MURATA YOSHINORI , SASAOKA KENJI , MORIOKA NAOKI
IPC分类号： H05K1/11 , H01L23/12 , H05K3/24 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which is highly accurate and exhibits reliable interlayer connections. SOLUTION: First masking films 20 are formed on a metal plate 11, and then the metal plate 11 is subjected to half etching for the formation of nearly conical metal bumps 11B. Then, a prepreg 12 is superposed on the surface of the metal plate 11 where the metal bumps 11B are formed, and the metal bumps 11B are made to penetrate through the prepreg 12 by hot pressing. The other metal plate where a conductive layer 34 is formed on its surface confronted with the metal bumps 11B is superposed on tops of the metal bumps 11B, and the metal plate 11 and the other metal plate are hot-pressed. Then, second masking films 41 are formed on the wiring pattern corresponding part of the rear surface of the metal plate 11, and a etching process is performed from above the second masking films 41 so as to form a first wiring pattern 43 from the metal plate 11. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2000077254A Production of multilayered capacitor 审中-公开
标题翻译：生产多层电容器
公开(公告)号：JP2000077254A
公开(公告)日：2000-03-14
申请号：JP24681698
申请日：1998-09-01
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： UMEDA KAZUO , KONNO KATSUTOSHI
IPC分类号： H01G4/12 , H01G4/30 , H01G13/00
CPC分类号： H01G4/30
摘要： PROBLEM TO BE SOLVED: To produce a multiplayered capacitor efficiently with high yield by hot pressing a laminate in order to burn out a carrier sheet and organic binder in conductive paste and then forming an external electrode through reductive firing.
SOLUTION: Lamination is repeated in the order of a green sheet 2, a pattern sheet 1A, a green sheet 2, a pattern sheet 1B, a green sheet 2, a pattern sheet 1A, and a green sheet 2 is laminated finally. A resulting laminate is hot pressed in order to eliminate interlayer air gaps and to burn out a carrier sheet and organic binder in conductive paste. Subsequently, a chip-like laminate cut into specified size is fired to produce a ceramic green sheet 2, i.e., a dielectric. Finally, an outer electrode is formed at the end part of the chip laminate.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：为了通过热压层压体以高产率有效地生产多电容电容器，以便将导电浆料中的载体片和有机粘合剂烧尽，然后通过还原烧制形成外部电极。解决方案：重复按照生片2，图案片1A，生片2，图案片1B，生片2，图案片1A和生片2的顺序重复层叠。将得到的层压体进行热压以消除层间气隙，并将导电浆料中的载体片和有机粘结剂烧尽。随后，将切割成规定尺寸的切屑状层压体烧制以制造陶瓷生片2，即电介质。最后，在芯片层叠体的端部形成有外部电极。

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