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1. 发明专利

JP2014136304A Molding die, manufacturing method of the same, structure, and manufacturing method of the same 审中-公开
标题翻译：模具，其制造方法，其结构和制造方法
公开(公告)号：JP2014136304A
公开(公告)日：2014-07-28
申请号：JP2013007426
申请日：2013-01-18
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SEKI MASASHI
IPC分类号： B81C1/00 , B29C33/38 , B81B1/00
摘要： PROBLEM TO BE SOLVED: To provide a structure formed with a fine machining surface at a part thereof, and having a complicated three-dimensional structure as a while, and a manufacturing method of the same.SOLUTION: A structure 10 includes a recessed portion 11, a first channel 12 communicating with the recessed portion 11, and a second channel 13 communicating with the recessed portion 11. A bottom surface 22 of the first channel 12 and a bottom surface 33 of the second channel 13 have different height from each other. On the bottom surface 22 of the first channel 12 and the bottom surface 33 of the second channel 13, fine machining surfaces 24 and 34 are respectively provided.
摘要翻译：要解决的问题：提供一部分形成有精加工表面的结构，并且具有复杂的立体结构及其制造方法。结构10包括凹部11 与凹部11连通的第一通道12和与凹部11连通的第二通道13.第一通道12的底面22和第二通道13的底面33具有彼此不同的高度。在第一通道12的底表面22和第二通道13的底表面33上分别设有精加工表面24和34。

2. 发明专利

JP2013022689A Minute through-hole forming apparatus, method of manufacturing minute through-hole molded article, and filter for mist formation manufactured by the method 有权
标题翻译：分钟孔形成装置，制造分钟通孔的模制品的方法和用于由方法制造的喷雾过滤器
公开(公告)号：JP2013022689A
公开(公告)日：2013-02-04
申请号：JP2011160346
申请日：2011-07-21
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMADA KANEO , FUJITA HIROSHI , NAGANUMA HIROYUKI , SEKI MASASHI , YANAGA TAKESHI , TAGUCHI TETSUYA
IPC分类号： B26F1/26 , B29C67/20
摘要： PROBLEM TO BE SOLVED: To provide a minute through-hole forming apparatus easily forming many minute through holes in a sheet of synthetic resin in a short period of time.SOLUTION: The minute through-hole forming apparatus includes: a cradle; a back sheet which is held on the cradle, has heat resistance, and supports a base material sheet made of synthetic resin; and an ultrasonic molding die which is arranged above the back sheet and has many projection parts at a lower part. The cradle includes a temperature controller which warms an upper surface of the cradle to desired temperature, and thereby heats the base material sheet arranged above the back sheet to the desired temperature. The ultrasonic molding die becomes movable up and down, the projection parts ultrasonically vibrate to warm the cradle and to heat the base material sheet substantially up to the glass transition temperature to the softening temperature of the synthetic resin. Then the ultrasonic molding die moves down, the projection parts abut against the base material sheet and heat the base material sheet by vibration, and the projection parts are penetrated up to a lower surface of the base material sheet to form many minute through holes in the base material sheet.
摘要翻译：要解决的问题：提供一种在短时间内容易地在合成树脂片中形成许多分钟通孔的微小通孔形成装置。解决方案：微小通孔形成装置包括：支架; 保持在支架上的背板具有耐热性，并且支撑由合成树脂制成的基材片; 以及设置在所述背板上方并且在下部具有许多突出部的超声波成型模具。支架包括温度控制器，其将支架的上表面加热到所需温度，从而将布置在背板上的基材片加热到所需温度。超声波成型模可以上下移动，突起部超声波振动以使托架加热，并将基材片基本达到玻璃化转变温度至合成树脂的软化温度。然后超声波成型模具向下移动，突起部分抵靠基材片材并通过振动加热基材片材，并且突出部分被穿透到基材片材的下表面，以在基片材料片材的下表面上形成许多分钟通孔基材片。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013094888A Micro through-hole forming device, method of manufacturing micro through-hole formed product, and micro through-hole formed product 有权
标题翻译：微通孔形成装置，制造微孔形成的产品的方法和微孔形成的产品
公开(公告)号：JP2013094888A
公开(公告)日：2013-05-20
申请号：JP2011239138
申请日：2011-10-31
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMADA KANEO , FUJITA HIROSHI , NAGANUMA HIROYUKI , SEKI MASASHI , YANAGA TAKESHI , TAGUCHI TETSUYA
IPC分类号： B26F1/26 , A61M11/00 , B29C67/20
摘要： PROBLEM TO BE SOLVED: To provide a micro through-hole forming device capable of easily and efficiently forming many micro through-holes in a pre-form of synthetic resin in a simple manner and in a short time, and manufacturing a micro through-hole formed product containing a flat plate having many micro through-holes and a peripheral edge flange provided at the outer periphery of the flat plate.SOLUTION: A micro through-hole forming device 10 includes a supporting base 11, a back sheet 12 which is held on the supporting base 11 and has heat resistance, and an ultrasonic form block 30 which is disposed above the back sheet 12 and has many projections 31 at a lower part. The back sheet 12 supports a pre-form 20 of synthetic resin that contains a flat plate 21 and a peripheral edge flange 22 which is provided at the outer periphery of the flat plate 21 and has a wall thickness larger than that of the flat plate 21. An ultrasonic form block 30 is vertically movable and ultrasonic-vibrated in the vertical direction so that the flat plate 21 of the pre-form 20 is heated by vibration, thereby melting the flat plate 21 to form many micro through-holes 41.
摘要翻译：要解决的问题：提供一种能够以简单的方式和短时间在合成树脂的预成型中容易且有效地形成许多微通孔的微通孔形成装置，并且制造微观该通孔成形体含有具有多个微通孔的平板和设置在平板的外周的周缘凸缘。解决方案：微通孔形成装置10包括支撑基座11，保持在支撑基座11上并具有耐热性的背板12和设置在背板12上方的超声波模块30 并且在下部具有许多突起31。背板12支撑合成树脂的预成型件20，其包含平板21和设置在平板21的外周处且具有比平板21的壁厚大的壁厚的周缘凸缘22 超声波形成块30可垂直移动并在垂直方向上超声波振动，从而使预成型体20的平板21受到振动加热，从而熔化平板21以形成许多微通孔41。 P>版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2014136303A Structure, manufacturing method of structure, and manufacturing method of molded article 有权
标题翻译：结构的制造方法和结构的制造方法和制造方法
公开(公告)号：JP2014136303A
公开(公告)日：2014-07-28
申请号：JP2013007421
申请日：2013-01-18
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SEKI MASASHI , ITO NOBUYUKI , CHIBA TAKESHI
IPC分类号： B81C3/00 , B81B1/00
摘要： PROBLEM TO BE SOLVED: To provide a structure formed with a fine machining surface at a part thereof, and having a complicated three-dimensional structure as a whole.SOLUTION: A structure 10 has a recessed portion 11, a first channel 12 communicating with the recessed portion 11, and a second channel 13 communicating with the recessed portion 11. The 10 includes a first base material 20 having a lower part 21 of the recessed portion 11 and a bottom surface 22 of the first channel 12; a second base material 30 laminated on the first base material 20, and having a first recessed portion through-hole 31, a first channel through-hole 32, and a bottom surface 33 of the second channel 13; and a third base material 40 laminated on the second base material 30, and having a second recessed portion through-hole 41, a second channel through-hole 42, and a third channel through-hole 43. On the bottom surface 22 of the first channel 12 of the first base material 20 and the bottom surface 33 of the second channel 13 of the second base material 30, fine machining surfaces 24 and 34 are respectively provided.
摘要翻译：要解决的问题：提供在其一部分形成有精加工表面的结构，并且整体上具有复杂的三维结构。结构：结构10具有凹部11，与第一通道12连通的第一通道12 凹部11和与凹部11连通的第二通道13.10包括具有凹部11的下部21和第一通道12的底面22的第一基材20。层叠在第一基材20上的第二基材30，具有第一凹部通孔31，第一通道通孔32和第二通道13的底面33; 以及层叠在第二基材30上的第三基材40，具有第二凹部通孔41，第二通道通孔42和第三通道通孔43。分别设置第一基材20的通道12和第二基材30的第二通道13的底面33，精加工表面24和34。

5. 发明专利

JP2013220502A Positioning system, positioning method, structure manufacturing method, and die with alignment mark 有权
标题翻译：定位系统，定位方法，结构制造方法和对齐标记
公开(公告)号：JP2013220502A
公开(公告)日：2013-10-28
申请号：JP2012093288
申请日：2012-04-16
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SEKI MASASHI
IPC分类号： B23Q17/24 , B23Q15/24
摘要： PROBLEM TO BE SOLVED: To provide a positioning system capable of easily acquiring positions of a rotating tool and a work relative to each other, and capable of easily positioning the rotating tool and the work.SOLUTION: A positioning system 10 includes: a loading stand 11 to be loaded with a work 30 including a projecting alignment mark 40; a rotating tool 12 for cutting the work 30 loaded on the loading stand 11; a tool holding part 13 for holding the rotating tool 12; and a detector 14 for detecting external forms of the alignment mark 40 and the rotating tool 12. The detector 14 detects the external forms of the alignment mark 40 and the rotating tool 12 from at least two directions on sides of the work 30. Positioning of the alignment mark 40 and the rotating tool 12 is performed based on a result of the detection from the detector 14.
摘要翻译：要解决的问题：提供一种能够容易地获取旋转工具和工件相对于彼此的位置并且能够容易地定位旋转工具和工件的定位系统。解决方案：定位系统10包括：装载架 11装载有包括突出对准标记40的工件30; 用于切割装载在装载台11上的工件30的旋转工具12; 用于保持旋转工具12的工具保持部13; 以及用于检测对准标记40和旋转工具12的外部形式的检测器14.检测器14从工件30的至少两个方向检测对准标记40和旋转工具12的外部形式。定位基于来自检测器14的检测结果来执行对准标记40和旋转工具12。

6. 发明专利

JP2013094890A Micro through-hole forming device, method of manufacturing micro through-hole formed product, and micro through-hole formed product 有权
标题翻译：微通孔形成装置，制造微孔形成的产品的方法和微孔形成的产品
公开(公告)号：JP2013094890A
公开(公告)日：2013-05-20
申请号：JP2011239146
申请日：2011-10-31
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMADA KANEO , FUJITA HIROSHI , NAGANUMA HIROYUKI , SEKI MASASHI , YANAGA TAKESHI , TAGUCHI TETSUYA
IPC分类号： B26F1/26
摘要： PROBLEM TO BE SOLVED: To provide a micro through-hole forming device capable of easily and efficiently forming many micro through-holes on a sheet of synthetic resin in a simple manner and in a short time, and at that time, preventing the occurrence of the deflection of a preform.SOLUTION: A micro through-hole forming device 10 includes a supporting base 11, a back sheet 12 for supporting a preform 20, and an ultrasonic form block 30 which is arranged above the back sheet 12 and has many projections 31 at a lower part. Flat load imparting regions 39 and 28 are provided around a projection forming region 34 of the ultrasonic form block 30 and around a protrusion region 11a of the supporting base 11, respectively. The ultrasonic form block 30 is movable vertically and made to ultrasonic-vibrate in the vertical direction to heat the preform 20 by vibration, and thus the preform 20 is melted to form many micro through-holes 41. At that time, a load is applied to the preform between the load imparting region 39 of the ultrasonic form block 30 and the load imparting region 28 of the supporting base 11.
摘要翻译：要解决的问题：提供一种能够以简单的方式和在短时间内容易且有效地在合成树脂片上形成多个微通孔的微通孔形成装置，并且此时防止预成型件的偏转的发生。解决方案：微通孔形成装置10包括支撑基座11，用于支撑预成型件20的背板12和布置在背板12上方并且具有多个突起31的超声波模块30 较低的部分。平坦负荷赋予区域39和28分别设置在超声波模块30的突出形成区域34周围并且分别围绕支撑基部11的突出区域11a。超声波模块30能够垂直移动并且在垂直方向上进行超声波振动，以通过振动来加热预制件20，从而使预制件20熔化以形成许多微通孔41.此时，施加负载超声波模块30的负载赋予区域39与支撑基座11的负载赋予区域28之间的预成型件。（C）2013，JPO＆INPIT

7. 发明专利

JP2013094885A Micro through-hole forming device, method of manufacturing micro through-hole formed product, and mist formation filter manufactured by the method 有权
标题翻译：微通孔形成装置，制造微孔形成的产品的方法和由方法制造的雾化过滤器
公开(公告)号：JP2013094885A
公开(公告)日：2013-05-20
申请号：JP2011239101
申请日：2011-10-31
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： YAMADA KANEO , FUJITA HIROSHI , NAGANUMA HIROYUKI , SEKI MASASHI , YANAGA TAKESHI , TAGUCHI TETSUYA
IPC分类号： B26F1/26
摘要： PROBLEM TO BE SOLVED: To provide a micro through-hole forming device capable of easily forming many micro through-holes on a sheet of synthetic resin in a simple manner and in a short time.SOLUTION: The micro through-hole forming device 10 includes, a supporting base 11, a back sheet 12 for supporting a base sheet 20, and an ultrasonic form block 30 containing many projections 31 at a lower part. The ultrasonic form block 30 is movable vertically, and the projection 31 ultrasonic-vibrates. Many protrusions 18 are provided at positions corresponding to the projections 31 of the ultrasonic form block 30 on the surface of the supporting base 11. Under a condition that the base sheet 20 and the back sheet 12 are pinched between the projection 31 and the protrusion 18, the projection 31 is made to ultrasonic-vibrate so that the base sheet 20 is heated by vibration. The base sheet 20 is penetrated with the projection 31 so that many micro though-holes 41 are formed on the base sheet 20.
摘要翻译：要解决的问题：提供一种能够以简单的方式和在短时间内容易地在合成树脂片上形成许多微通孔的微通孔形成装置。微通孔形成装置10包括：支撑基座11，用于支撑基片20的背面片12和在下部包含许多突起31的超声波形成块30。超声波模块30可以垂直移动，并且突起31被超声波振动。许多突起18设置在与支撑基座11的表面上的超声波模块30的突起31相对应的位置。在基片20和背片12被夹在突起31和突起18之间的条件下突起31被超声波振动，从而基片20被振动加热。底片20被突起31穿透，使得许多微通孔41形成在基片20上。版权所有（C）2013，JPO＆INPIT

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