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1. 发明专利

JP2004019811A Refrigerant low-permeable compound sealing material and manufacturing method for it 审中-公开
公开(公告)号：JP2004019811A
公开(公告)日：2004-01-22
申请号：JP2002176298
申请日：2002-06-17
申请人： Denso Corp , Gomuno Inaki Kk , ゴムノイナキ株式会社 , 株式会社デンソー
发明人： INAGAKI SHINICHI , YAMADA HIROYUKI , HARADA HIDEO , IIDA ARATA
IPC分类号： F16J15/10 , B29C63/02 , B29L31/26
摘要： PROBLEM TO BE SOLVED: To provide a refrigerant low-permeable compound sealing material having pressure tightness, excellent permeability resistance, and very easily manufactured, and a manufacturing method for it.
SOLUTION: A resin film 4 composed of a lower resin film from the lower side and an upper resin film from the upper side is brought into pressure contact with an O-ring 2 by a press machine to be coated therewith, and burr generated at the time is removed by polishing, cutting or heat welding lapping. A coating material is applied to the surface of the resin film 4 of the O-ring from which burr is removed to form a coating layer to manufacture a compound sealing material 1.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2002012852A SEALING MATERIAL 失效
公开(公告)号：JP2002012852A
公开(公告)日：2002-01-15
申请号：JP2000203098
申请日：2000-06-30
申请人： DENSO CORP , GOMUNO INAKI KK
发明人： IIDA ARATA , YAMADA HIROYUKI
IPC分类号： F16J15/10 , C09K3/10
摘要： PROBLEM TO BE SOLVED: To obtain a rubber material useful as a sealing material in a refrigerant system, having low swelling/gas permeability to a high-pressure carbon dioxide gas, for example, a supercritical carbon dioxide gas. SOLUTION: This sealing material comprises a butyl rubber. The butyl rubber is preferably a halogenated butyl rubber. The halogenated butyl rubber is preferably crosslinked with a metal oxide. The sealing material preferably contains a reinforcing filler such as zinc oxide. Further the sealing material preferably contains a flat filler such as graphite. The flat filler has preferably =0.1 μm average particle diameter.

3. 发明专利

JP2014154859A Flux fume recovery device 有权
标题翻译： FLUX FUME RECOVERY DEVICE
公开(公告)号：JP2014154859A
公开(公告)日：2014-08-25
申请号：JP2013026246
申请日：2013-02-14
申请人： Denso Corp , 株式会社デンソー
发明人： SUKEGAWA TAKUSHI , YAMAMOTO MASAYASU , YAMADA HIROYUKI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a recovery device which recovers flux fume when a reflow furnace is inactivated.SOLUTION: A flux fume recovery system (10) recovers flux fume occurring in a reflow furnace when the reflow furnace is inactivated and includes: a suction duct part (17) which is detachably installed at a transfer inlet (19); a blower (11) which causes an atmosphere gas in the reflow furnace to be suctioned by the flux fume recovery device (10) through the suction duct part (17) installed sealing the transfer inlet (19) when the reflow furnace is inactivated; and a flux fume collection part (4) which collects the deposited flux fume.
摘要翻译：要解决的问题：提供一种当回流炉失活时回收通量烟雾的回收装置。解决方案：当回流炉失活时，助熔剂烟气回收系统（10）回收在回流炉中发生的通量烟气，并且包括：吸入导管部分（17），其可拆卸地安装在转移入口（19）处; 使回流炉内的气氛气体通过漏斗回收装置（10）通过在回流炉不活动时密封输送口（19）的吸入管道部（17）引起的鼓风机（11）以及收集沉积的助熔剂烟雾的助熔剂烟雾收集部分（4）。

4. 发明专利

JP2007329349A Thermoelectric conversion device and manufacturing method thereof 审中-公开
标题翻译：热电转换装置及其制造方法
公开(公告)号：JP2007329349A
公开(公告)日：2007-12-20
申请号：JP2006160203
申请日：2006-06-08
申请人： Denso Corp , 株式会社デンソー
发明人： MATSUOKA AKIO , AZEYANAGI ISAO , NIIMI YASUHIKO , YAMADA HIROYUKI
IPC分类号： H01L35/30 , F25B21/02
摘要： PROBLEM TO BE SOLVED: To improve the reliability of a thermoelectric conversion device while suppressing the performance reductions of its thermoelectric elements 12, 13, in the junctions of its thermoelectric elements 12, 13 to its heat absorbing/radiating electrode members 22, 32.
SOLUTION: The contacting areas of the thermoelectric elements 12, 13 with the heat absorbing/radiating electrode members 22, 32 are made smaller than the areas of the junction surfaces 12a, 13a of the thermoelectric elements 12, 13. According to this, in the junctions of the thermoelectric elements 12, 13 to the heat absorbing/radiating electrode members 22, 32 having heat absorbing/radiating electrodes 25, 35; there can be suppressed by the reductions of the contacting areas the performance reductions of the thermoelectric elements 12, 13 which are caused by the diffusions of the copper (Cu) molecules of the components of the heat absorbing/radiating electrodes 25, 35 to the insides of the thermoelectric elements 12, 13.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题为了提高热电转换装置的可靠性同时抑制其热电元件12,13的性能降低，在其热电元件12,13与其吸热/辐射电极构件22的接合处，解决方案：使热电元件12,13与吸热/辐射电极构件22,32的接触面积比热电元件12,13的接合表面12a，13a的面积小。根据在热电元件12,13与具有吸热/辐射电极25,35的吸热/辐射电极构件22,32的接合处，可以通过减少接触面积来抑制由吸热/辐射电极25,35的部件的铜（Cu）分子扩散到内部而引起的热电元件12,13的性能降低的热电元件12,13。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2006065799A Manufacturing process management method and manufacturing process management system 审中-公开
标题翻译：制造过程管理方法和制造过程管理系统
公开(公告)号：JP2006065799A
公开(公告)日：2006-03-09
申请号：JP2004250863
申请日：2004-08-30
申请人： Denso Corp , 株式会社デンソー
发明人： YAMADA HIROYUKI
IPC分类号： G05B19/418
CPC分类号： Y02P90/04 , Y02P90/12
摘要： PROBLEM TO BE SOLVED: To effectively perform a manufacturing process management even in the case of including a process incapable of being electrically conducted to a product itself. SOLUTION: Respective equipment such as a laser marking apparatus 11, a plurality of component mounting apparatuses 12, a circuit inspecting apparatus 15, a label issuer, a terminal 16 and a terminal 17 which constitute a manufacturing line 2 are connected to an external management apparatus 3 via a communication means. The respective equipment on the manufacturing line 2 transmit serial data of substrates 4a and 5a and a component 9, and process data such as assembly and inspection executed in the process to the external management apparatus 3 in real time. In a manual operation process, a worker transmits the process data are transmitted to the external management apparatus 3 by operating the terminals 16 and 17. The external management apparatus 3 stores and accumulates in a database 18 the serial data and the process data transmitted from each facility to establish process history data every product 1, compares the process with a process flow stored in advance, and decides whether or not the process proceeds correctly. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使在包括不能对产品本身进行电导通的过程的情况下，也能有效地执行制造过程管理。解决方案：构成制造线2的各种设备如激光打标设备11，多个部件安装设备12，电路检查设备15，标签发行者，终端16和终端17被连接到外部管理装置3经由通信装置。制造线2上的各个设备将实施例中的基板4a，5a和部件9的串行数据传送到外部管理装置3，并将处理中的处理数据，例如组装和检查。在手动操作过程中，通过操作终端16和17将工作人员发送的过程数据发送到外部管理装置3.外部管理装置3在数据库18中存储并累积串行数据和从每个发送的处理数据每个产品建立过程历史数据的设施1，将过程与预先存储的过程流程进行比较，并确定过程是否正确进行。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2012035291A Semiconductor device bonding material 有权
标题翻译：半导体器件接合材料
公开(公告)号：JP2012035291A
公开(公告)日：2012-02-23
申请号：JP2010176456
申请日：2010-08-05
申请人： Denso Corp , Senju Metal Ind Co Ltd , 千住金属工業株式会社 , 株式会社デンソー
发明人： SAKAMOTO ZENJI , YAMADA HIROYUKI , YAMANAKA YOSHIE , ONISHI TSUKASA , YOSHIKAWA SHUNSAKU , TADOKORO KENZO
IPC分类号： B23K35/14 , B22F3/26 , B23K1/00 , B23K35/26 , B23K35/40 , B23K101/40 , C22C1/08 , C22C5/06 , C22C9/02 , C22C13/00 , H01L21/52 , H05K3/34
CPC分类号： B23K35/262 , B22F2998/00 , B23K35/025 , B23K35/302 , B23K2201/40 , C22C1/08 , C22C9/02 , C22C13/00 , H01L23/3735 , H01L24/07 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04042 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29198 , H01L2224/2929 , H01L2224/29299 , H01L2224/32014 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83065 , H01L2224/8309 , H01L2224/83444 , H01L2224/83455 , H01L2224/83801 , H01L2224/8384 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01021 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/15747 , H01L2924/203 , H05K3/3463 , H05K2201/0116 , Y10T428/12479 , H01L2924/00014 , C22C1/0483 , H01L2924/00 , H01L2924/00012 , H01L2224/29099 , H01L2224/29199 , H01L2924/0002
摘要： PROBLEM TO BE SOLVED: To provide a high temperature solder bonding material for internal bonding of a semiconductor device, and to provide a semiconductor device wherein an internal bonding section does not melt when being mounted to a substrate.SOLUTION: An Sn or Sn-based solder alloy is used for filling the hole portions of a porous metal body having a mesh structure and also for covering the surface thereof.
摘要翻译：要解决的问题：提供一种用于半导体器件的内部接合的高温焊料接合材料，并且提供一种当安装到基板上时内部接合部不熔化的半导体器件。解决方案：使用Sn或Sn基焊料合金来填充具有网状结构的多孔金属体的孔部分并且还覆盖其表面。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2005251904A Substrate front surface mounting part, substrate circuit, substrate, solder connecting method and method of manufacturing substrate circuit 审中-公开
标题翻译：基板前表面安装部件，基板电路，基板，焊接连接方法及制造基板电路的方法
公开(公告)号：JP2005251904A
公开(公告)日：2005-09-15
申请号：JP2004058942
申请日：2004-03-03
申请人： Denso Corp , 株式会社デンソー
发明人： YAMADA HIROYUKI , FURUMOTO ATSUSHI , MUROWAKI TORU
IPC分类号： H05K3/34 , H05K1/18
CPC分类号： Y02P70/613
摘要： PROBLEM TO BE SOLVED: To assure a bonding lifetime over an electronic printed circuit board by assuring the stand-off height of a front surface mounting part, such as a chip, etc. SOLUTION: It prevents that a solder 4 is damp along the end face electrode 23 and/or the side face electrode 24 of the substrate front surface mounting part 2, such as the chip part, etc. having the end face electrode 23 and/or the side face electrode 24, and the solder height (stand-off height) under the chip is assured sufficiently. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过确保诸如芯片等的前表面安装部分的支架高度来确保电子印刷电路板上的粘合寿命。解决方案：防止焊料 4具有端面电极23和/或侧面电极24的诸如芯片部分等的衬底前表面安装部分2的端面电极23和/或侧面电极24是潮湿的，以及充分确保芯片下方的焊料高度（间隔高度）。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2014154804A Soldering method, apparatus used for the method, and electronics product using the method 审中-公开
标题翻译：焊接方法，用于该方法的装置和使用该方法的电子产品
公开(公告)号：JP2014154804A
公开(公告)日：2014-08-25
申请号：JP2013025284
申请日：2013-02-13
申请人： Denso Corp , 株式会社デンソー
发明人： YAMADA HIROYUKI
IPC分类号： H05K3/34 , B23K1/00 , B23K1/06 , B23K3/02 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To make it possible to solder without causing a problem such as a breakage of an electronic component by vibration when soldering an electronic component by providing supersonic vibration.SOLUTION: When an electronic component is soldered to a substrate, after solder is melted, before solidifying, a supersonic vibrating tool is brought into contact with a surface of the molten solder, nucleation of a solidified nuclei is promoted by providing the molten solder with a supersonic vibration, a solidified structure of the solder is miniaturized, and an electronic component excellent in bond strength is obtained.
摘要翻译：要解决的问题：通过提供超音速振动来焊接电子部件时，可以通过振动而引起电子部件的破损等问题。当将电子部件焊接到基板上时，焊料为在凝固之前熔融，使超音速振动工具与熔融焊料的表面接触，通过使熔融焊料具有超音速振动来促进凝固核的成核，焊料的固化结构小型化，并且电子得到粘结强度优异的成分。

9. 发明专利

JP2013105933A Reflow device 有权
标题翻译：反流装置
公开(公告)号：JP2013105933A
公开(公告)日：2013-05-30
申请号：JP2011249477
申请日：2011-11-15
申请人： Denso Corp , 株式会社デンソー
发明人： SUKEGAWA TAKUSHI , YAMADA HIROYUKI , INOMATA NORIYASU
IPC分类号： H05K3/34 , B23K1/00 , B23K1/008 , B23K3/04 , B23K3/08 , B23K101/42
CPC分类号： B23K3/00 , B23K1/0016 , B23K1/008 , B23K3/04 , B23K3/08 , B23K2201/42 , H05K3/3494
摘要： PROBLEM TO BE SOLVED: To provide a reflow device which has high heat transfer rate of contact heating and high thermal uniformity of air heating in combination.SOLUTION: In a reflow device, a heating furnace is equipped with: a contact heating part having a conveyance rail (1) which supports the outer edge of a printed circuit board (P) from a lower part, and an upper heat conduction heater (2) which supports the outer edge of the printed circuit board (P) from an upper part; and a hot blast heating part (3), the conveyance rail (1) and the upper heat conduction heater (2) are provided with heaters which heat the outer edge of the printed circuit board (P), respectively, the conveyance rail (1) or the upper heat conduction heater (2) moves in the vertical direction after carrying in the printed circuit board, and the conveyance rail (1) and the upper heat conduction heater (2) sandwich the outer edge of the printed circuit board (P) to be heated.
摘要翻译：要解决的问题：提供组合具有高的接触加热传热速率和高的热均匀性的回流装置。解决方案：在回流装置中，加热炉配备有：接触加热部，其具有从下部支撑印刷电路板（P）的外边缘的输送轨道（1）和上部热量传导加热器（2），其从上部支撑印刷电路板（P）的外边缘; 和热风加热部分（3），输送轨道（1）和上部热传导加热器（2）分别设置有加热印刷电路板（P）的外边缘的输送轨道（1））或上部导热加热器（2）在承载印刷电路板之后沿垂直方向移动，并且输送轨道（1）和上部导热加热器（2）夹着印刷电路板（P）的外边缘）加热。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2002237675A PRINTED-WIRING BOARD 失效
公开(公告)号：JP2002237675A
公开(公告)日：2002-08-23
申请号：JP2001032471
申请日：2001-02-08
申请人： DENSO CORP
发明人： MITSUHARU MASAKI , OBARA FUMIO , KAMIMURA ATSUSHI , YAMADA HIROYUKI , YAMAMOTO MASAYASU
IPC分类号： B23K1/00 , B23K35/26 , B23K101/42 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To restrain a land from being striped from a printed-wiring board, in which the land is soldered by using a solder material at a high melting point exceeding 200 deg.C. SOLUTION: In the printed-wiring board, a through-hole 2 passed in its thickness direction is formed in the board 1 in which conductor circuits 5 are formed on its surfaces, the land part 4 electrically bonded to the conductor circuits 5 is formed in the opening edge part of the through-hole 2, the lead part 9 of an electronic component mounted on the board 1 is inserted into the through- hole 2, and the lead part 9 is electrically bonded to the land 4 by solder 7. The solder 7 is lead-free solder having melting point of 200 deg.C or higher. Surfaces of the conductor circuits 5 are covered with heat-resistance insulating films 6 used to prevent the solder 7 from adhering, and at least the outer circumferential part of the land 4 is covered with the films 6.

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