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1. 发明专利

JP2015014584A 生体検知器、車両用着座検知器およびシートベルト非着用警告システム有权
标题翻译：有机检测仪，汽车和座椅防护罩警报系统
公开(公告)号：JP2015014584A
公开(公告)日：2015-01-22
申请号：JP2013220112
申请日：2013-10-23
申请人：株式会社デンソー , Denso Corp
发明人： SAITO KEITA , SHIRAISHI YOSHIHIKO , YAZAKI YOSHITARO , TANAKA YASUHIRO , MIYAGAWA EIJIRO , SHIMIZU MOTONORI , HARADA TOSHIICHI , SAKAIDA ATSUSUKE , TANIGUCHI TOSHIHISA , GOKO MICHIHISA
IPC分类号： G01V9/00 , A47C7/62 , B60N2/90 , G01K17/08
CPC分类号： B60R22/48 , B60N2/002 , B60R21/01512 , B60R2022/4808 , G01K17/00 , G01K17/20 , G01K2205/00 , G01V9/005
摘要：【課題】従来よりも正確な生体の検知を可能とする。【解決手段】検知対象位置に存在する生体からの熱流束を検出できるように熱流束センサ10を配置する。そして、熱流束センサの検出結果と、検知対象位置に生体が存在する場合に検出されうる熱流束に応じて予め設定された判定基準とを比較して、生体の有無を判定する。そして、検出結果が判定基準を満たす場合、すなわち、熱流束センサで検出した熱流束が生体からの熱流束である場合に、生体有りと判定することで、従来よりも正確な生体の検知が可能となる。【選択図】図1
摘要翻译：要解决的问题：比常规方法更准确地检测生物体。解决方案：热通量传感器10被布置成检测存在于检测对象位置的生物体的热通量。然后，将热通量传感器的检测结果与当生物存在于检测对象位置时可以检测到的热通量预先设定的确定基准进行比较，从而确定生物体的存在/不存在。然后，当检测结果满足判定基准时，即，当由热通量传感器检测到的热通量是来自生物体的热通量时，确定存在生物体。因此，可以比常规方式更准确地检测生物体。

2. 发明专利

JP2011187619A Device for filling through via with conductive material, and usage thereof 有权
标题翻译：通过导电材料填充的装置及其使用
公开(公告)号：JP2011187619A
公开(公告)日：2011-09-22
申请号：JP2010050356
申请日：2010-03-08
申请人： Denso Corp , 株式会社デンソー
发明人： TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , ISHIKAWA TOMIICHI
IPC分类号： H05K3/40
摘要： PROBLEM TO BE SOLVED: To prevent a conductive material filling a through via from falling, and to reduce the amount of surplus metal powder which falls into disuse contained in the conductive material. SOLUTION: A multilayer circuit board 10 is installed on a mounting surface 21a of a filling base 21 with an adsorption paper 21b interposed, and through vias 11 are filled with a conductive paste 1. A solvent of the conductive paste 1 is therefore adsorbed into the adsorption paper 21b and metal powder is concentrated in the through vias 11 to remain by a necessary amount. Consequently, the ratio of the metal powder is made less than the ratio of the solvent, and metal powder contained in ineffective paste is reduced. Further, the conductive paste 1 is made of a material which solidifies at room temperature and after the through vias 11 are filled with the conductive paste 1, the multilayer circuit board 10 is cooled to cause the conductive paste 1 to solidify. Consequently, even when the multilayer circuit board 10 is peeled from the adsorption paper 21b, the conductive paste 1 is made not to fall. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了防止填充通孔的导电材料落下，并且减少掉在导电材料中的废弃物中剩余的金属粉末的量。解决方案：多层电路板10安装在填充基座21的安装表面21a上，吸附纸21b插入，并且通孔11填充有导电膏1.因此，导电膏1的溶剂被吸附到吸附纸21b中，并且将金属粉末集中在通孔11中以保持必要的量。因此，使金属粉末的比例小于溶剂的比例，并且无效糊料中所含的金属粉末减少。此外，导电膏1由在室温下固化的材料制成，并且在通孔11被导电膏1填充之后，多层电路板10被冷却以使导电膏1固化。因此，即使当多层电路板10从吸附纸21b剥离时，导电膏1也不会掉落。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010184430A Method and apparatus which fill up closed-bottom hole with paste-like substance 有权
标题翻译：用类似物质填充封闭底孔的方法和装置
公开(公告)号：JP2010184430A
公开(公告)日：2010-08-26
申请号：JP2009029996
申请日：2009-02-12
申请人： Denso Corp , 株式会社デンソー
发明人： TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , ISHIKAWA TOMIICHI
IPC分类号： B41F15/40 , B41F15/08 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a filling apparatus for filling a paste-like substance capable of achieving high filling quality and high productivity, and to provide a filling method.
SOLUTION: The filling apparatus for the paste-like substance includes a paste-like substance metering means 30, and a filling head 40. The filling head 40 moves by slidably coming into contact with a sheet material 10. The filling apparatus is equipped with a filling room 42 with an opening 44 closed by bringing the filling head 40 into contact with the surface of the sheet material 10, and a squeegee 43 which is arranged in the filling room 42, receives and holds the paste-like substance P which is metered and prepared, and rubs the held paste-like substance P into a closed-bottom hole 13 of the sheet material 10. The amount of the paste-like substance P received by the squeegee 43 is such an amount that can be held by the squeegee 43 without falling down from the squeegee 43 even if the opening 44 of the filling room 42 is opened.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于填充能够实现高填充质量和高生产率的糊状物质的填充装置，并提供填充方法。解决方案：糊状物质的填充装置包括糊状物质计量装置30和填充头40.填充头40通过滑动地与片材10接触而移动。填充装置是配备有通过使填充头40与片材10的表面接触而使开口部44闭合的填充室42和布置在填充室42中的刮板43，从而容纳并保持糊状物质P 将其进行计量和准备，并将保持的糊状物质P摩擦到片材10的闭孔13中。由刮板43接收的糊状物质P的量为可以保持的量即使打开填充室42的开口44，也可以通过刮板43从刮板43落下。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2009266966A Apparatus for manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的装置
公开(公告)号：JP2009266966A
公开(公告)日：2009-11-12
申请号：JP2008112988
申请日：2008-04-23
申请人： Denso Corp , 株式会社デンソー
发明人： TAKEUCHI SATOSHI , SAKAIDA ATSUSUKE , TANIGUCHI TOSHIHISA , HARADA TOSHIICHI , CHIBA MAKI
IPC分类号： H05K3/46
CPC分类号： B30B15/061 , B30B15/024 , H05K3/4611 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0133 , H05K2203/065 , H05K2203/068
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a printed circuit board that improves the number of times for reuse of a buffer member, which is provided to reduce variations of pressure applied to each part of a laminate.
SOLUTION: In the apparatus, a pressing die includes a lower pressing part wherein a buffer member is disposed between the surface of a laminate and the lower pressing part, an upper pressing part which has a portion facing the other surface of the laminate and a portion facing the buffer member and is away from the buffer member at least in pre-heat-pressing state, and a circular frame which surrounds a whole area of a side surface of the buffer member and is integrated with only the lower pressing part at least upon heat pressing. Before pressing and heating, the laminate, a second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member. A lip is arranged on a surface facing the surface of the laminate while protruding from the frame toward the laminate, and it is deformed following the deformation of the buffer member caused by pressing and comes in contact with the upper pressing part facing the buffer member.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于制造印刷电路板的装置，其提高缓冲构件的再利用次数，其用于减少施加到层压体的每个部分的压力的变化。解决方案：在该装置中，压模包括下压部，其中缓冲部件设置在层叠体的表面和下挤压部之间，上压部，其具有面向层叠体的另一表面的部分以及面向缓冲构件并且至少在预热状态下远离缓冲构件的部分，以及围绕缓冲构件的侧表面的整个区域的圆形框架，并且仅与下部按压部分至少在热压时。在加压和加热之前，层压体，第二按压部分和缓冲部件在其间限定了用于逸出缓冲部件的逸出空间。在从框架朝向层叠体突出的同时，在与层压体的表面相对的表面上设置有唇部，并且随着缓冲构件由于按压而变形而变形，并且与上部按压部件面向缓冲构件接触。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009135307A Support for work 有权
标题翻译：支持工作
公开(公告)号：JP2009135307A
公开(公告)日：2009-06-18
申请号：JP2007310915
申请日：2007-11-30
申请人： Denso Corp , 株式会社デンソー
发明人： GOKO MICHIHISA , TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , ISHIKAWA TOMIICHI , OKAMOTO KEIJI
IPC分类号： H01L21/677 , B65G7/06 , B65G49/07 , B65G51/03
摘要： PROBLEM TO BE SOLVED: To provide a support for a workpiece that is conveyed without causing any breakage and any crack by making it afloating with gas.
SOLUTION: A sealing space 15 is formed at a lower surface side of an air permeability porosity sheet 14 by supporting the air permeability porosity sheet 14 with mounting members 13 distributed and provided at predetermined intervals, and a pressurization gas supply source 16 is connected to this sealing space 15. The air permeability porosity sheet 14 makes it possible to stay the gas in a space 17 formed on the mounting members 13, while carrying out a swelling in the shape of a convex at each attaching position with the mounting members 13.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为通过使其与气体的浮动而不会导致任何破损和任何裂纹而被传送的工件提供支撑。解决方案：通过以预定间隔分布和设置的安装构件13支撑透气性孔隙度片14，在透气孔隙度片材14的下表面侧形成密封空间15，加压气体供给源16为透气性孔隙纸14使得可以将气体保持在形成在安装构件13上的空间17中，同时在每个安装位置执行凸起形状的膨胀，其中安装构件 13.版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2008300805A Method and apparatus of manufacturing circuit board 有权
标题翻译：制造电路板的方法和装置
公开(公告)号：JP2008300805A
公开(公告)日：2008-12-11
申请号：JP2007148614
申请日：2007-06-04
申请人： Denso Corp , 株式会社デンソー
发明人： TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , TSUZUKI YUJI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus of manufacturing a circuit board which reduce warpage deformation caused when applying predetermined warpage to the circuit board.
SOLUTION: An outer edge portion 912 and stiffener 95 of the circuit board 91 are held by upper and lower outer edge clamps 11, 12 in between. Additionally, a semiconductor element mounting portion 911 of the circuit board 91 is held by upper and lower mounting clamps 31, 32 in between. The predetermined warpage fabrication is carried out by deforming the upper and lower mounting clamps 31, 32 after the circuit board 91 whose base material is comprised of a thermoplastic resin is heated at the upper and lower outer edges clamps 11, 12 and upper and lower mounting clamps 31, 32 heated by a heaters 11A, 12A.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造电路板的方法和装置，其减少当向电路板施加预定翘曲时引起的翘曲变形。解决方案：电路板91的外边缘部分912和加强件95在其之间被上和外外边缘夹具11,12保持。此外，电路板91的半导体元件安装部分911由上和下安装夹31,32保持在其间。预定的翘曲制造是通过在其基材由热塑性树脂构成的电路板91在上外侧和外侧边缘夹具11,12加热的情况下使上部和下部安装夹具31,32变形而进行的，上部和下部安装夹具31,32由加热器11A，12A加热。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008177305A Method and device for filling fluid substance 审中-公开
标题翻译：用于填充流体物质的方法和装置
公开(公告)号：JP2008177305A
公开(公告)日：2008-07-31
申请号：JP2007008442
申请日：2007-01-17
申请人： Denso Corp , 株式会社デンソー
发明人： TANIGUCHI TOSHIHISA , TAKEDA KYOICHI , SAKAIDA ATSUSUKE
IPC分类号： H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a method for filling metallic paste extending no weak sheet material.
SOLUTION: The method for filling metal paste has a holding step of holding the sheet material 11 in an arcuate surface shape on the external surface of a holding drum 21 while directing a via hole as the outside, and a filling step of relatively moving the sheet material 11 and a filling head 32 in the circumferential direction of an arcuate surface to fill the inside of the via hole with metal paste while abutting the filling head 32 filling the inside of the via hole with metal paste against the external surface of the held sheet material 11. Accordingly, the weak sheet material 11 can be prevented from being extended due to a suction force and a holding tension by filling paste while holding the weak filmy sheet material 11 on the external surface of the holding drum 21 equal to a surface plate so as to be stuck in the arcuate surface shape. An angle of filling and a pushing force can be stabilized, and the quality of filling can be improved.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种填充不含弱片材的金属糊的方法。解决方案：用于填充金属浆料的方法具有保持步骤，在将通孔作为外部引导的同时将片材11保持在保持滚筒21的外表面上的弓形表面形状，并且相对地在圆弧表面的周向上移动片材11和填充头32，以用金属膏填充通孔的内部，同时将金属膏填充到通孔内部的填充头32抵靠在保持片材11.因此，通过在保持滚筒21的外表面上保持薄膜片材11保持等于...的同时，通过填充糊剂可以防止弱片材料11由于吸力和保持张力而延伸表面板，以便被卡在圆弧形表面上。可以使填充角度和推力稳定化，能够提高填充质量。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008104993A Wet type surface treatment device 有权
标题翻译：湿式表面处理装置
公开(公告)号：JP2008104993A
公开(公告)日：2008-05-08
申请号：JP2006292590
申请日：2006-10-27
申请人： Denso Corp , 株式会社デンソー
发明人： GOKO MICHIHISA , TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , TAKEDA KYOICHI
IPC分类号： B08B3/04 , C23F1/08 , C23G3/00 , H01L21/304 , H01L21/306
摘要： PROBLEM TO BE SOLVED: To provide a wet type surface treatment device miniaturizable by combination of each link length by performing two operations by differential movement of two links, while keeping dipping depth.
SOLUTION: In a carrying mechanism part 13, for rotating a vertically moving casing 27 six times during one rotation of a carrying gear 18, a gear ratio of an internal gear 17 to a planetary gear 22 is set to 3:1, a gear ratio of a first transmission gear 26 to a second transmission gear 26 is set to 2:1, and a rotation ratio of the carrying gear 18 to the vertically moving casing 27 is set to 1:6. For differential movement by the carrying mechanism part 13, a gear ratio of a first vertically moving gear to a third vertically movement gear is set to 1:2, and a gear ratio of a first rocking gear 32 to a third rocking gear 34 is set to 2:1.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过在保持浸渍深度的同时通过两个链节的差分运动执行两个操作来提供通过组合每个链接长度而可以小型化的湿式表面处理装置。解决方案：在承载机构部13中，为了在承载齿轮18的一次旋转期间使垂直移动的壳体27旋转六次，内齿轮17与行星齿轮22的齿轮比被设定为3:1，第一变速齿轮26与第二变速齿轮26的齿轮比被设定为2:1，并且承载齿轮18与垂直移动的壳体27的转速比设定为1:6。为了通过承载机构部13进行的差速运动，将第一垂直移动齿轮与第三上下运动齿轮的齿轮比设定为1：2，设定第一摆动齿轮32与第三摆动齿轮34的齿轮比至2：1。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008091931A Method and device for generating fine particle 审中-公开
标题翻译：用于生成细颗粒的方法和装置
公开(公告)号：JP2008091931A
公开(公告)日：2008-04-17
申请号：JP2007263516
申请日：2007-10-09
申请人： Denso Corp , 株式会社デンソー
发明人： SAKAIDA ATSUSUKE , TANIGUCHI TOSHIHISA , TANAKA HIROSHI
IPC分类号： H01L21/306 , B05B7/30 , B81C99/00
摘要： PROBLEM TO BE SOLVED: To provide fine liquid droplets in a fine space in order to enable microprocessing and to provide a method and a device for forming fine liquid droplets therefor.
SOLUTION: The method and the device for generating liquid fine particles that atomizes a liquid, and after separating fine liquid droplets from generated foggy liquid particles, causes them to come into contact with a heated carrier gas and thermally dries the liquid particles into fine particles.
COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2008023747A Equipment and method for screen printing 有权
标题翻译：屏幕打印的设备和方法
公开(公告)号：JP2008023747A
公开(公告)日：2008-02-07
申请号：JP2006195966
申请日：2006-07-18
申请人： Denso Corp , 株式会社デンソー
发明人： GOKO MICHIHISA , TANIGUCHI TOSHIHISA , SAKAIDA ATSUSUKE , TAKEDA KYOICHI
IPC分类号： B41F15/40 , B41F15/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide equipment and a method for screen printing which can cope with enhanced minuteness of a printing bump in a maintenance-free manner, without conducting the conventional work for disposal of solder paste, and enables reduction of the cost of solder and improvement of productivity.
SOLUTION: In the screen printing equipment, a printing head 4 has a main-body case 43 holding the solder paste P inside, a scraping squeegee 44 disposed adjacently to the main-body case and scraping the solder paste from the surface of a screen S, a printing piston 45 pressing out the solder paste in the main-body case and a squeegee pressing piston 46 making the scraping squeegee move. The solder paste which is scraped by the scraping squeegee and of which the flux is reduced is collected into the main-body case and the collected solder paste and the solder paste in the main-body case are agitated to be mixed with each other.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供能够以免维护的方式处理印刷凸块的增强的细度的丝网印刷的设备和方法，而不进行常规的用于处理焊膏的工作，并且能够减少焊料成本和生产率的提高。＆lt; P＆gt;解决方案：在丝网印刷设备中，打印头4具有保持焊膏P的主体壳体43，与主体壳体相邻设置的刮刮刮板44，屏幕S，压出主体壳体中的焊膏的印刷活塞45和使刮刮刮板移动的刮板按压活塞46。被刮刮刮板刮除并将助焊剂还原的焊锡膏收集到主体外壳中，并将收集的焊膏和主体外壳中的焊膏搅拌混合。版权所有（C）2008，JPO＆INPIT

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