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1. 发明专利

JP2008310604A Ic card for common use in contact/noncontact antenna sheet and manufacturing method for antenna sheet 审中-公开
标题翻译：用于公共使用的IC卡/非天线天线片和天线片的制造方法
公开(公告)号：JP2008310604A
公开(公告)日：2008-12-25
申请号：JP2007158022
申请日：2007-06-14
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI , YOSHIDA HIDEYO , AKIYAMA TOMOYA
IPC分类号： G06K19/077 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To reduce antenna resistance as a whole including the connecting part between an IC chip and an antenna by using different antenna metal materials for the front and the back, and also to reduce the constraint by the antenna during card processing. SOLUTION: This IC card has a terminal board on the outer surface. In an IC card for common use, the two terminals 7a and 7b for antenna connection of an IC module 5 on which an IC chip for common use in contact/noncontact is mounted, a substrate having two terminals 7a and 7b for antenna connection on the inner surface thereof, and an antenna starting end part 21 and an ending end part 22 in a card substrate 10 are connected in a concave part 30 for mounting IC module. An antenna pattern is formed on the front and the back of the antenna sheet 20. On the side surface which has the antenna starting end part 21 and the ending end part 22, metal materials whose connection resistance with a conductive connecting material is smaller than that of the opposite side surface of the antenna sheet is used. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了通过使用用于前后的不同的天线金属材料来减少整体上的包括IC芯片和天线之间的连接部分的天线电阻，并且还减少卡内的天线的约束处理。
解决方案：该IC卡在外表面具有端子板。在通常使用的IC卡中，安装有用于接触/非接触的通常使用的IC芯片的IC模块5的天线连接的两个端子7a和7b，具有用于天线连接的两个端子7a和7b的基板卡片基板10中的天线起始端部21和端部22连接在用于安装IC模块的凹部30中。天线图案形成在天线片20的正面和背面。在具有天线起始端部分21和末端部分22的侧表面上，与导电连接材料的连接电阻小于使用天线片的相对侧表面。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008176549A Dual interface ic card, its manufacturing method, contact/noncontact dual ic module 有权
标题翻译：双接口IC卡及其制造方法，接触/非连接双IC模块
公开(公告)号：JP2008176549A
公开(公告)日：2008-07-31
申请号：JP2007009147
申请日：2007-01-18
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI , OZAKI KATSUMI , OKAMOTO KENICHI
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a dual interface IC card which is very strong against peeling in an IC module while securing a good connection with an antenna coil by providing a liquid pooling part from which conductive adhesive flows on an adhesive sheet used in the IC module. SOLUTION: The dual interface IC card is an IC card with a contact/noncontact dual IC module attached on a recess for attachment by using an adhesive sheet 2. The IC module is provided with two or more terminal plates for antenna connection 24 and 25 facing a first recess surface of the recess. The adhesive sheet 2 has openings 24k and 25k forming spaces surrounding the terminal plates for antenna connection. When the terminal plates for antenna connection are connected to the antennas in a card base in the openings with conductive adhesive, the spaces are formed so that liquid pools are made for the conductive adhesive on a side surface of a resin mold part 7 on internal peripheries. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种双重接口IC卡，其通过提供在所使用的粘合剂片上形成导电粘合剂流动的液体收集部分来确保与天线线圈的良好连接而非常强烈地抵抗IC模块中的剥离在IC模块中。
解决方案：双接口IC卡是具有接触/非接触双IC模块的IC卡，其通过使用粘合片2附接在凹部上以进行附接.IC模块设置有两个或更多个用于天线连接的端子板24 和25，其面向凹部的第一凹部表面。粘合片2具有形成用于天线连接的端子板周围的空间的开口24k和25k。当天线连接用端子板通过导电性粘合剂与开口中的卡座中的天线连接时，形成为在内周侧的树脂模具部7的侧面上形成导电性粘接剂的液体池。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007249599A Ic module for ic card and method for manufacturing ic module 有权
标题翻译： IC卡IC模块及制造IC模块的方法
公开(公告)号：JP2007249599A
公开(公告)日：2007-09-27
申请号：JP2006071954
申请日：2006-03-16
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： G06K19/077
CPC分类号： H01L2224/48228
摘要： PROBLEM TO BE SOLVED: To provide a technique for making a sealing resin hard to flow out of a regulated area in an IC module, and facilitating visual discrimination of a defective IC module with its outflow from the regulated area. SOLUTION: This IC module that is a unit IC module for IC card on COT (chip on tape) surface comprises a terminal substrate 10 and a contact IC chip 3. The terminal substrate 10 includes an insulating base material and a copper foil laminated on one side that forms the outer surface of an IC card of the insulating base material. The copper foil includes grooves 7m for partitioning the copper foil surface into a plurality of predetermined terminal blocks formed on the surface by etching. The insulating base material includes wire bonding through-holes 5 formed in terminal block bases and grooves 8m for partitioning a range to be filled with the sealing resin. The IC module may be an IC module using a terminal substrate 10 covered on both sides with copper foil and mounted with a contact/noncontact type IC chip. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种使密封树脂难以从IC模块中的调节区域流出的技术，并且有助于视觉辨别有缺陷的IC模块的流出从调节区域。作为COT（带状芯片）表面的IC卡的IC单元IC模块，该IC模块包括端子基板10和接触IC芯片3.端子基板10包括绝缘基材和铜箔层压在形成绝缘基材的IC卡的外表面的一侧上。铜箔包括用于将铜箔表面分割成通过蚀刻形成在表面上的多个预定端子块的槽7m。绝缘基材包括形成在端子台基部中的引线接合通孔5和用于分隔待填充密封树脂的范围的槽8m。 IC模块可以是使用覆盖在铜箔两侧的端子基板10并安装有接触/非接触型IC芯片的IC模块。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2007055611A Ic card mailing enclosure 有权
标题翻译： IC卡邮件外壳
公开(公告)号：JP2007055611A
公开(公告)日：2007-03-08
申请号：JP2005239258
申请日：2005-08-22
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： B65D27/02 , B42D15/02 , B42D15/10
摘要： PROBLEM TO BE SOLVED: To provide an IC card mailing enclosure capable of preventing an IC module from being damaged by a "mail sorting machine" when mailing a contact-type IC card to a user. SOLUTION: The IC card mailing enclosure 3 is an enclosure for sealing and sending a contact-type IC card 1. The IC card is mounted on an IC card enclosure mount. While the IC card enclosure mount is enclosed in a mailing envelope of the substantially same size capable of containing the mount, the enclosure 3 which is the other enclosure inserted in the envelope is worked at a position facing an IC module 1m of the IC card 1 mounted on the IC card enclosure mount 2 so that a portion corresponding to the IC module is increased in thickness from 0.10 mm to 5.0 mm. The enclosure may be thick-walled, hardened, provided with a protective member formed of a plastic resin, paper or a metal affixed or fixed to the corresponding portion. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种当向用户发送接触式IC卡时能够防止IC模块被“邮件分拣机”损坏的IC卡邮寄箱。
解决方案：IC卡邮寄箱3是用于密封和发送接触式IC卡1的外壳.IC卡安装在IC卡外壳安装座上。当IC卡外壳安装件被封装在能够容纳安装件的大致相同尺寸的邮寄信封中时，作为插入信封中的另一个外壳的外壳3在与IC卡1的IC模块1m相对的位置处被加工安装在IC卡外壳安装件2上，使得对应于IC模块的部分的厚度从0.10mm增加到5.0mm。外壳可以是厚壁的，硬化的，设置有由塑料树脂，纸或固定到相应部分上的金属形成的保护构件。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006157049A Film-carrier tape, method of manufacturing film-carrier tape, film-carrier tape on which ic modules are mounted, and method of manufacturing film-carrier tape on which ic modules are mounted 有权
标题翻译：薄膜载体带，制造薄膜载体带的方法，IC模块安装的薄膜载体带以及制造IC模块安装的薄膜载体带的方法
公开(公告)号：JP2006157049A
公开(公告)日：2006-06-15
申请号：JP2006040825
申请日：2006-02-17
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： H01L21/60 , B42D15/10 , G06K19/077 , H01L21/50
CPC分类号： H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a film-carrier tape capable of automatically and accurately positioning itself at a working position including initial working position for a module by a simple process, and a transportation device capable of accurately positioning the tape at the working position with a simple constitution of the device using the film-carrier tape.
SOLUTION: The film-carrier tape is provided with a plurality of IC chips 13 that are respectively mounted on module cutout regions 3 in the length direction of the tape to manufacture IC modules 10, each of which is built in an IC card, by individually cutting out the module cutout regions 3. One piece or more of a positioning hole 4 per one piece or one line of the module cutout region 3 in the width direction of the tape is formed in a predetermined position other than the module cutout regions 3. The transfer device 30 detects the positioning hole 4 with a photosensor to stop the transportation at the predetermined working position.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够通过简单的过程自动且精确地定位在包括模块的初始工作位置的工作位置的胶片载带，以及能够将胶带精确地定位在胶带使用薄膜载带的装置的简单结构的工作位置。＆lt; P＆gt;解决方案：胶片载体带设置有多个IC芯片13，其分别安装在带的长度方向上的模块切除区域3上，以制造IC模块10，IC模块10内置于IC卡通过单独地切出模块切口区域3.在带的宽度方向上的每一片或模块切除区域3的一行中的一个或多个定位孔4形成在除了模块切口传送装置30用光传感器检测定位孔4，以停止在预定工作位置的传送。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005165699A Method for issuing ic card, ic module for ic card, and ic card 有权
标题翻译： IC卡发卡方法，IC卡IC模块和IC卡
公开(公告)号：JP2005165699A
公开(公告)日：2005-06-23
申请号：JP2003403902
申请日：2003-12-03
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： B42D15/10 , G06K17/00 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a method for issuing an IC card that can reduce the lead time from the acceptance of an order to delivery; an IC module for an IC card; and an IC card. SOLUTION: The method for issuing an IC card, that is carried out at the stage of COT (tape-like IC module), includes (1) a process for writing the data needed to actually use the IC card and setting files on the IC chip of each IC module at the stage of the COT; (2) a process for generating issuance identification data associated with the inspection/issuance result of each module, the names of the data files issued, and the order of the data files issued, on the basis of the relationship of module specific numbers designated for the individual modules as to a COT sequence; and (3) a process for writing the module specific numbers in the rewritable memory areas of the individual IC modules that do not affect the actual use of the IC chips. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以减少从接受订单到交货的交货时间的IC卡的发行方法; 用于IC卡的IC模块; 和IC卡。解决方案：在COT（带状IC模块）阶段执行的用于发行IC卡的方法包括（1）用于写入实际使用IC卡所需的数据和设置文件的处理在COT阶段的每个IC模块的IC芯片上; （2）根据指定的模块特定号码的关系，生成与每个模块的检查/发布结果相关联的发布识别数据，所发布的数据文件的名称和所发布的数据文件的顺序的处理关于COT序列的各个模块; 以及（3）在不影响IC芯片的实际使用的各个IC模块的可重写存储区域中写入模块特定编号的处理。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005092761A Manufacturing method of uim with card frame, and uim with the card frame 审中-公开
标题翻译：具有卡框的UIM的制造方法和具有卡框的UIM
公开(公告)号：JP2005092761A
公开(公告)日：2005-04-07
申请号：JP2003328559
申请日：2003-09-19
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： B42D15/10 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a user identity module (UIM) with a card frame, and a UIM with a card frame, which does not scratch a person, without leaving sharp protrusions on frame sides, when the UIM 1 is broken off from the card frame 2. SOLUTION: The UIM with a card frame has a surrounding slit within the card frame for forming the UIM 1 enclosed therein, and bridges 1 and 3 through which the UIM is connected to the card frame. The manufacturing method of the UIM includes the steps of (1) milling the surrounding slit 4 by an end mill, with the bridges 3 being left on the periphery of the UIM on the card frame, (2) machining half-cuts 6 at the bridge portions along the periphery of the UIM, and (3) forming a notch 5, by the end mill on the periphery of the UIM and at both ends or both of near ends of the bridge portions so that sharp protrusions are not left on the card frame sides, after breaking off the UIM. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供具有卡框的用户身份模块（UIM）和具有卡框的UIM的制造方法，其不会划伤人，而不会在框架侧面上留下尖锐的突起，当时 UIM1从卡框2断开。解决方案：具有卡框的UIM在卡框架内具有用于形成封装的UIM 1的周围狭缝，以及连接UIM的桥1和3 到卡框。 UIM的制造方法包括以下步骤：（1）通过立铣刀铣削周围狭缝4，桥3留在卡框上的UIM的周边上，（2）加工半切割6 沿着UIM的周边的桥接部分，以及（3）通过位于UIM的周边上的端铣刀和桥接部分的两端或两个近端处的端铣刀形成切口5，使得尖锐的突起不会残留在卡框边，断掉UIM后。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004362200A Method for manufacturing ic card and ic card 审中-公开
公开(公告)号：JP2004362200A
公开(公告)日：2004-12-24
申请号：JP2003158935
申请日：2003-06-04
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： B42D15/10 , G06K19/077 , H01L21/56
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing an IC card having excellent appearance and high durability, and an IC card. SOLUTION: In this method for manufacturing an IC card by forming a concave 21 for embedding an IC module at a card base body, and hot-pressing and mounting the IC module on the concave for embedding the IC module, a thin groove d for releasing expanded air generated when the IC module is heated and mounted on the surface of the first concave of the concave for embedding the IC module is formed so as to be communicated from the outer circumference of the first concave to the second concave. The IC card is manufactured by forming the concave for embedding the IC module at the card base body, and hot-pressing and mounting the IC module on the concave for embedding the IC module, and the thin groove d is formed so as to be communicated from the outer circumference of the first concave to a second concave 212 on the surface of the first concave 211 of the concave for embedding the IC module. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2004326381A Data carrier and method for manufacturing same 审中-公开
公开(公告)号：JP2004326381A
公开(公告)日：2004-11-18
申请号：JP2003119216
申请日：2003-04-24
申请人： Dainippon Printing Co Ltd , 大日本印刷株式会社
发明人： SHIMIZU KATSUMI
IPC分类号： B42D15/10 , G06K19/077
摘要： PROBLEM TO BE SOLVED: To provide a data carrier which can be used by equipment using a small-sized data carrier in general by making it possible to cut the data carrier into smaller sizes as necessary and a method for manufacturing the data carrier. SOLUTION: In this data carrier configured by embedding an IC module in a card base material, the card base material is provided with a first card base material portion including an IC module embedded portion where the IC module is embedded and a second card base material portion excluding the IC module embedded portion, and the boundary section of the first card base material portion and the second card base material portion is formed so as to be separable. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JPH11259621A MANUFACTURE OF IC MODULE AND IC MODULE 失效
公开(公告)号：JPH11259621A
公开(公告)日：1999-09-24
申请号：JP5652498
申请日：1998-03-09
申请人： DAINIPPON PRINTING CO LTD
发明人： SHIMIZU KATSUMI , KON KENJI
IPC分类号： G06K19/077 , B42D15/10 , H01L21/56 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To provide a method for the manufacture of an IC module which carries out resin-sealing in a specific shape easily and stably even when a material with low viscosity is used as the sealing resin coating an IC chip and the IC module which has high quality including shape precision for the sealing resin under wide-range viscosity conditions. SOLUTION: This method for the manufacture of an IC module which mounts an IC chip 14 on a chip mount part of an insulating film 11 and also covers the IC chip 14 with a sealing resin 16 is provided with a thin-film forming process for forming a thin-film layer 12 which can be removed through etching on one surface of the insulating film 11 and a frame body forming process for forming a frame body 12a as a flow stopper for the sealing resin 16 by etching at the position surrounding the chip mount part of the thin-film layer 12 on the insulating film 11.

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