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    • 9. 发明专利
    • HEAT-RESISTANT MOLDING COMPOUND
    • JPS6067539A
    • 1985-04-17
    • JP17649483
    • 1983-09-26
    • DAINIPPON INK & CHEMICALS
    • KAMEDA MAMORUYAMAUCHI NOBUHIKO
    • C08G73/00C08G73/10C08J5/24
    • PURPOSE:To obtain titled molding compound capable of low-pressure molding, therefore of autoclave molding, by impregnating reinforcing fiber with a specific blend comprising polyimide resin and other several components followed by bringing the resultant composite into a B-stage to make a flexible prepreg. CONSTITUTION:A blend consisting of (A) a polyimide resin, (B) 10-70 (pref. 20- 50)wt% of a reactive epoxy or vinyl group-contg. polymeric oligomer with a molecular weight 200-100,000, (C) 10-100pts.wt., based on 100pts.wt. of the component (A), or 10-200pts.wt., based on 100pts.wt. of the component (A) plus the solvent (D), of one sort, pref. several sorts of reactive vinyl group-contg. monomer(s) with boiling point(s) ranging from that of the solvent (D) to 180 deg.C, and (D) a solvent, i.e. a mixture of a high-boiling point solvent homogeneoulsy dispersible pref. dissolvable for the blend and a low-boiling point solvent is impregnated in (E) reinforcing fiber followed by drying at 70-200 deg.C for several-several tenth minutes to bring the resultant composite into a B-stage to make a prepreg, i.e. the ojbective molding compound.