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    • 3. 发明专利
    • PHOTODETECTOR
    • JPH08195504A
    • 1996-07-30
    • JP3581995
    • 1995-01-17
    • DAIDO STEEL CO LTD
    • IMAIZUMI MITSURU
    • H01L29/06H01L31/10
    • PURPOSE: To dispense with an optical filter for a light intake face of a photodetector and to make variable an energy value, i.e., a wavelength, of the minimum light which can be outputted as an electric signal through photoelectric conversion, by using a layer comprising specific quantum dots and an energy barrier, as a light-receiving layer. CONSTITUTION: A photodetector is obtained by forming a buffer layer 11, a base layer 12, a light-receiving layer 15 comprising an energy barrier layer 13 and a GaAs quantum dot layer, an emitter layer 16, a window layer 17, a P electrode 18 and also an N electrode 19 on a semiconductor substrate 10. As the light-receiving layer 15 of the photodetector, herein, a layer which has a plurality of quantum dots 14 each constituted of a semiconductor having sectional dimensions of about a de Broglie wavelength of an electron and has a semiconductor surrounding these quantum dots 14, having potential energy higher than the one of the quantum dots 14 and functioning as the energy barrier 13 and which comprises the quantum dots 14 and the energy barrier 13, is used.
    • 6. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPH0194677A
    • 1989-04-13
    • JP25180187
    • 1987-10-06
    • DAIDO STEEL CO LTD
    • IMAIZUMI MITSURUKATO TOSHIHIROSHICHI EIICHI
    • H01L31/04C30B29/40
    • PURPOSE:To prevent electric performance deterioration attributable to the presence of buffers by forming a shortcircuit electrode shortcircuiting two kinds of semiconductors in a semiconductor element, wherein the two kinds of semiconductors whose band gaps are different are stacked in such a manner as to be interposed between buffers for alleviating lattice mismatching, and currents are allowed to flow between such two kinds of semiconductors. CONSTITUTION:A semiconductor element 10 comprises two kinds of semiconductors 12, 14, whose band gaps are different, being stacked in such a manner as to be interposed between buffers for alleviating lattice mismatching, and being used so that currents are allowed to flow between such two kinds of semiconductors 12, 14, wherein a shortcircuit electrode 30 for shortcircuiting said two kinds of semiconductors 12, 14 is provided. For example, a tandem solar battery 10 is constructed by stacking a solar battery 14, in which a p-n junction is formed by an n-GaAs layer and a P - GaAs layer, on a solar battery 12, in which a p-n junction is formed by an n-Si layer and a P -Si layer, while interposing a buffer 16 consisting of a GaP layer, a GaP/ GaAs1-xPx strained superlattice layer, and a GaAs1-xPx/GaAs strained superlattice layer. An Au shortcircuit electrode 30 is arranged by forming a plurality of grooves 26, 28 both horizontally and vertically on the surface of such tandem solar battery.
    • 7. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR ELEMENT
    • JPS6477928A
    • 1989-03-23
    • JP23546387
    • 1987-09-18
    • DAIDO STEEL CO LTD
    • IMAIZUMI MITSURUKATO TOSHIHIROSHICHI EIICHI
    • H01L21/205C30B25/18
    • PURPOSE:To prevent the adhesion of an impurity, etc., to decrease recombination centers and to improve the characteristics of a p-n junction by epitaxial-growing one of a p-type semiconductor and an n-type semiconductor and heating and purifying the surface of the semiconductor. CONSTITUTION:A substrate 22 is pretreated, and an oxide, etc., on the surface 28 are removed. The substrate 22 is charged into a reaction furnace 10 for an MOCVD device, and heated at a temperature of approximately 600-800 deg.C, a raw material gas is supplied, n-GaAs is epitaxial-grown onto the surface 28, and a semiconductor 38 is grown. H2 gas containing arsine is introduced, and the surface is heated up to approximately 600-1000 deg.C, and held for approximately one or sixty min, thus purifying and treating the surface. The temperature of the surface is adjusted at 600-800 deg.C, a raw material gas is fed, and a p -GaAs semiconductor 40 is grown. A p-n junction is constituted by the semiconductors 38 and 40. When the temperature is changed into a temperature proper to the crystal growth of p -Al0.8Ga0.2As and the raw material gas is supplied, a p Al0.8Ga0.2As semiconductor 42 is grown, thus acquiring a semiconductor element 34.
    • 9. 发明专利
    • CRYSTAL GROWING DEVICE IN CHEMICAL VAPOR OF ORGANO METALLIC COMPOUND
    • JPS6431973A
    • 1989-02-02
    • JP18700687
    • 1987-07-27
    • DAIDO STEEL CO LTD
    • KATO TOSHIHIROIMAIZUMI MITSURU
    • C23C16/18
    • PURPOSE:To grow crystal contg. metallic atom with uniform film thickness even in the peripheral edge part of a substrate by providing a recessing part having a same shape as the substrate to the holder thereof, nesting the substrate therein, and introducing a gaseous raw material cont. organo metallic compound into a reaction chamber. CONSTITUTION:A gaseous raw material contg. organo metallic compound is introduced into the reaction chamber 12 of a bell jar 10 made of quartz regulated to the prescribed temp. with a high-frequency coil 16 from a raw material gas feeder 14. Thereby crystal contg. metallic atoms of the organo metallic compound is grown on the surface of a substrate held by a carrying tray 20 made of quartz which is provided on a supporting base 18 made of graphite. In the above-mentioned crystal growing device of organo metallic compound, a spot facing hole 26 having a same shape as the substrate is provided on the carrying tray 20 used as the holder of the substrate and this substrate is nested into the recessing part. The depth (t) of this recessing part 26 is preferably made equal to plate thickness of the substrate. There increase of film thickness in the peripheral edge part of the substrate is solved and uniform film thickness is obtained.