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1. 发明专利

JPH0770097A PRODUCTION OF CHLOROSTYRENE OXIDE 失效
公开(公告)号：JPH0770097A
公开(公告)日：1995-03-14
申请号：JP21874593
申请日：1993-09-02
申请人： DAICEL CHEM
发明人： IKUI SOUZOU
IPC分类号： C07D301/12 , C07D301/14 , C07D301/19 , C07D303/08
摘要： PURPOSE:To provide production method of chlorostyrene oxide in high conversion ratio of an organic peroxide and in high yield. CONSTITUTION:In production of chlorostyrene oxide by reacting chlorostyrene with a peroxide, 0.05-5.0wt.% of an alkali metal salt of a weak acid and/or a phosphoric acid-containing ester based on the peroxide exists in the reactional system.

2. 发明专利

JPH06207126A RESIN COMPOSITION FOR THERMOSETTING POWDER COATING 失效
公开(公告)号：JPH06207126A
公开(公告)日：1994-07-26
申请号：JP402593
申请日：1993-01-13
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C09D5/03 , C09D5/46 , C09D163/00 , C09D167/00
摘要： PURPOSE:To obtain a resin composition for thermosetting powder coating, containing a specific epoxy resin, a hydroxyl group-containing polyester resin and a cationic curing catalyst in prescribed amounts, excellent in weather and heat resistance, electrical characteristics and anticorrosive properties without evolving toxic volatiles and useful for outer surfaces of steel pipes, etc. CONSTITUTION:The composition comprises (A) an epoxy resin obtained by reacting (i) a compound having one or more vinyl groups and one epoxy group in one molecule such as 4-vinylcylohexane-1-oxide with (ii) one or more selected from polymers containing polybasic acids (anhydrides), acid-terminated polymers and polymers containing carboxylic acid group and (iii) one or more selected from compounds having one or more active hydrogens, providing a resin having vinyl group and further epoxidizing the resultant resin, (B) a hydroxyl group- containing polyester resin and (C) a cationic curing catalyst such as N,N- dimethyl-N-benzylanilinium antimony hexafluoride in an amount of 0.05-3.0wt.% [based on the total amount of the components (A) and (B)].

3. 发明专利

JPH06157678A ACRYLIC RESIN AND ITS PRODUCTION 失效
公开(公告)号：JPH06157678A
公开(公告)日：1994-06-07
申请号：JP31358892
申请日：1992-11-24
申请人： DAICEL CHEM
发明人： IKUI SOUZOU
IPC分类号： C08F220/12 , C08F20/32 , C08F220/10 , C08F220/32 , C08G59/20 , C08G59/32
摘要： PURPOSE:To obtain an easily handleable acrylic resin. CONSTITUTION:This resin is one having at least one epoxy group in the molecule, a number-average molecular weight of 800-1500, a weight-average molecular weight to number-average molecular weight ratio of 2.5 or below and an epoxy concentration of 2.5mol/kg of resin or above. It is produced by polymerizing 100 pts.wt. acrylic monomer in the presence of 2-10 pts.wt. polymerization initiator at 130-160 deg.C.

4. 发明专利

JPH06116361A PHOTO-SETTING RESIN COMPOSITION 失效
公开(公告)号：JPH06116361A
公开(公告)日：1994-04-26
申请号：JP27023992
申请日：1992-10-08
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C08G59/20 , C08G59/34 , C08G59/68 , H05K3/00
摘要： PURPOSE:To obtain a photo-setting resin composition capable of providing cured products excellent in heat and weather resistances. CONSTITUTION:This photo-setting resin composition consists essentially of (A) an epoxy resin obtained by further epoxidizing a resin, having vinyl groups and prepared by reacting (a) a compound having one or more vinyl groups and one epoxy group in one molecule with (b) at least one of polybasic acid anhydrides, polybasic acids, acid-terminated polymers and polymers containing carboxylic acid group and (c) at least one of compounds having one or more active hydrogen atoms and a photoinitiator. Thereby, this photo-setting resin composition capable of providing cured products excellent in heat and weather resistances can be developed.

5. 发明专利

JPH061905A EPOXY RESIN COMPOSITION 失效
公开(公告)号：JPH061905A
公开(公告)日：1994-01-11
申请号：JP15965792
申请日：1992-06-18
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C08G59/20 , C08G59/00 , C08G59/34 , C08L63/00
摘要： PURPOSE:To obtain a composition providing a cured material having extremely excellent heat resistance by blending specific two kinds of epoxy resins. CONSTITUTION:(A) 95-5 pts.wt. epoxy resin containing one or more epoxy groups in the molecule except a component B is blended with (B) 5-95 pts.wt. epoxy resin obtained by reacting 1-99 pts.wt. compound containing one or more vinyl groups and one epoxy group in one molecule with 99-1 pts.wt. polymer containing a polybasic acid anhydride, polybasic acid, acid end polymer or carboxyl group-containing polymer and 0-99 pts.wt. compound containing one or more active hydrogens such as alcohols or hydroxyl group end polymer to give a vinyl group-containing resin and further epoxidizing the resin. 4- Vinylcyclohexen-1-oxide or limonene monooxide is used as the compound containing one or more vinyl groups and one epoxy group in one molecule in the component B.

6. 发明专利

JPH04164921A POLYETHER COMPOUND 失效
公开(公告)号：JPH04164921A
公开(公告)日：1992-06-10
申请号：JP29340490
申请日：1990-10-30
申请人： DAICEL CHEM
发明人： IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C08G65/26 , C08F290/00 , C08F299/02
摘要： PURPOSE:To obtain a polyether compound useful as a material having a good balance among properties such as a curing rate, hardness, flexibility and weathering resistance by selecting a specified compound having a main chain comprising cyclohexane rings each having a (meth)acrylic group as the side chain and ether groups. CONSTITUTION:A polyether compound having ether groups and (meth)acrylic groups and represented by formula I (wherein R is a residue of an organic compound having l active hydrogen atoms or HO-, n1, n2...nl are each 0 or 1-100; their sum is 1-100; l is 1-100 and is the functionality of R ; A is a skeleton comprising groups of formula II (wherein R is H or methyl) or a mixture of groups of formulas II and III (wherein R is a residue of an organic compound), and at least one skeleton of formula II should be contained in the molecule. This compound is useful as a material extensively used in industrial fields of ultraviolet- or electron beam-curable inks, plastic coating materials, film coating materials or resist inks.

7. 发明专利

JPH06248022A ACRYLIC RESIN AND ITS PRODUCTION 失效
公开(公告)号：JPH06248022A
公开(公告)日：1994-09-06
申请号：JP3511593
申请日：1993-02-24
申请人： DAICEL CHEM
发明人： IKUI SOUZOU
IPC分类号： C08F20/32 , C08G59/14 , C08G59/30
摘要： PURPOSE:To obtain an easily handleable acrylic resin by reacting a compound having a silanol group or an alkoxysilane group. CONSTITUTION:This acrylic resin has a number-average mol.wt. of 500-1500, a weight-average mol.wt./number-average mol.wt. of of

8. 发明专利

JPH06226395A COMPOSITION FOR BINDING MOLDING SAND 失效
公开(公告)号：JPH06226395A
公开(公告)日：1994-08-16
申请号：JP1338893
申请日：1993-01-29
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： B22C1/22 , C08G59/20 , C08G59/34 , C08G59/62 , C08L61/06 , C08L63/00
摘要： PURPOSE:To provide the compsn. for binding molding sand which has high strength and excellent heat resistance at the time of calcination of a casting mold or core. CONSTITUTION:This compsn. for binding the molding sand consists of (a) an epoxy resin obtd. by further epoxylating a resin having the vinyl groups obtd. by bringing a compd. having >=1 pieces of vinyl groups and one piece of epoxy group in one molecule, at least one kind of polymers contg. a polybasic acid anhydride, polybasic acid, acid terminal polymer and carboxylic acid group and at least one kind of compds. having >=1 pieces of active hydrogen, (b) a hardener for the epoxy group which is inert at room temp. and (c) a phenol formaldehyde resin. As a result, the compsn. for binding the molding sand which has the high strength and the excellent heat resistance at the time of calcination of the casting mold or core is developed.

9. 发明专利

JPH06116357A METHOD FOR PURIFYING EPOXY RESIN 失效
公开(公告)号：JPH06116357A
公开(公告)日：1994-04-26
申请号：JP26892792
申请日：1992-10-07
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C08G59/02
摘要： PURPOSE:To obtain a method for producing an alicyclic epoxy resin with an extremely low content of ionic substances. CONSTITUTION:This method for purifying an epoxy resin is to wash the resultant epoxy resin with an alkaline aqueous solution in a step for reacting (a) a compound having one or more vinyl groups and one epoxy group in one molecule with (b) at least one selected from polybasic acid anhydrides, polybasic acids, acid-terminated polymers and polymers containing carboxylic acid groups and (c) at least one selected from compounds having one or more active hydrogen atoms and reacting the prepared resin having the vinyl groups with peracetic acid. Thereby, the objective method for producing an alicyclic epoxy resin with an extremely low content of ionic substances can be developed.

10. 发明专利

JPH0684203A SUBSTRATE FOR OPTICAL DISK 失效
公开(公告)号：JPH0684203A
公开(公告)日：1994-03-25
申请号：JP23815892
申请日：1992-09-07
申请人： DAICEL CHEM
发明人： MAEDA KATSUYUKI , IKUI SOUZOU , HARANO YOSHIYUKI
IPC分类号： C08G59/20 , C08G59/34 , G11B7/24 , G11B7/253
摘要： PURPOSE:To provide the substrate for an optical disk having excellent heat resistance and electrical insulation characteristic. CONSTITUTION:This substrate consists essentially of an epoxy resin obtd. by further epoxylating the resin having the vinyl groups obtd. by bringing a compd. having >=1 pieces of the vinyl groups and one piece of epoxy group in one molecule, at least one kind selected from polymers contg. a polybasic acid anhydride, polybasic acid, acid terminal end polymer and carboxylic acid group and at least one kind selected from compds. having >=1 pieces of active hydrogen into reaction and a hardener for this epoxy resin. As a result, the substrate for the optical disk having the excellent heat resistance and electrical insulation characteristic is obtd.

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