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1. 发明专利

JP2007044701A Lead-free solder material 审中-公开
标题翻译：无铅焊料
公开(公告)号：JP2007044701A
公开(公告)日：2007-02-22
申请号：JP2005228841
申请日：2005-08-05
申请人： Asami Makoto , Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社 , 浅見真
发明人： MAKITA KAZUYUKI , ICHINOSE MASAKI , WATAJIMA TOSHIHITO , SAOTOME MASANORI , YAMASHITA MITSUO , ASAGI TAKESHI , HIRAI MASATOSHI , MURATA TORU
IPC分类号： B23K35/26 , C22C13/00
CPC分类号： B23K35/262 , Y10T428/31678
摘要： PROBLEM TO BE SOLVED: To inexpensively obtain a thin sheet-shaped lead-free solder material. SOLUTION: An ingot of a lead-free alloy comprising tin, 10 to 20 wt.% silver and 3 to 5 wt.% copper is produced. The ingot is rolled, so as to be a sheet-shaped solder material with a thickness of 40 to 120 μm. Further, the solder material may has a disk shape with a size same as that of the member to be joined. In this way, the inexpensive lead-free solder material requiring no powering in itself or in the raw material thereof when being made into a thin sheet shape is provided. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了廉价地获得薄片状无铅焊料材料。解决方案：制备包含锡，10至20重量％银和3至5重量％铜的无铅合金锭。将该锭轧制成为厚度为40〜120μm的片状焊料。此外，焊料材料可以具有与要接合的构件的尺寸相同的尺寸的盘形。以这种方式，提供了当制成薄片形状时不需要自身或其原材料供电的便宜的无铅焊料。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2008108886A Resin-sealed semiconductor device 有权
标题翻译：树脂密封半导体器件
公开(公告)号：JP2008108886A
公开(公告)日：2008-05-08
申请号：JP2006289888
申请日：2006-10-25
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： ICHINOSE MASAKI
IPC分类号： H01L23/48
CPC分类号： H01L2224/40 , H01L2224/4007 , H01L2224/40245 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/181 , H01L2924/00012 , H01L2224/37099
摘要： PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device capable of raising reliability in moisture resistance. SOLUTION: The amount of solder 7 for fixing the upper surface electrode exposure part 10 of a semiconductor chip 6 and an auxiliary terminal 2 is made to be appropriate, and a solder component and moisture are prevented from directly contacting an oxide film 6c, so that the reliability in moisture resistance is raised. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供能够提高耐湿性的可靠性的树脂密封型半导体装置。解决方案：将用于固定半导体芯片6和辅助端子2的上表面电极曝光部分10的焊料7的量适当，并且防止焊料组分和湿气直接接触氧化膜6c ，从而提高耐湿性的可靠性。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2007048787A Solder bonding method 有权
标题翻译：焊接方法
公开(公告)号：JP2007048787A
公开(公告)日：2007-02-22
申请号：JP2005228840
申请日：2005-08-05
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： MAKITA KAZUYUKI , ICHINOSE MASAKI , WATAJIMA TOSHIHITO , SAOTOME MASANORI , YAMASHITA MITSUO
IPC分类号： H01L21/02 , B23K1/00 , B23K1/008 , B23K31/02 , B23K35/14 , B23K35/26 , B23K101/40 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To perform solder bonding having solder heat resistance which is equal to a conventional case using a solder material comprising lead or beyond it by using a lead-free solder material in a thin sheet shape.
SOLUTION: Ingot obtained by rolling an alloy comprising tin, 10 to 20 weight% of silver, and 3 to 5 weight% or less of cooper as main components and comprising no lead is rolled and is made into the sheet shape. A wafer surface is pressurized with pressure of 1 to 10 MPa from a vertical direction, in a state where the solder material in the sheet shape and a wafer are alternately laminated. The solder material is melted at a temperature from a temperature higher than a solidus line temperature of the solder material by 30°C to a temperature lower than a liquidus line temperature by 30°C in vacuum atmosphere. A low melting point component in the melted solder material is pushed outside from the bonding part of the wafers.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：通过使用薄片形状的无铅焊料，进行与使用包含铅或超过铅的焊料材料的常规情况相同的焊料耐热性的焊料接合。解决方案：轧制含有锡，10〜20重量％的银和3〜5重量％以下的作为主要成分并且不包含铅的铜的合金的锭被轧制并制成片状。在片状形状的焊料材料和晶片交替层叠的状态下，从垂直方向以1〜10MPa的压力对晶片表面进行加压。在真空气氛中，焊料材料在高于焊料材料的固相线温度30℃的温度下熔融至低于液相线温度30℃的温度。熔融的焊料中的低熔点成分被从晶片的接合部分推出。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2005044932A High-tension diode 审中-公开
标题翻译：高张力二极管
公开(公告)号：JP2005044932A
公开(公告)日：2005-02-17
申请号：JP2003201880
申请日：2003-07-25
申请人： Fuji Electric Device Technology Co Ltd , 富士電機デバイステクノロジー株式会社
发明人： ICHINOSE MASAKI , AMANO AKIRA , ITO HIDEAKI , FURUHATA HIROAKI
IPC分类号： H01L21/329 , H01L23/29 , H01L23/31 , H01L25/07 , H01L25/11 , H01L29/861
CPC分类号： H01L25/117 , H01L23/293 , H01L23/3135 , H01L24/33 , H01L29/861 , H01L2924/12036 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To sort out resin for a resin sealed high-tension diode which has an excellent anti-moisture property by using, as standards, such characteristic values found acceptable in a prescribed anti-moisture test for sealing resin, without assembling a high-tension diode using sealing resin, and also to provide the high-tension diode having a high anti-moisture property which is manufactured using the resin at a low cost since the cost of the resin can be reduced.
SOLUTION: The high-tension diode is sealed with fire-resistant epoxy resin which is such that resin extract under prescribed conditions has an electric conductivity of 250 μS/cm or less.
COPYRIGHT: (C)2005,JPO&NCIPI

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