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    • 3. 发明专利
    • Connector and semiconductor testing device
    • 连接器和半导体测试设备
    • JP2013026145A
    • 2013-02-04
    • JP2011162278
    • 2011-07-25
    • Advantest Corp株式会社アドバンテストMolex Japan Co Ltd日本モレックス株式会社
    • WAGATA HIROTAKASAKIYAMA SHINHAMA HIROYUKISUZUKI TERUHITOYAJIMA HIROYUKIMIZUMURA AKINORI
    • H01R24/44H01R12/71
    • H01R13/629H01R13/422H01R13/6473H01R24/50
    • PROBLEM TO BE SOLVED: To provide a connector capable of improving a signal transfer characteristic, and semiconductor testing device.SOLUTION: In a connector 1, a first semi-cylinder part 6 is engaged with an insulation member 5 in a state where the first semi-cylinder part 6 is elastically deformed so that an interval between both end parts in the circumferential direction increases, and a second semi-cylinder part 7 is engaged with the insulation member 5 with which the first semi-cylinder part 6 is engaged in a state where the second semi-cylinder part 7 is elastically deformed so that an interval between both end parts in the circumferential direction increases. A slope that guides the first semi-cylinder part 6 so that an interval between the center parts of the first semi-cylinder part 6 and the second semi-cylinder part 7 in the circumferential direction is decreased as insertion of an assembly 3 proceeds, is provided in an insertion hole 21 of an enclosure 2.
    • 要解决的问题:提供能够提高信号传递特性的连接器和半导体测试装置。 解决方案:在连接器1中,在第一半圆筒部6弹性变形的状态下,第一半圆筒部6与绝缘构件5接合,使得圆周方向两端部之间的间隔 并且第二半圆筒部7与在第二半圆筒部7弹性变形的状态下与第一半圆筒部6接合的绝缘构件5接合,使得两端部之间的间隔 在圆周方向上增加。 引导第一半圆筒部6的斜面,使得随着组件3的插入而在圆周方向上的第一半圆筒部6的中心部和第二半圆筒部7之间的间隔减小, 设置在外壳2的插入孔21中。版权所有(C)2013,JPO&INPIT