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    • 8. 发明专利
    • PHOTOSENSITIVE RESIN COMPOSITION
    • JPS63305346A
    • 1988-12-13
    • JP14089087
    • 1987-06-05
    • ASAHI CHEMICAL IND
    • TAKAHASHI MOTOAKIUSUBUCHI MINORU
    • G03F7/027
    • PURPOSE:To easily obtain a cured material which has the excellent sensitivity and no amine odor and the sufficient mechanical strength by exposing for a short period, by incorporating an amide compd. having a specified structure with a prescribed ratio together with a photopolymerization initiator in the titled material. CONSTITUTION:The titled composition contains the amide compd. shown by formula I and the photopolymerization initiator, and said amide compd. is necessary to be incorporated in the titled composition in an amount of >=5wt.% of the compd. based on the total weight of the titled composition. In the case that the additional mount of the compd. is about 3wt.%, the sensitivity of the titled composition somewhat increases, but, the sufficient effect is not obtd., in the reduction of an exposure time and the formation on a relief such as a minimum point, etc. The compounding amount of the photopolymerization initiator is usually 0.001-10wt.% based on the total weight of the titled composition. Thus, the cured material which has no amine order the excellent sensitivity measured based on insolubility of the cured material, and the excellent sensitivity measured based on the mechanical strength and the hardness is obtd.