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1. 发明专利

JP2003200387A ULTRASONIC CUTTING DEVICE AND CUTTING TOOL 审中-公开
公开(公告)号：JP2003200387A
公开(公告)日：2003-07-15
申请号：JP2001397268
申请日：2001-12-27
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU
IPC分类号： B26D7/08 , B28D5/00
摘要： PROBLEM TO BE SOLVED: To reduce cutting width. SOLUTION: A screw bar 5a is rotated by driving a motor 4 in one rotation direction after placing a part 25 to be cut on a table 2 for moving a support mechanism 6 downward. When the table 2 moves laterally from the position shown by the actual lines to the position shown by the virtual lines with a resonator 15, a cutting tool 21 and a blade 23 resonated with the ultrasonic vibration generated by a vibrator 17, the lower section of the blade 23 is brought into contact with the part 25 to be cut on the table 2 to cut the part 25 by the ultrasonic vibration transmitted from the blade 23. COPYRIGHT: (C)2003,JPO

2. 发明专利

JP2001038291A ULTRASONIC HORN FOR ULTRASONIC VIBRATION JOINING 失效
公开(公告)号：JP2001038291A
公开(公告)日：2001-02-13
申请号：JP21885499
申请日：1999-08-02
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , NAKAI SEIYA
IPC分类号： B06B1/02 , B23K20/10 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To achieve weight reduction and the shortening of the distance be tween both supports by forming joining action parts in the upper and rear surfaces of a horn body at the max. vibration amplitude point of the center thereof and projecting out bent support parts from the front and rear surfaces of the horn body at two min. vibration amplitude points separated from the joining action parts by the same dimension on both sides of the horn body. SOLUTION: Square joining action parts 3, 4 are formed in the upper and rear surfaces of a horn body 2 at the max. vibration amplitude point f3 of the center of the horn body so as to outwardly protrude from the horn body 2 and bent support parts 5-8 are formed in the front and rear surfaces of the horn body 2 in a protruded state at two min. vibration amplitude points f2, f4 separated from the joining action parts 3, 4 by the same dimension on both sides of the horn body. By this constitution, the work space to members to be joined can be ensured without being narrowed by the support parts 5-8 and weight reduction and the shortening of the distance between both support parts can be achieved.

3. 发明专利

JP2000200961A ULTRASONIC VIBRATION BONDER 失效
公开(公告)号：JP2000200961A
公开(公告)日：2000-07-18
申请号：JP104499
申请日：1999-01-06
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , NAKAI SEIYA
IPC分类号： B23K20/10 , H01L21/00 , H01L21/52 , H01L21/60 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To simplify a suction passage structure. SOLUTION: A resonator 23 has a suction passage 31 at a max. oscillation amplitude point on which a bonding action part 27 is provided, a measuring mechanism 60 measures the positions of pads 93 of a circuit board 92 mounted on a mounting mechanism 2 and pads of a semiconductor chip 90 vacuum- chucked to a bonding action part 7 of the resonator 23 for driving the mounting mechanism 2, thereby matching the positions of the pads 91, 93. The resonator 23 is lowered to lay the pads 91, 93 one above the other under pressure, and an oscillator 30 is actuated to transmit ultrasonic vibration to the resonator 23, thereby jointing the pads 91, 93.

4. 发明专利

JPH11314168A RESONATOR FOR ULTRASONIC VIBRATION WELDING 失效
公开(公告)号：JPH11314168A
公开(公告)日：1999-11-16
申请号：JP11946698
申请日：1998-04-28
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU
IPC分类号： B06B1/02 , B23K20/10
摘要： PROBLEM TO BE SOLVED: To attain effectiveness and economy of a welding operation for a deep position that has reach by fixedly attaching a joining tool to an ultrasonic horn with a screw member capable of advancing and retreating vertically to the vibrating direction. SOLUTION: This resonator is so constituted that a joining tool 2, which a length integer times as long as the half wave length of the resonance frequency, is fixedly attached to an ultrasonic horn 1 with a screw member 3 capable of advancing and retreating vertically to the vibrating direction X, thereby vibrating the tip end face 2b of the joining tool 2 in the same direction as the vibration of the ultrasonic horn 1, and enabling welding to be performed properly by ultrasonic vibration. In the case where the joining tool 2 can no longer be used through the repeated repair by grinding its tip end face 2b, the ultrasonic horn 1 can be used again, in which tuning of a resonant state is properly maintained, by merely exchanging the old joining tool 2 with a new one, with the ultrasonic horn 1 attached to the device.

5. 发明专利

JPH09283908A METHOD OF FORMING SOLDER BUMPS ON WIRING BOARD 失效
公开(公告)号：JPH09283908A
公开(公告)日：1997-10-31
申请号：JP8688996
申请日：1996-04-09
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , BABA TOMOYUKI
IPC分类号： B23K1/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To equalize the height of solder bumps and improve the quality reliability, by burying solder in bump-forming holes by the action of an ultrasonic vibration. SOLUTION: An interconnection board has a resist layer 5 having bump- forming holes 4 opened on bond terminals 3 and is dipped in a flow Y of a molten solder 12 in an ultrasonic soldering apparatus while a longitudinal wave of ultrasonic vibration Y is exerted perpendicularly on the flow Y of the solder 12 to bury the solder 12 in the holes 4 of the wiring board 1, thereby well penetrating the solder 12 everywhere into the corners of the holes 4 even being small in diameter, resulting in that the diameter and height of the solder 12 are equalized according to the holes 4. The board 1 is pulled up from the solder 12, the resist layer 5 is removed, then the solder 12 is re-molten to laminate solder bumps 6 equal in height and diameter on the bond terminals 3 of the board 1, thereby correctly connecting the bumps 6 to connection terminals 8 of semiconductor elements 7.

6. 发明专利

JPH09220661A ULTRASONIC VIBRATION SOLDERING DEVICE AND RESONATOR USED THEREFOR 失效
公开(公告)号：JPH09220661A
公开(公告)日：1997-08-26
申请号：JP2817896
申请日：1996-02-15
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , ISHII RYOICHI
IPC分类号： B23K1/08 , B06B1/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To eliminated the leakage of solder and to reduce the energy loss of ultrasonic vibration. SOLUTION: The first-half part 14b of a resonator 14 is inserted into a through-hole 8b through an incorporating hole 8c from the outside of a solder vessel 1, and a rib of a presser member 11 fitted outward to the rear-half part 14c of the resonator 14 is inserted into the incorporating hole 8c. Further, the resonator 14 is arranged so as not to contact with the through-hole 8b and an aperture 11a, and the supporting part 14a of the resonator 14 is interposed with a receiving part 8 and a presser member 11 by fastening the presser member 11 to the receiving part 8 by a screw 12 to fix the resonator 14 to the solder vessel 1. Further, the resonator 14 is constituted of an ultrasonic horn at the solder vessel 1 side and a fin booster at a vibrator 13 side, and the fin booster is formed with a material having good thermal conductivity, such as aluminum, and the vibrator can thermally be protected by radiating the heat transferred from the solder vessel to the resonator.

7. 发明专利

JPH0957467A RESONATOR FOR ULTRASONIC JOINING 失效
公开(公告)号：JPH0957467A
公开(公告)日：1997-03-04
申请号：JP21347995
申请日：1995-08-22
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU
IPC分类号： B23K20/10 , B06B3/04 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To improve quality and reliability by concentrating energy of ultrasonic vibration at between parts to be joined having a circumference formed to an annular shape so as to stabilize joining strength. SOLUTION: By arranging a cross shape vibration transducing part 18a to a minimum vibration amplitude point f6 of ultrasonic vibration of a resonator 7, a joining working part 11 is formed to the annular shape around the minimum, vibration amplitude point f6 on a cross shaped flat face of the vibration transducing part 18a. By this method, at the time of joining parts to be joined with ultrasonic vibration, the energy of ultrasonic vibration is concentrated at between the parts to be joined so as to stabilize joining strength only by uniformly pressurizing/holding the parts to be joined having an annular circumference with the joining working part 11 together with the receiving table and giving ultrasonic vibration to the resonator 7 from a vibrator 10.

8. 发明专利

JP2002334909A RESONATOR FOR ULTRASONIC VIBRATION JOINT 失效
公开(公告)号：JP2002334909A
公开(公告)日：2002-11-22
申请号：JP2001139120
申请日：2001-05-09
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , NAKAI SEIYA
IPC分类号： B23K20/10 , B06B1/02 , H01L21/60 , H01L21/607
摘要： PROBLEM TO BE SOLVED: To improve the cost benefit of forming a passage for suction that sucks a semiconductor chip to a resonator suitable, for surface mounting the semiconductor chip to a circuit board through ultrasonic vibration joint. SOLUTION: A horn body 2 is provided with a base 21, projecting over the outside surface of the horn body 2, and a passage 8 for suction formed of vertical hole 16 and horizontal hole 17 is formed inside the horn body 2. In this structure, after a jointing action part 3 is jointed with the base 21 by a brazing agent 22, such as a solder, a small hole 20 is formed from the outer side face of the jointing action part 3 toward the side of the base 21, so that a diameter D1 of a suction side port 12, that is formed in the jointing action part 3 for suck an object to be jointed, is made smaller than a diameter D2 of the passage inside the horn body 2.

9. 发明专利

JP2000260828A SEMICONDUCTOR CHIP MOUNTING EQUIPMENT 失效
公开(公告)号：JP2000260828A
公开(公告)日：2000-09-22
申请号：JP6193699
申请日：1999-03-09
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , NAKAI SEIYA
IPC分类号： H01L21/60 , H01L21/52
摘要： PROBLEM TO BE SOLVED: To facilitate incorporation into a semiconductor manufacturing line by temporarily installing a semiconductor chip on a printed circuit board(PCB) at the chip installing position with an adhesive before finally installing the chip on the PCB at the chip installing position in the surface mounting process by means of supersonic oscillation. SOLUTION: A semiconductor chip is placed on a PCB at the installing position, which is placed on a temporarily installed positioning table 2 provided in the center of the top of a temporary-installation mechanism 1. After adjusting movement in the X and Y directions, which are the horizontal and vertical directions of a level surface, and the rotating angle within the level surface, the chip is temporarily installed with an adhesive. The PCB, on which the chip is temporarily installed, is sent to a final-installation transfer line 20 from a temporarily installed transfer line 10, and is stored in a PCB storage 12a of a finally installed positioning table 12. With the temporarily installed semiconductor chip faced up, the PCB is sandwiched between a jointing portion 18 and the finally installed positioning table 12, and is pressurized. An oscillator 19 generates supersonic oscillation, causing resonator 17 to resonate, resulting in non-fusion junction of the semiconductor chip.

10. 发明专利

JP2000093894A SUPPORTING DEVICE OF ULTRASONIC VIBRATION RESONATOR 失效
公开(公告)号：JP2000093894A
公开(公告)日：2000-04-04
申请号：JP29370199
申请日：1999-10-15
申请人： ARUTEKUSU KK
发明人： SATO SHIGERU , ISHII RYOICHI , NAKAI SEIYA
IPC分类号： B06B1/02 , B23K20/10
摘要： PROBLEM TO BE SOLVED: To improve support rigidity to force orthogonal to a resonator received by the resonator at the time of working to reduce energy loss of ultrasonic vibration. SOLUTION: Locking tools 42, 43 fitted to arms 30a, 30b opposite to each other of a holder pressurize heat parts (c) of supporting parts 40e, 40f in the direction along the axial direction are abutted to stepped parts 30n, 30p of the arms 30a, 30b, and the looking tools 42, 43 and the stepped parts 30n, 30p are joined so that the supporting parts 40e, 40f of first and second boosters 40c, 40d are put between them in the direction along the axial direction, respectively.

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