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    • 6. 发明专利
    • ETCHING METHOD FOR SILICON NITRIDE FILM
    • JPH0266943A
    • 1990-03-07
    • JP21877488
    • 1988-09-01
    • FUJITSU LTD
    • SAITO TSUTOMUYANO HIROSHI
    • H01L21/302H01L21/3065
    • PURPOSE:To etch a silicon nitride film in a satisfactory anisotropic shape without substantially etching a silicon oxide film of a base by reactive ion etching it in a chromium trifluoride etching gas having pressure of 0.3-1.0Torr. CONSTITUTION:A base SiO2 film is formed on an Si substrate 1 by thermally oxidizing, and an Si3N4 film 3 is then formed by a vapor growing (CVD) method. Thereafter, after a resist pattern 4 is formed on the film 3, the substrate is inserted into an RIE device, and the film 3 is selectively etched with 0.4W/cm of power density in CIF3 gas having 0.3Torr using CIF3 as the etching gas. Since the etching rate of the film 3 to the SiO2 film of the CIF3 gas is approx. 17, the thickness DELTAt1 of the base SiO2 film 2 to be reduced by the overetching of approx. 50% is approx. 30Angstrom , and a region in which the film 2 is completely removed is not generated. Accordingly, in case of etching, the substrate 1 is not immediately exposed with ions to undergo damage.
    • 7. 发明专利
    • METHOD FOR CONTROLLING HIGH FREQUENCY POWER SOURCE
    • JPH0199116A
    • 1989-04-18
    • JP25678187
    • 1987-10-12
    • FUJITSU LTD
    • YANO HIROSHISHIMONAGA MASASHI
    • G05F1/66
    • PURPOSE:To protect a transistor and to stably output a large electric power by switching an effective value electric power control to an incident electric power control when the ratio of an incident electric power and an effective value electric power goes to the reference value or below. CONSTITUTION:A transistor type high frequency power source has an oscillator 1 and a driver amplifier 2, and an output amplifier 3, since the output of one transistor is about 200W at most, is divided into plural output amplifiers, amplified and thereafter, synthesized. A directionality coupler 4 monitors an incident electric power to a load and a reflecting electric power, a controller 5 can switch to either of an effective value electric power control or an incident electric power control, and when the incident electric power/effective value electric power goes to the reference value, for example, 0.8 or below, the effective value electric power control is switched into the incident electric power electric power control. Thus, a transistor can be protected, the control can be executed so as to output stably the large electric power and the process stabilization of the plasma application can be executed.
    • 10. 发明专利
    • DRY ASHING APPARATUS
    • JPS62272536A
    • 1987-11-26
    • JP11641886
    • 1986-05-20
    • FUJITSU LTD
    • YANO HIROSHISAITO TSUTOMU
    • H01L21/302H01L21/3065
    • PURPOSE:To largely suppress an etching with fluorine radical on a base part without so decelerating an ashing velocity by switching gas fed into a plasma light emitting chamber from a mixture gas of CF4 and O2 to only oxygen when the intensity of a light emitting spectrum of a specific wavelength becomes a preset predetermined value or higher. CONSTITUTION:When a resist is ashed by an oxygen radical, a CO light emitting spectrum is generated. Then, a spectrochemical analyzer 17 detects only the intensity of the CO light emitting spectrum, and outputs a detection signal of a level responsive to the detecting intensity. When the intensity of the input detection signal spectrum arrives at a predetermined value, a comparator 18 supplies a control signal of a logic level different from that supplied so far since the input detection signal level becomes a first reference signal level or lower from an input terminal 19 to close a conduit 10 by a solenoid valve 11. Thus, the input of Freon gas (CF4) to a plasma light emitting chamber 6 is stopped, but only oxygen (O2) is fed into the chamber 6 to eliminate an etching with fluorine radical (F*) on the base of a sample 14.