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1. 发明专利

JP2014220544A 多層配線板の製造方法有权
标题翻译：制造多层接线板的方法
公开(公告)号：JP2014220544A
公开(公告)日：2014-11-20
申请号：JP2014175997
申请日：2014-08-29
申请人：株式会社村田製作所 , Murata Mfg Co Ltd , 株式会社デンソー , Denso Corp
发明人： CHISAKA SHUNSUKE , ITO YUUKI , KATO MOTORO
IPC分类号： H05K3/46
CPC分类号： H05K3/46
摘要：【課題】寸法安定性や形状精度に優れた多層配線板が得られる多層配線板の製造方法、を提供する。【解決手段】多層配線板の製造方法は、熱可塑性の樹脂シート21の表面21a上に、導体パターン37を形成する工程と、複数枚の樹脂シート21を積層してなる積層体121を加熱しつつ、その積層方向に加圧する工程とを備える。積層体121を加熱しつつ加圧する工程は、複数枚の樹脂シート21を、樹脂シート21が軟化することのない第1温度まで加熱する工程と、第1温度まで加熱する工程の後、複数枚の樹脂シート21を、第1温度よりも高い第2温度まで加熱しつつ加圧する工程とを含む。【選択図】図7
摘要翻译：要解决的问题：提供一种能够获得具有优异的尺寸稳定性和形状精度的多层布线板的多层布线板的制造方法。解决方案：一种制造多层布线板的方法包括以下步骤：形成导体图案37 在热塑性树脂片21的表面21a上; 并且在层叠方向上层叠多个树脂片21而形成的层叠体121加热的同时进行加压。加热层叠体21的步骤还包括以下步骤：将多个树脂片21加热到树脂片21不软化的第一温度; 并且在将树脂片21加热到第一温度的步骤之后，将多个树脂片21加热至高于第一温度的第二温度。

2. 发明专利

JP2011066122A a circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2011066122A
公开(公告)日：2011-03-31
申请号：JP2009214381
申请日：2009-09-16
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE , HATASE MINORU
IPC分类号： H05K3/34 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To securely prevent peeling and damages such as cracking of a terminal electrode layer provided to a support substrate. SOLUTION: The peripheral part 31 of the terminal electrode layer 3 provided to one principal surface of the support substrate 9 is continuously covered with a resist layer 2 except a part thereof to reinforce bonding between the terminal electrode layer 3 and support substrate 9, thereby preventing peeling of the terminal electrode layer 3 from the support substrate 9. Further, when coefficients of thermal expansion of the support substrate 9, terminal electrode layer 3 and resist layer 2 are greatly different from one another, for example, even when the support substrate 9, terminal electrode layer 3 and resist layer 2 are heated and expanded, and stress is produced, during a reflow treatment, since the produced stress is released through the part of the terminal electrode layer peripheral part 31, which is not covered with the resist layer 2, the terminal electrode layer 3 is prevented from peeling from the support substrate 9 or cracking. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：可靠地防止设置在支撑基板上的端子电极层的剥离和破损等破损。
解决方案：设置在支撑基板9的一个主表面上的端子电极层3的周边部分31被除了其一部分之外的抗蚀剂层2连续地覆盖以加强端电极层3和支撑基板9之间的接合从而防止端子电极层3从支撑基板9剥离。此外，当支撑基板9，端子电极层3和抗蚀剂层2的热膨胀系数彼此大不相同时，即使当支撑基板9，端子电极层3和抗蚀剂层2被加热膨胀，并且在回流处理期间产生应力，因为产生的应力通过未被覆盖的端子电极层周边部分31的部分释放抗蚀剂层2，端子电极层3被防止从支撑基板9剥离或开裂。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2014116415A Method of manufacturing resin multilayer substrate 审中-公开
标题翻译：树脂多层基板的制造方法
公开(公告)号：JP2014116415A
公开(公告)日：2014-06-26
申请号：JP2012268526
申请日：2012-12-07
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin multilayer substrate normally with no problem of the heat resistance of a release material.SOLUTION: A method of manufacturing a resin multilayer substrate includes a step for preparing such a state that a laminate of a plurality of thermoplastic resin sheets is arranged between two pressure members 31, 32 of a press device including the two pressure members 31, 32 for pressing an object while sandwiching, and a step for hot pressing the laminate by pressing it while heating by the press device. The arrangement step includes a step for interposing metal foils 21a, 21b, having a coating 22 mainly composed of silica, between the pressure members 31, 32 and the laminate so that the coating 22 is in contact with the laminate, in at least one of two contact surfaces of the pressure members 31, 32 and the laminate.
摘要翻译：要解决的问题：提供通常没有剥离材料的耐热性问题的树脂多层基板的制造方法。解决方案：制造树脂多层基板的方法包括制备这样的状态的步骤：多个热塑性树脂片被布置在包括用于夹持物体的两个压力构件31,32的压制装置的两个压力构件31,32之间，以及在通过压力加热的同时通过压制层压体进行热压的步骤设备。布置步骤包括在压力构件31,32和层叠体之间插入具有主要由二氧化硅构成的涂层22的金属箔21a，21b，使得涂层22与层压体接触的步骤，至少一个压力构件31,32的两个接触表面和层压体。

4. 发明专利

JP2012182293A Electronic component mounting substrate and method for manufacturing the same 有权
标题翻译：电子元件安装基板及其制造方法
公开(公告)号：JP2012182293A
公开(公告)日：2012-09-20
申请号：JP2011043974
申请日：2011-03-01
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE , NAKANO KIMISUKE
IPC分类号： H05K3/34 , H05K1/11 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate that eliminates the need for a special member such as underfill material and prevents formation of cracks in a junction between an electronic component and a wiring substrate due to external impact or heat stress.SOLUTION: An electronic component mounting substrate includes at least one printed substrate that has: an insulating substrate that includes resin; and a conductor wiring layer formed on at least one surface of the insulating substrate. The electronic component mounting substrate has: a wiring substrate that has a plurality of land electrodes on a surface thereof; and an electronic component that has a plurality of terminal electrodes on a surface thereof. The land electrodes and the terminal electrodes are electrically connected through a bonding member. The bonding member includes an intermetallic compound with a melting point of 300°C or more that is formed by a reaction of a first metal including Sn and a second metal with a higher melting point than that of the first metal. A difference between lattice constants of the second metal and the intermetallic compound that is initially formed on a surface of the second metal is 50% or more of the lattice constant of the second metal. The bonding member has a plurality of air voids therein.
摘要翻译：要解决的问题：提供一种电子部件安装基板，其不需要诸如底部填充材料的特殊部件，并且防止由于外部冲击或热应力而在电子部件和布线基板之间的接合处形成裂纹。解决方案：电子部件安装基板包括至少一个印刷基板，该印刷基板具有包括树脂的绝缘基板; 以及形成在绝缘基板的至少一个表面上的导体布线层。电子部件安装基板具有：在其表面上具有多个焊盘电极的布线基板; 以及在其表面上具有多个端子电极的电子部件。接地电极和端子电极通过接合构件电连接。接合部件包括由包含Sn的第一金属和比第一金属的熔点高的第二金属的反应形成的熔点为300℃以上的金属间化合物。最初形成在第二金属的表面上的第二金属和金属间化合物的晶格常数之间的差异为第二金属的晶格常数的50％以上。接合部件中具有多个空气空隙。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012079920A Manufacturing method of multilayer wiring board 审中-公开
标题翻译：多层布线板的制造方法
公开(公告)号：JP2012079920A
公开(公告)日：2012-04-19
申请号：JP2010223693
申请日：2010-10-01
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board in which a plurality of wiring layers are disposed highly accurately.SOLUTION: A manufacturing method of a multilayer wiring board comprises: a step of preparing a plurality of thermoplastic resin sheets 21 and forming a conductor pattern 31 which serves as a wiring layer in a central region on a surface 21a of each resin sheet 21; a step of forming a metal film 46 in a peripheral region on the surface 21a of the resin sheet 21 and forming a plurality of positioning holes 47 to be opened in the metal film 46; a step of laminating a plurality of resin sheets 21 while inserting a positioning pin 52 into the positioning holes 47; and a step of pressurizing the plurality of the resin sheets 21 in a lamination direction while heating them after performing the step of laminating the resin sheets 21.
摘要翻译：要解决的问题：提供一种其中多个布线层被高精度地布置的多层布线板的制造方法。解决方案：多层布线板的制造方法包括：制备多个热塑性树脂片21并在每个树脂片的表面21a上的中心区域形成用作布线层的导体图案31的步骤 21; 在树脂片21的表面21a的周边区域形成金属膜46的步骤，形成在金属膜46中打开的多个定位孔47; 在将定位销52插入定位孔47的同时层叠多个树脂片21的步骤; 以及在执行层压树脂片21的步骤之后对层叠方向加压多个树脂片21的步骤。（C）2012，JPO＆INPIT

6. 发明专利

JP2012070243A Method for manufacturing multilayered antenna 有权
标题翻译：制造多层天线的方法
公开(公告)号：JP2012070243A
公开(公告)日：2012-04-05
申请号：JP2010213677
申请日：2010-09-24
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H01Q1/40 , H01Q1/38
摘要： PROBLEM TO BE SOLVED: To provide a multilayered antenna which can obtain excellent antenna characteristics, and suppresses the occurrence of delamination.SOLUTION: A method for manufacturing the multilayered antenna includes the steps of: forming a coil electrode 21p and a coil electrode 21q which linearly extend on surfaces 31a, respectively on a resin sheet 31p and a resin sheet 31q which have the surfaces 31a and rear faces 31b arranged at the rear side thereof, and are formed from a thermoplastic resin; forming a slit 46 which extends at a position corresponding to the coil electrode 21q on a buffer sheet 41 formed from the thermoplastic resin; laminating the resin sheet 31p and the resin sheet 31q so that the surface 31a faces the rear face 31b, and inserting the buffer sheet 41 between the resin sheet 31p and the resin sheet 31q so that the coil electrode 21q overlaps the slit 46 in the lamination direction; and pressurizing the resin sheet 31p and the resin sheet 31q in the lamination direction while heating the resin sheets 31p and 31q.
摘要翻译：要解决的问题：提供可以获得优异的天线特性并抑制分层的发生的多层天线。解决方案：制造多层天线的方法包括以下步骤：在树脂片31p和具有表面31a的树脂片31q上分别形成线圈电极21p和线圈电极21q，线圈电极21p和线圈电极21q在表面31a上分别直线延伸并且其背面布置的后表面31b由热塑性树脂形成; 形成狭缝46，该狭缝46在由热塑性树脂形成的缓冲片41上的与线圈电极21q对应的位置处延伸; 层叠树脂片31p和树脂片31q使得表面31a面向后表面31b，并且将缓冲片41插入树脂片31p和树脂片31q之间，使得线圈电极21q在层叠中与狭缝46重叠方向; 并且在加热树脂片31p和31q的同时在层叠方向上加压树脂片31p和树脂片31q。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011108929A Circuit board and method of manufacturing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：JP2011108929A
公开(公告)日：2011-06-02
申请号：JP2009263926
申请日：2009-11-19
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board improved in stiffness in a rigid section, and to provide a method of manufacturing the circuit board.
SOLUTION: The circuit board includes: a deformable flexible section 130; the rigid section 110 including an insulation base material 111 and an electric circuit 120 formed in the insulation base material 111 and connected to the flexible section 130; and a reinforcement member 140 formed at the periphery of the insulation base material 111, applies internal stress to the insulation base material 111, and formed of an insulating resin having stiffness higher than that of the insulation base material 111.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供在刚性部分中提高刚度的电路板，并提供制造电路板的方法。电路板包括：可变形的柔性部分130; 刚性部分110包括绝缘基材111和形成在绝缘基材111中并连接到柔性部分130的电路120; 以及形成在绝缘基材111的周围的加强构件140，对绝缘基材111施加内应力，并且由刚性高于绝缘基材111的刚性的绝缘树脂形成。版权所有（ C）2011，JPO＆INPIT

8. 发明专利

JP2011108922A Circuit board 审中-公开
标题翻译：电路板
公开(公告)号：JP2011108922A
公开(公告)日：2011-06-02
申请号：JP2009263839
申请日：2009-11-19
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H05K1/02 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board improved in stiffness in a rigid section while maintaining electrical characteristics of an electric circuit provided on a wiring board. SOLUTION: A circuit board includes: a deformable flexible section 130; the rigid section 110 including an insulation base material 111 and an electric circuit formed in the insulation base material 111 and connected to the flexible section 130; and a reinforcement section 141 formed in the insulation base material 111, extended in a thickness direction of the insulation base material 111, having stiffness higher than that of the insulation base material 111, and independent of the electric circuit electrically. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在刚性部分中提高刚度的布线板，同时保持设置在布线板上的电路的电特性。电路板包括：可变形的柔性部分130; 刚性部分110包括绝缘基材111和形成在绝缘基材111中并连接到柔性部分130的电路; 以及形成在绝缘基材111上的加强部141，其在绝缘基材111的厚度方向上延伸，刚性高于绝缘基材111的刚度，并且与电路无关。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2010212345A Multilayer wiring board and method of manufacturing the same 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2010212345A
公开(公告)日：2010-09-24
申请号：JP2009054880
申请日：2009-03-09
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable multilayer wiring board for which a conductor layer is reliably interlayer-connected through a conductor for interlayer connection formed using conductive paste, and which is superior in connection stability in the stage of a product as well, and to provide a method of manufacturing the same. SOLUTION: The conductor layer 2 includes a first conductor layer 21 and a second conductor layer 22 covering the prescribed region of the first conductor and comprising a second metal which is more noble and highly corrosion resistant than the first conductor layer, and the conductor layer and a via hole conductor 4 are brought into contact with each other and electrically conducted. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2012195423A Manufacturing method of multilayer wiring board and multilayered antenna 审中-公开
标题翻译：多层接线板和多层天线的制造方法
公开(公告)号：JP2012195423A
公开(公告)日：2012-10-11
申请号：JP2011057924
申请日：2011-03-16
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： CHISAKA SHUNSUKE , KATO MOTORO
IPC分类号： H05K3/46 , H01Q1/40 , H01Q7/00 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board capable of suppressing occurrence of a delamination, and to provide a multilayered antenna capable of preventing performance deterioration caused by floating capacitance occurrence.SOLUTION: A manufacturing method of a multilayered antenna as a multilayer wiring board includes: a step of forming a conductor pattern 36 extending in an annular shape on a resin sheet 21; a step of forming a laminate 120 by laminating a plurality of resin sheets 21 and disposing the laminate 120 between a convex press plate 61 and a flat press plate 62; and a step of pressurizing the resin sheet 21 in its lamination direction while heating the resin sheet 21. The convex press plate 61 has a press surface 61a on which a salient 63 protruding to the flat press plate 62 is formed. The step of disposing the laminate 120 between the convex press plate 61 and the flat press plate 62 includes a step of positioning the laminate 120 so that the salient 63 overlaps a region 33 inside the conductor pattern 36 when viewed from the lamination direction of the resin sheet 21.
摘要翻译：解决的问题：提供能够抑制分层发生的多层布线板的制造方法，并且提供能够防止由浮动电容发生引起的性能劣化的多层天线。解决方案：作为多层布线基板的多层天线的制造方法包括：形成在树脂片21上呈环状延伸的导体图案36的工序; 通过层压多个树脂片21并将层压体120设置在凸形压板61和平板压板62之间来形成层压体120的步骤; 以及在加热树脂片21的同时对树脂片21进行加压的步骤。凸压板61具有压制表面61a，其上形成有突出到平压板62的突出部63。将叠层120设置在凸压板61和平压板62之间的步骤包括将叠层120定位的步骤，使得当从树脂的层叠方向观察时，突出部63与导体图案36内的区域33重叠（C）2013，JPO＆INPIT

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