专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2010084168A Wet process method, electroless copper plating method, and printed circuit board 有权
标题翻译：湿法处理方法，电镀铜法和印刷电路板
公开(公告)号：JP2010084168A
公开(公告)日：2010-04-15
申请号：JP2008252161
申请日：2008-09-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANEMOTO MASARU , KAWAMURA TOSHINORI , AKABOSHI HARUO , IIDA TADASHI , MIYAZAKI SATOYUKI , YODA KENTARO
IPC分类号： C23C18/31 , H05K3/42
摘要： PROBLEM TO BE SOLVED: To provide a wet process method capable of ensuring the sufficient flow velocity difference of plating liquid on both sides of a substrate, and sufficiently and consistently feeding plating liquid even in a through hole of small diameter and high aspect ratio.
SOLUTION: In the wet process method for executing the wet process of a substrate having a through hole using a tool, the tool 3 is a cylindrical flat plate with upper and lower surfaces thereof being opened, and side surfaces thereof being surrounded by a flat plate 6, and has a substrate holding part 7 in which a plurality of substrates 4 are arranged at the predetermined intervals and held in the cylindrical flat plate, liquid flow generating units arranged on lower ends between the substrates, and bulkheads 5a, 5b which are arranged on an upper part of the substrate between the predetermined substrates and an outer circumferential surface of the cylindrical flat plate. The tool 3 holding the substrates 4 is installed in a treatment tank 1 storing treatment liquid 2. The treatment liquid is passed through the through hole in the vertical direction by driving the liquid flow generating units arranged in rows of even number or odd number. The treatment liquid 2 ejected from upper parts of the substrates 4 is allowed to flow out to an outer periphery of the tool by avoiding the space between the adjacent substrates by using the bulkheads 5a, 5b for performing the wet process.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种湿法处理方法，其能够确保基板两侧的电镀液的充分的流速差，并且即使在小直径和高方向的通孔中也能充分且一致地供给电镀液比。解决方案：在用于使用工具执行具有通孔的基板的湿法处理的湿式方法中，工具3是其上表面和下表面打开的圆柱形平板，其侧表面被平板6，并且具有基板保持部7，其中多个基板4以预定间隔布置并保持在圆柱形平板中，液体流产生单元布置在基板之间的下端，隔板5a，5b 其布置在预定基板之间的基板的上部和圆柱形平板的外周面之间。保持基板4的工具3安装在储存处理液2的处理槽1中。通过驱动排列成偶数或奇数行的液体流产生单元，处理液体沿垂直方向通过通孔。通过使用用于进行湿法处理的隔壁5a，5b避开相邻基板之间的空间，允许从基板4的上部排出的处理液体2流出到工具的外周。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2015010749A 伝熱装置审中-公开
标题翻译：传热装置
公开(公告)号：JP2015010749A
公开(公告)日：2015-01-19
申请号：JP2013135740
申请日：2013-06-28
申请人：株式会社日立製作所 , Hitachi Ltd
发明人： TAMURA AKINORI , KAWAMURA TOSHINORI , KITO KAZUAKI , NAKANO HIROSHI
IPC分类号： F28F13/12 , F28D7/16 , F28F1/12
CPC分类号： F28D7/16 , F28F13/06 , F28F13/12 , F28F13/185 , F28F13/187
摘要：【課題】本発明の課題は、低流速時においても微細多孔質層による伝熱促進効果を十分に得ることにある。【解決手段】本発明は、前記低温流体と接する伝熱管表面に、微細多孔質層と複数の伝熱促進構造を備え、流れの代表長さDに対し、前記伝熱促進構造の高さHが0.05≧H/D≧0.01であり、かつ、前記伝熱促進構造の流れ方向への設置間隔Lが40
摘要翻译：要解决的问题：以低流速充分提供微细多孔层的传热促进效果。解决方案：该传热装置包括在传热表面上的细多孔层和多个传热促进结构与低温流体接触的管道。传热促进结构的高度H相对于流动代表长度D满足0.05≥H/D≥0.01，传热促进结构向流动方向的安装间隔L满足40

3. 发明专利

JP2012126967A Electroless plating apparatus and electroless plating method 有权
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2012126967A
公开(公告)日：2012-07-05
申请号：JP2010280396
申请日：2010-12-16
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANEMOTO MASARU , KAWAMURA TOSHINORI , AKABOSHI HARUO , MIYAZAKI SATOYUKI
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus and an electroless plating method, simply controllable of the composition of the plating liquid.SOLUTION: The electroless metal plating apparatus 1 includes a plating tank 2, metal melting tanks 30, 31 for replenishing metal ions in the plating liquid extracted from the plating tank 2, and an aeration tank 4 for generating aerated liquid by reducing the concentration of dissolved oxygen contained in the liquid supplied from the metal melting tanks 30, 31. The apparatus further includes a plating liquid conveying unit for conveying the plating liquid extracted from the plating tank 2 to the metal melting tanks 30, 31, a highly concentrated plating liquid conveying unit for conveying the highly concentrated plating liquid to the aeration tank 4 from the metal melting tanks 30, 31, an aerated liquid conveying unit for conveying the aerated liquid from the aeration tank 4 to the plating tank 2, and oxygen-enriched gas supply units 60, 61 for dissolving oxygen in the plating liquid. The metal melting tanks 30, 31 are capable of disposing and taking out metals included in the tanks, and adjusting the amount of dissolution of ions. The oxygen-enriched gas supply units 60, 61 are added to the metal melting tanks 30, 31, or the plating liquid conveying unit.
摘要翻译：要解决的问题：为了提供化学镀设备和化学镀方法，简单地控制电镀液的组成。解决方案：化学镀金属设备1包括镀槽2，用于补充从镀槽2中提取的电镀液中的金属离子的金属熔池30,31，以及用于通过减少镀液而产生充气液体的曝气池4 从金属熔化槽30,31供给的液体中所含的溶解氧的浓度。该设备还包括一个电镀液输送单元，用于将从镀槽2中提取的电镀液体输送到金属熔化槽30,31，电镀液输送单元，用于将高浓缩电镀液体从金属熔池30,31输送到曝气池4，用于将充气液体从曝气池4输送到镀槽2的充气液体输送单元和富氧用于将氧溶解在电镀液中的气体供给单元60,61。金属熔化罐30,31能够处理和取出包含在罐中的金属，并调节离子的溶解量。富氧气体供给单元60,61被添加到金属熔池30,31或电镀液输送单元。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2013216932A Electroless metal plating equipment 有权
标题翻译：电镀金属镀膜设备
公开(公告)号：JP2013216932A
公开(公告)日：2013-10-24
申请号：JP2012086994
申请日：2012-04-06
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KANEMOTO MASARU , KAWAMURA TOSHINORI , AKABOSHI HARUO , MIYAZAKI SATOYUKI
IPC分类号： C23C18/31 , C23C18/16 , C23C18/36 , C23C18/40
摘要： PROBLEM TO BE SOLVED: To provide an electroless metal plating apparatus which can extend the life of an electroless plating solution and also stably perform continuous plating.SOLUTION: An electroless metal plating apparatus includes: a plating tank for immersing a substrate to be plated into a plating solution and plating the substrate with a metal; a metal dissolution tank in which the metal is dissolved with the plating solution extracted from the plating tank for replenishing ions of the metal thereto; an oxygen-enriched gas feeding unit for feeding an oxygen-enriched gas to the plating solution fed to the metal dissolution tank; an aeration tank for lowering the concentration of dissolved oxygen contained in the plating solution fed from the metal dissolution tank to produce an aeration fluid; and an aeration fluid conveying unit for transferring the aeration fluid to the plating tank from the aeration tank. The aeration tank includes a micro-air feeding unit for feeding air with a fine bubble diameter to the plating solution within the aeration tank.
摘要翻译：要解决的问题：提供一种能够延长化学镀溶液的寿命并且还可以稳定地进行连续电镀的化学镀金属设备。解决方案：一种无电金属电镀设备，包括：用于将要镀覆的基板浸入电镀液并用金属电镀基板; 金属溶解槽，其中从电镀槽中提取的镀液溶解金属，以补充金属的离子; 富氧气体供给单元，其向供给到所述金属溶解槽的所述电镀液供给富氧气体; 曝气池，用于降低从所述金属溶解槽供给的镀液中所含的溶解氧的浓度，以产生曝气液; 以及用于将曝气流体从曝气池传送到镀槽的曝气流体输送单元。曝气池包括用于向曝气池内的镀液供给具有细小气泡直径的空气的微空气供给单元。

5. 发明专利

JP2000214113A MEASURING METHOD FOR INSIDE TEMPERATURE OF SUBSTANCE IN CHEMICAL REACTION 失效
公开(公告)号：JP2000214113A
公开(公告)日：2000-08-04
申请号：JP1525499
申请日：1999-01-25
申请人： HITACHI LTD , HITACHI VIA MECHANICS LTD
发明人： INANAMI YOSHIHITO , KAWAMURA TOSHINORI , AKABOSHI HARUO , ARAI KUNIO
IPC分类号： G01N23/225 , G01N25/02 , G01N31/00
摘要： PROBLEM TO BE SOLVED: To obtain a measuring method in which a temperature distribution inside a reaction substance can be measured with high resolution without introducing a material for a temperature measurement by a method wherein a halogen distribution amount before the temperature rise of a substance containing halogen atoms is compared with a halogen distribution amount after the temperature rise. SOLUTION: The reaction rate of the dissociation reaction of the bond of halogen atoms to other atoms and, in many cases, that of the dissociation reaction of the bond of halogen atoms to carbon atoms are measured. The temperature is estimated from the relation between the reaction time and the temperature on the basis of the theory of the reaction rate. When the temperature is estimated on the basis of the theory of the reaction rate, the temperature is estimated comparatively easily when the reaction rate of the dissociation reaction of the bond of the halogen atoms to the other atoms is in the range of 10 to 90%. When, even outside the range, the reaction rate of the dissociation reaction of a bond containing halogens and that of the dissociation reaction of another bond are measured, the temperature can be estimated. For example, the dissociation reaction of a C-Br bond progresses nearly 100%, but a C-C bond is in a state that it is hardly cut. Then, the C-Br bond is dissociated 100%, and the minimum value of the estimated temperature can be calculated.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式