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1. 发明专利

JP2010183794A Rotary electric machine device and method for manufacturing the same 有权
标题翻译：旋转电机装置及其制造方法
公开(公告)号：JP2010183794A
公开(公告)日：2010-08-19
申请号：JP2009027212
申请日：2009-02-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： TAZAWA CHIKAAKI , HONDA KENJI , MASUDA ATSUSHI , FUKUI KENTARO , FUJII RYO , TOMOKAGE RYOJI , OTSUKA HIROSHI
IPC分类号： H02K5/22 , H02K11/00 , H02K15/02
摘要： PROBLEM TO BE SOLVED: To achieve electrical connection while securing a sufficient insulating distance. SOLUTION: A terminal block 106 includes: control-unit side connections 120 mounted on one end side along the axial direction and electrically connected to PCUs 112 respectively; and a rotary electric machine side connections 122 mounted on the other side along the axial direction and electrically connected to a generator 22 and a motor 24, respectively. The control-unit side connections 120 include: A1 to A3 terminals 128a to 128c connecting to three-phase lines 114a for generator and being disposed on the outside in the radial direction of a casing 102; and B1 to B3 terminals 130a to 130c connecting to the three-phase lines 114b for motor and being adjacently disposed on the inside in the radial direction of the casing 102. The A1 to A3 terminals 128a to 128c and the B1 to B3 terminals 130a to 130c are disposed to be relatively displaced in the direction of a rotating shaft. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在确保足够的绝缘距离的同时实现电气连接。端子排106包括：控制单元侧连接件120，其分别安装在沿轴向的一端侧并电连接到PCU 112; 以及沿轴向安装在另一侧的旋转电机侧连接件122，并分别电连接到发电机22和电动机24。控制单元侧连接120包括：连接到用于发电机的三相线路114a并且设置在壳体102的径向外侧的A1至A3端子128a至128c; 以及连接到电动机的三相线路114b并且相对地设置在壳体102的径向内侧的B1至B3端子130a至130c。A1至A3端子128a至128c以及B1至B3端子130a至 130c被设置成在旋转轴的方向上相对移位。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2008042089A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2008042089A
公开(公告)日：2008-02-21
申请号：JP2006217279
申请日：2006-08-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： TAKANO FUMITOMO , WATANABE SHINYA , AIBA TSUKASA , NAKAJIMA JOJI , OTSUKA HIROSHI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/13055 , H01L2924/30107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can attain miniaturization and compaction of a semiconductor module structure mounting a plurality of semiconductor chips in one package, while reducing the inductance of the main circuit and enhancing noise resistance of a drive signal. SOLUTION: The semiconductor device includes a first assembly 12A, a second assembly 12B, and an output bus bar 24. The first assembly has a first semiconductor chip, a high voltage bus bar 21 being bonded to one side of the first semiconductor chip and having a high voltage terminal, and a first metal wiring board 25 being bonded to the other side of the first semiconductor chip. The second assembly has a second semiconductor chip, a low voltage bus bar 23 being bonded to one side of the second semiconductor chip and having a low voltage terminal, and a second metal wiring board 26 being bonded to the other side of the second semiconductor chip. The first and second assemblies are arranged while spaced apart from each other in stack structure. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种半导体器件，其能够实现在一个封装中安装多个半导体芯片的半导体模块结构的小型化和压实，同时降低主电路的电感并提高驱动信号的抗噪声性。解决方案：半导体器件包括第一组件12A，第二组件12B和输出母线24.第一组件具有第一半导体芯片，高压母线21接合到第一半导体的一侧并且具有高电压端子，并且第一金属布线板25接合到第一半导体芯片的另一侧。第二组件具有第二半导体芯片，低压汇流条23接合到第二半导体芯片的一侧并具有低电压端子，第二金属布线板26接合到第二半导体芯片的另一侧。第一和第二组件以堆叠结构彼此间隔开地布置。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2012105370A Power control unit 有权
标题翻译：电源控制单元
公开(公告)号：JP2012105370A
公开(公告)日：2012-05-31
申请号：JP2010248944
申请日：2010-11-05
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： NISHIYAMA YUKIHIRO , FUKATSU TOMOHIRO , OTSUKA HIROSHI , ISOYA SHIGEJI
IPC分类号： H02M3/155 , H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a power control unit which suppresses deformation of a plate member even when bolts are fastened in a power module while reducing the thickness of the plate member of a heat sink.SOLUTION: A power control unit comprises: a housing 14 in which a flow channel groove 16 is formed at an upper surface; a plate member 15 covering the upper surface of the housing 14 and composing a heat sink; a water jacket 10 forming a cooling channel 20; and a power module 60 provided at an upper surface of the plate member 15 and incorporating multiple transistors which form at least an inverter circuit. The flow channel groove 16 is formed on the upper surface of the housing 14, and a guide rib 24, which contacts with a lower surface of the plate member 15, is provided. Bolt fastening parts 55b provided at the power module 60 are positioned above the guide rib 24 of the housing.
摘要翻译：要解决的问题：提供一种功率控制单元，即使在将功率模块中的螺栓紧固在同时减小散热片的板构件的厚度的同时也能够抑制板构件的变形。解决方案：电源控制单元包括：壳体14，其中在上表面上形成有流动通道槽16; 覆盖壳体14的上表面并构成散热器的板构件15; 形成冷却通道20的水套10; 以及设置在板构件15的上表面并且并入至少形成有逆变器电路的多个晶体管的功率模块60。流路槽16形成在壳体14的上表面，并且设置有与板构件15的下表面接触的引导肋24。设置在功率模块60处的螺栓紧固部件55b位于壳体的引导肋24的上方。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2008086099A Inverter device 审中-公开
标题翻译：逆变器装置
公开(公告)号：JP2008086099A
公开(公告)日：2008-04-10
申请号：JP2006261821
申请日：2006-09-27
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： OTSUKA HIROSHI , SAITO KAZUHIRO
IPC分类号： H02M7/00
CPC分类号： H05K7/20927 , H01L23/3735 , H01L23/4334 , H01L23/467 , H01L23/473 , H01L23/49531 , H01L23/49562 , H01L23/49575 , H01L2224/36 , H01L2224/40 , H01L2224/40137 , H01L2224/40139 , H01L2224/48137 , H01L2224/48139 , H01L2224/48247 , H01L2224/49 , H01L2224/49111 , H01L2224/49175 , H01L2224/73265 , H01L2224/83205 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/13055 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/37099 , H01L2224/37599
摘要： PROBLEM TO BE SOLVED: To equalize the heat balance of the entire inverter circuit by cooling an IGBT element more than IGBT elements on the first stage and the final stage of a triple bridge inverter circuit. SOLUTION: In an inverter device which has a triple bridge inverter circuit where a series circuit is composed of a plurality of switching elements arranged in three stages and three series circuits are connected in parallel, the switching element on the second stage is arranged upstream of a cooling path which is supplied with a refrigerant for cooling the triple inverter circuit, and the switching elements on the first stage and the third stage are arranged downstream of the above cooling path. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：通过将IGBT元件冷却多于三桥逆变器电路的第一级和最后级的IGBT元件来均衡整个逆变器电路的热平衡。解决方案：在具有三桥逆变器电路的逆变器装置中，串联电路由分三级布置的多个开关元件和三个串联电路并联连接，第二级上的开关元件布置提供有用于冷却三重反相器电路的制冷剂的冷却路径的上游，第一级和第三级的开关元件设置在上述冷却路径的下游。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008085052A Heating element cooling device 有权
标题翻译：加热元件冷却装置
公开(公告)号：JP2008085052A
公开(公告)日：2008-04-10
申请号：JP2006262876
申请日：2006-09-27
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： OTSUKA HIROSHI
IPC分类号： H01L23/427 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a technique which can electrically insulate a space between a cooling bath storing insulating refrigerant liquid and a heat sink joined to a heating element without fail by a simple constitution, and raise cooling performance in cooling the heating element by the insulating refrigerant liquid.
SOLUTION: A heating element cooling device 11 has a metallic cooling bath 16 for storing insulating refrigerant liquid 17. The cooling bath 16 has a through hole 63 in a fixing surface 62 for fixing the heating element 21. The heating element 21 is joined to one surface 23 in the metallic heat sink 24. The other surface 28 is larger than the through hole 63, and it is a heat dissipation surface in contact with the insulating refrigerant liquid 17 inside the cooling bath 16 through the through hole 63 when applied to the through hole 63. Only a portion of a heat dissipation surface 28 facing the through hole 63 is exposed and the remaining portion is coated with a coating member 27 with electrical insulation property. The heat dissipation surface 28 is fixed to the fixing surface 62 via the coating member 27 in a position of the through hole 63.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够通过简单的结构将存储绝缘制冷剂液体的冷却浴与连接到加热元件的散热器之间的空间电绝缘的技术，并且提高冷却加热时的冷却性能元件通过绝缘制冷剂液体。解决方案：加热元件冷却装置11具有用于存储绝缘制冷剂液体17的金属冷却槽16.冷却槽16在用于固定加热元件21的固定面62中具有通孔63.加热元件21是连接到金属散热器24中的一个表面23.另一个表面28大于通孔63，并且它是通过通孔63与冷却槽16内的绝缘制冷剂液体17接触的散热表面，施加到通孔63的情况下，仅露出面向通孔63的散热面28的一部分，其余部分涂覆有具有电绝缘性的涂布部件27。散热面28经由涂覆部件27在通孔63的位置固定在固定面62上。（C）2008，JPO＆INPIT

6. 发明专利

JP2008042086A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2008042086A
公开(公告)日：2008-02-21
申请号：JP2006217246
申请日：2006-08-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： TAKANO FUMITOMO , WATANABE SHINYA , AIBA TSUKASA , NAKAJIMA JOJI , OTSUKA HIROSHI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can attain miniaturization and compaction of a semiconductor module structure while reducing the inductance of the main circuit, and enhancing noise resistance of a drive signal. SOLUTION: The semiconductor device includes first and second assemblies 12A and 12B. The first assembly has a first semiconductor chip, a high voltage bus bar 21 being bonded to one side of the first semiconductor chip, a first metal wiring board 24-1 being connected to the other side of the first semiconductor chip by a bonding wire, and a third metal wiring board 24-3 being coupled with the first metal wiring board. The second assembly has a second semiconductor chip, a low voltage bus bar 23 being connected to one side of the second semiconductor chip by a bonding wire, a second metal wiring board 24-2 being bonded to the other side of the second semiconductor chip, and a fourth metal wiring board 24-4 being turned up from the end of the second metal wiring board and coupled and arranged in parallel with the second metal wiring board. The first and second assemblies are arranged while spaced apart from each other in stack structure. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体器件，其可以在减小主电路的电感的同时实现半导体模块结构的小型化和压缩，并且提高驱动信号的抗噪声性。解决方案：半导体器件包括第一和第二组件12A和12B。第一组件具有第一半导体芯片，与第一半导体芯片的一侧接合的高电压母线21，通过接合线与第一半导体芯片的另一侧连接的第一金属布线板24-1，以及与第一金属布线板连接的第三金属布线板24-3。第二组件具有第二半导体芯片，低压母线23通过接合线连接到第二半导体芯片的一侧，第二金属布线板24-2接合到第二半导体芯片的另一侧，第四金属布线板24-4从第二金属布线板的端部向上翻开，并与第二金属布线板并联布置。第一和第二组件以堆叠结构彼此间隔开地布置。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2007329427A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2007329427A
公开(公告)日：2007-12-20
申请号：JP2006161616
申请日：2006-06-09
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： TAKANO FUMITOMO , WATANABE SHINYA , AIBA TSUKASA , NAKAJIMA JOJI , OTSUKA HIROSHI
IPC分类号： H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the inductance of a main circuit in a semiconductor module structure, where a plurality of semiconductor chips are mounted in one package. SOLUTION: The semiconductor device comprises: a pair of semiconductor chips that are placed side by side on the same plane; a high-pressure bus bar 21 that is joined onto the surface of a collector side in one semiconductor chip; a low-pressure bus bar 23 joined onto the surface of an emitter side in the other semiconductor chip by a bonding wire 27; a first metal wiring board 24-1 connected onto the surface of the emitter side of one semiconductor chip by a bonding wire 26; a second metal wiring board 24-2 joined onto the surface of the collector side of the other semiconductor chip; a third metal wiring board 24-3 connected to the first metal wiring board; a fourth metal wiring board 24-4 folded back from the edge of the second metal wiring board for connection; and an output bus bar 24 having an output terminal extended from the edges of the third and fourth metal wiring boards. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种减少半导体模块结构中的主电路的电感的半导体器件，其中多个半导体芯片安装在一个封装中。解决方案：半导体器件包括：一对并排放置在同一平面上的半导体芯片; 在一个半导体芯片中接合到集电极侧的表面上的高压汇流条21; 通过接合线27连接到另一半导体芯片的发射极侧的表面上的低压母线23; 通过接合线26连接到一个半导体芯片的发射极侧的表面上的第一金属布线板24-1; 接合到另一半导体芯片的集电极侧的表面上的第二金属布线板24-2; 连接到第一金属布线板的第三金属布线板24-3; 从第二金属布线板的边缘向后折叠的用于连接的第四金属布线板24-4; 以及具有从第三和第四金属布线板的边缘延伸的输出端子的输出母线24。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2004345454A Structure of mounting high-voltage equipment component to vehicle 有权
公开(公告)号：JP2004345454A
公开(公告)日：2004-12-09
申请号：JP2003143415
申请日：2003-05-21
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： MASUI RITSUO , OTSUKA HIROSHI
IPC分类号： B62D25/20 , B60K1/04 , B60K6/28 , B60K6/40 , B60L15/00 , B60K6/04
CPC分类号： B60L11/1877 , B60L1/003 , B60L3/0007 , B60L11/1864 , B60L11/1874 , B60L11/1879 , B60L2240/545 , Y02T10/7005 , Y02T10/7061
摘要： PROBLEM TO BE SOLVED: To provide a structure of mounting a high-voltage equipment to a vehicle component capable of enhancing the attaching/detaching workability of the high-voltage equipment component to/from a vehicle body side, forming a flow passage to pass cooling air to the high-voltage equipment component at low cost, and protecting the high-voltage equipment component even when a vehicle body floor is deformed by some force from a lower side. SOLUTION: A high-voltage equipment component 41 is disposed in a hanging condition in a downwardly recessed accommodation part 20 formed in a vehicle body floor 10, and a heat insulating material 40 to form a flow passage 110 to pass cooling air to the high-voltage equipment component 41 is interposed between the high-voltage equipment component 41 and a bottom part 20E of the recessed accommodation part 20. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2014135457A Cooler for semiconductor module, and semiconductor module 有权
标题翻译：半导体模块冷却器和半导体模块
公开(公告)号：JP2014135457A
公开(公告)日：2014-07-24
申请号：JP2013004081
申请日：2013-01-11
申请人： Honda Motor Co Ltd , 本田技研工業株式会社 , Fuji Electric Co Ltd , 富士電機株式会社
发明人： OTSUKA HIROSHI , FUKATSU TOMOHIRO , NISHIYAMA YUKIHIRO , ICHIMURA TAKESHI , GOHARA HIROMICHI
IPC分类号： H01L23/473 , H05K7/20
CPC分类号： H05K7/20236 , H01L23/473 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve cooling performance of a semiconductor.SOLUTION: A cooler for a semiconductor module includes: a fin 2C-1 of a heat sink which is thermally connected with a semiconductor element and is provided with notches n1-n6 at one or a plurality of arbitrary positions in the longitudinal direction of an end thereof; and ribs r1-r6 with a convex shape which are provided in the bottom face having a cooling passage in a water jacket 2A-3 and matched with the notches at one or a plurality of arbitrary positions. Accordingly, the cooler for a semiconductor module increases thermal transfer efficiency of the semiconductor element by a refrigerant, thereby improving heat dissipation performance.
摘要翻译：要解决的问题：提高半导体的冷却性能。解决方案：一种用于半导体模块的冷却器包括：与半导体元件热连接的散热片的翅片2C-1，并在一个半导体元件上设置有缺口n1-n6 或其端部的纵向方向上的多个任意位置; 以及具有凸形的肋r1-r6，其设置在底面上，在水套2A-3中具有冷却通道，并且与一个或多个任意位置处的凹口配合。因此，半导体模块的冷却器通过制冷剂提高半导体元件的热传递效率，从而提高散热性能。

10. 发明专利

JP2009296708A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2009296708A
公开(公告)日：2009-12-17
申请号：JP2008145008
申请日：2008-06-02
申请人： Honda Motor Co Ltd , 本田技研工業株式会社
发明人： OTSUKA HIROSHI , SAITO OSAMU , AMANO ATSUSHI
IPC分类号： H02M7/48
摘要： PROBLEM TO BE SOLVED: To provide a power conversion apparatus that exhibits sufficient cooling performance by making the power conversion apparatus compact, thereby ensuring a large cooling passage. SOLUTION: In a power conversion apparatus with a cooling device for integrally holding power modules and dissipating heat of the power modules by using a heat sink 41, a plurality of openings 51 are provided in a metal base frame 50, each power module is provided integrally with the heat sink 41, the power module is arranged in the opening 51 of the base frame 50 while the molded portion M of the power module is exposed to one surface of the base frame 50 and the heat sink 41 is exposed to the other surface of the base frame 50 and then they are integrally fixed by a resin material in the gap C. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过使电力转换装置紧凑地呈现足够的冷却性能的电力转换装置，从而确保大的冷却通道。解决方案：在具有通过使用散热器41一体地保持电源模块和散热功率模块的冷却装置的电力转换装置中，在金属基架50中设置有多个开口51，每个电源模块与散热器41一体设置，功率模块布置在基架50的开口51中，而功率模块的模制部分M暴露于基架50的一个表面并且散热器41暴露于底座框架50的另一个表面，然后它们通过树脂材料一体地固定在间隙C中。版权所有（C）2010，JPO＆INPIT

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