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    • 2. 发明专利
    • Electrical component
    • 电气元件
    • JP2014127558A
    • 2014-07-07
    • JP2012282337
    • 2012-12-26
    • Honda Motor Co Ltd本田技研工業株式会社
    • HAMADA KENJITSURUMI TAKASHIYAMAMOTO KAZUHISASAITO KANAKO
    • H05K7/20B60R16/02H05K5/00
    • PROBLEM TO BE SOLVED: To provide an electrical component having a simple mounting structure in which heat dissipation is enhanced.SOLUTION: An electrical component (1) comprises: a substrate 3 on which an electronic component 4 is mounted; and a resin block 5 composed of resin for sealing the electronic component 4 and substrate 3, and is mounted on a mounting surface (2) by a fastening member (6). The substrate 3 has a high heat conduction layer (11) composed of a material having a heat conductivity higher than that of the resin. A pipe 8 composed of a material having a heat conductivity higher than that of the resin, and having outer peripheral surface in contact with the high heat conduction layer (11) is held in a mode of penetrating the pipe 8. The pipe 8 comes into contact with the mounting surface (2), while being mounted on the mounting surface (2) by the fastening member (6) inserted into the pipe 8.
    • 要解决的问题:提供具有简单的散热增强的安装结构的电气部件。解决方案:电气部件(1)包括:安装有电子部件4的基板3; 以及由用于密封电子部件4和基板3的树脂构成的树脂块5,并且通过紧固部件(6)安装在安装面(2)上。 基板3具有由导热率高于树脂导热率的材料构成的高导热层(11)。 由导热率高于树脂的材料构成并具有与高导热层(11)接触的外周面的材料的管8被保持为穿透管8的模式。管8进入 在通过插入到管8中的紧固构件(6)安装在安装表面(2)上的同时与安装表面(2)接触。